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EP0144943
European procedure
Extract from the Register of European Patents
EP About this file: EP0144943
| EP0144943 - Process using plasma for forming conductive through-holes through a dielectric layer [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.04.1991 Database last updated on 31.08.2024 | Most recent event Tooltip | 07.03.1997 | Lapse of the patent in a contracting state | published on 23.04.1997 [1997/17] | Applicant(s) | For all designated states E. I. du Pont de Nemours and Company 1007 Market Street Wilmington, DE 19898 / US | [N/P] |
| Former [1985/25] | For all designated states E.I. DU PONT DE NEMOURS AND COMPANY 1007 Market Street Wilmington Delaware 19898 / US | Inventor(s) | 01 /
Johnson, Daniel David Box 222 Yorklyn Delaware 19736 / US | [1985/25] | Representative(s) | dompatent von Kreisler Selting Werner - Partnerschaft von Patent- und Rechtsanwälten mbB Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | [N/P] |
| Former [1985/25] | Werner, Hans-Karsten, Dr., et al Patentanwälte Von Kreisler-Selting-Werner Postfach 10 22 41 D-50462 Köln / DE | Application number, filing date | 84114614.5 | 01.12.1984 | [1985/25] | Priority number, date | US19830558309 | 05.12.1983 Original published format: US 558309 | [1985/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0144943 | Date: | 19.06.1985 | Language: | EN | [1985/25] | Type: | A3 Search report | No.: | EP0144943 | Date: | 22.10.1986 | Language: | EN | [1986/43] | Type: | B1 Patent specification | No.: | EP0144943 | Date: | 13.06.1990 | Language: | EN | [1990/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.09.1986 | Classification | IPC: | H05K3/42 | [1985/25] | CPC: |
H05K3/4084 (EP,US);
H05K3/0041 (EP,US);
H05K3/0055 (EP,US);
H05K2201/0394 (EP,US);
H05K2201/0397 (EP,US);
H05K2201/09509 (EP,US);
H05K2203/0554 (EP,US);
H05K2203/1184 (EP,US);
H05K2203/1572 (EP,US);
Y10T29/49167 (EP,US)
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| Designated contracting states | BE, DE, FR, GB, IT, NL [1985/25] | Title | German: | Plasmaverfahren zur Herstellung leitfähiger durchgehender Löcher durch eine dielektrische Schicht | [1985/32] | English: | Process using plasma for forming conductive through-holes through a dielectric layer | [1985/25] | French: | Procédé utilisant un plasma pour former des trous conducteurs à travers une couche diélectrique | [1985/32] | Examination procedure | 27.03.1987 | Examination requested [1987/22] | 16.02.1989 | Despatch of a communication from the examining division (Time limit: M04) | 27.05.1989 | Reply to a communication from the examining division | 15.09.1989 | Despatch of communication of intention to grant (Approval: Yes) | 15.12.1989 | Communication of intention to grant the patent | 06.03.1990 | Fee for grant paid | 06.03.1990 | Fee for publishing/printing paid | Opposition(s) | 14.03.1991 | No opposition filed within time limit [1991/23] | Fees paid | Renewal fee | 19.12.1986 | Renewal fee patent year 03 | 15.12.1987 | Renewal fee patent year 04 | 28.12.1988 | Renewal fee patent year 05 | 22.12.1989 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US3364300 (BRADHAM III ALLEN C); | [AD]US3969815 (HACKE HANS-JURGEN, et al); | [A]US4012307 (PHILLIPS EUGENE); | [A]US4357203 (ZELEZ JOSEPH) | [A] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 20, no. 3, August 1977, page 1024, IBM Corp., New York, US; J.S. LOGAN et al.: "SiO barrier layer for lift-off process" | [A] - XEROX DISCLOSURE JOURNAL, vol. 7, no. 4, July/August 1982, page 221; H.R. THOMAS et al.: "Insulating layers for metal cross-overs from polyparaxylylene" |