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EP0202630
European procedure
Extract from the Register of European Patents
EP About this file: EP0202630
| EP0202630 - Semiconductor wafer precision cutting device with integrated compensators to reduce errors caused by temperature changes [Right-click to bookmark this link] | |||
| Former [1986/48] | Precision device having errors attributed to termperature change reduced | ||
| [1992/13] | Status | No opposition filed within time limit Status updated on 28.01.1993 Database last updated on 04.06.2024 | Most recent event Tooltip | 15.08.2008 | Change - representative | published on 17.09.2008 [2008/38] | Applicant(s) | For all designated states DISCO ABRASIVE SYSTEMS, LTD. 14-3 Higashi Kojiya 2-chome Ota-Ku Tokyo 144 / JP | [N/P] |
| Former [1986/48] | For all designated states DISCO ABRASIVE SYSTEMS, LTD. 14-3 Higashi Kojiya 2-chome Ota-Ku Tokyo 144 / JP | Inventor(s) | 01 /
Sekiya, Shinji 9-8 Takanawa 3-chome Minato-ku Tokyo / JP | [1986/48] | Representative(s) | Beetz & Partner mbB Patentanwälte Prinzregentenstraße 54 80538 München / DE | [N/P] |
| Former [2008/38] | Beetz & Partner Patentanwälte Steinsdorfstrasse 10 80538 München / DE | ||
| Former [1986/48] | Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr Steinsdorfstrasse 10 D-80538 München / DE | Application number, filing date | 86106728.8 | 16.05.1986 | [1986/48] | Priority number, date | JP19850072333U | 17.05.1985 Original published format: JP 7233385 U | JP19860011900 | 24.01.1986 Original published format: JP 1190086 | [1986/48] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0202630 | Date: | 26.11.1986 | Language: | EN | [1986/48] | Type: | A3 Search report | No.: | EP0202630 | Date: | 10.01.1990 | Language: | EN | [1990/02] | Type: | B1 Patent specification | No.: | EP0202630 | Date: | 25.03.1992 | Language: | EN | [1992/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.11.1989 | Classification | IPC: | H01L21/68, G01B21/00, H01L21/304 | [1986/48] | CPC: |
G05B19/404 (EP,US);
H01L21/00 (KR);
B23D59/002 (EP,US);
B23Q11/0007 (EP,US);
B23Q15/08 (KR);
G01B5/0014 (EP,US);
| Designated contracting states | DE, FR, GB, IT, NL [1986/48] | Title | German: | Halbleiterwafer-Präzisionschneidevorrichtung mit integrierten Kompensatoren zur Verringerung der durch Temperaturänderungen verursachten Fehler | [1992/13] | English: | Semiconductor wafer precision cutting device with integrated compensators to reduce errors caused by temperature changes | [1992/13] | French: | Dispositif de découpage de précision pour pastilles semi-conductrices comportant des compensateurs pour réduire les erreurs dues aux changements de température | [1992/13] |
| Former [1986/48] | Präzisionsvorrichtung mit verringerten durch Temperaturänderung verursachten Fehlern | ||
| Former [1986/48] | Precision device having errors attributed to termperature change reduced | ||
| Former [1986/48] | Dispositif de précision ayant des erreurs minimes dues au changement de température | Examination procedure | 02.07.1990 | Examination requested [1990/35] | 26.02.1991 | Despatch of a communication from the examining division (Time limit: M04) | 16.05.1991 | Reply to a communication from the examining division | 07.08.1991 | Despatch of communication of intention to grant (Approval: Yes) | 24.09.1991 | Communication of intention to grant the patent | 15.11.1991 | Fee for grant paid | 15.11.1991 | Fee for publishing/printing paid | Opposition(s) | 29.12.1992 | No opposition filed within time limit [1993/11] | Fees paid | Renewal fee | 20.05.1988 | Renewal fee patent year 03 | 24.05.1989 | Renewal fee patent year 04 | 29.05.1990 | Renewal fee patent year 05 | 24.05.1991 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP55083567 ; | [A]US2664787 (PLIMMER ALFRED G); | [A]US2956344 (KURT RANTSCH); | [A]US3579073 (JOHNSTONE RICHARD, et al); | [AP]DD228048 (ZEISS JENA VEB CARL [DD]); | [AP]EP0177835 (FLEXIBLE MFG SYSTEMS [US]) | [A] - PATENT ABSTRACTS OF JAPAN, unexamined applications, M section, vol. 4, no. 125, September 3, 1980 THE PATENT OFFICE JAPANESE GOVERNMENT page 95 M 30 & JP-A-55 083567 (OKAMOTO) 24-06-1980, & JP55083567 A 00000000 | [A] - KUHLENKAMPF "Lexikon der Feinwerktechnik" (LUEGER), 1969 DEUTSCHE VERLAGSANSTALT, Stuttgart |