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Extract from the Register of European Patents

EP About this file: EP0130719

EP0130719 - A connector and packaging structure for a semiconductor device employing the connector [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.09.1990
Database last updated on 14.09.2024
Most recent event   Tooltip29.09.1990No opposition filed within time limitpublished on 22.11.1990 [1990/47]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo / JP
[N/P]
Former [1985/02]For all designated states
HITACHI, LTD.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 100 / JP
Inventor(s)01 / Minemura, Tetsuro
1-36-4-506 Nishinarusawa-cho
Hitachi-shi Ibaraki-ken / JP
02 / Ando, Hisashi
5-16-5 Kanesawa-cho
Hitachi-shi Ibaraki-ken / JP
03 / Kita, Yoshiaki
3337-128 Nakane
Katsuta-shi Ibaraki-ken / JP
04 / Ikuta, Isao
2-26 Mimaya-cho Uchigou
Iwaki-shi Fukushima-ken / JP
[1985/02]
Representative(s)Paget, Hugh Charles Edward, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
[N/P]
Former [1985/02]Paget, Hugh Charles Edward, et al
MEWBURN ELLIS York House 23 Kingsway
London WC2B 6HP / GB
Application number, filing date84304015.514.06.1984
[1985/02]
Priority number, dateJP1983010565215.06.1983         Original published format: JP 10565283
[1985/02]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0130719
Date:09.01.1985
Language:EN
[1985/02]
Type: A3 Search report 
No.:EP0130719
Date:05.02.1986
Language:EN
[1986/06]
Type: B1 Patent specification 
No.:EP0130719
Date:06.12.1989
Language:EN
[1989/49]
Search report(s)(Supplementary) European search report - dispatched on:EP04.12.1985
ClassificationIPC:H01R4/70, H01R23/68
[1986/05]
CPC:
H05K3/326 (EP,US); H01R12/82 (EP,US); H01R12/52 (EP,US);
H01R4/58 (EP,US); H05K2201/0308 (EP,US); H05K2201/0397 (EP,US);
H05K2201/1059 (EP,US); H05K3/306 (EP,US); H05K3/4092 (EP,US) (-)
Former IPC [1985/02]H01R4/70
Designated contracting statesCH,   DE,   FR,   LI,   NL [1989/15]
Former [1985/02]CH,  DE,  FR,  GB,  IT,  LI,  NL,  SE 
TitleGerman:Steckverbinder und Verpackungseinrichtung für eine Halbleitervorrichtung, die diesen Steckverbinder benutzt[1985/02]
English:A connector and packaging structure for a semiconductor device employing the connector[1985/02]
French:Connecteur et structure d'emballage pour un dispositif semi-conducteur utilisant ce connecteur[1985/02]
File destroyed:15.01.2000
MiscellaneousEPB 1989/46: (deleted)
EPB 1989/46: (deleted)
EPB 1989/46: (deleted)
EPB 1985/02: Ein Berichtigungsantrag nach Regel 88(EPÜ)auf Hinzufügung einer zweiten Priorität, 270783 JP135883 ist am 240984 eingegangen
EPB 1985/02: A request for correction under rule 88(EPC)for the purpose of adding a second priority-claim, 270783 JP135883, has been received on 240984
EPB 1985/02: Une requête en correction selon la règle 88(CBE)pour l'ajout d'une deuxième priorité, 270783 JP135883, a été reçue en date du 240984
Examination procedure30.07.1984Examination requested  [1985/02]
29.01.1988Despatch of a communication from the examining division (Time limit: M04)
03.06.1988Reply to a communication from the examining division
20.09.1988Despatch of communication of intention to grant (Approval: Yes)
23.11.1988Communication of intention to grant the patent
15.02.1989Fee for grant paid
15.02.1989Fee for publishing/printing paid
Opposition(s)07.09.1990No opposition filed within time limit [1990/47]
Fees paidRenewal fee
20.06.1986Renewal fee patent year 03
19.06.1987Renewal fee patent year 04
18.06.1988Renewal fee patent year 05
21.06.1989Renewal fee patent year 06
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Documents cited:Search[E]EP0123376  (HITACHI LTD [JP]);
 [X]US3748108  (ROTHWARF F, et al);
 [E]EP0086013  (BBC BROWN BOVERI & CIE [CH]);
 [A]EP0081372  (RAYCHEM CORP [US]);
 [A]US3528173  (GALL ANDREW S);
 [AP]GB2130025  (CONTROL DATA CORP)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.