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EP0211357

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Extract from the Register of European Patents

EP About this file: EP0211357

EP0211357 - Process for installing a contact device on a circuit board. [Right-click to bookmark this link]
Former [1987/09]	Contact device
	[1992/26]
Status	No opposition filed within time limit Status updated on 24.04.1993 Database last updated on 28.03.2026
Most recent event Tooltip	24.04.1993	No opposition filed within time limit	published on 16.06.1993 [1993/24]
Applicant(s)	For all designated states SIEMENS AKTIENGESELLSCHAFT Werner-von-Siemens-Str. 1 DE-80333 München / DE
	[N/P]
Former [1987/09]	For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 D-80333 München / DE
Inventor(s)	01 / Awakowicz, Erwin, Dipl.-Ing. Richard-Pietzsch-Weg 18 D-8000 München 71 / DE
	02 / Kleine, Peter, Dipl.-Ing. Kramerstrasse 9 D-8121 Fischen / DE
	[1987/09]
Application number, filing date	86110306.7	25.07.1986
	[1987/09]
Priority number, date	DE19853527142	29.07.1985 Original published format: DE 3527142
	[1987/09]
Filing language	DE
Procedural language	DE
Publication	Type:	A2 Application without search report
	No.:	EP0211357
	Date:	25.02.1987
	Language:	DE
	[1987/09]
	Type:	A3 Search report
	No.:	EP0211357
	Date:	21.09.1988
	Language:	DE
	[1988/38]
	Type:	B1 Patent specification
	No.:	EP0211357
	Date:	24.06.1992
	Language:	DE
	[1992/26]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	02.08.1988
Classification	IPC:	H01R9/09	[1987/09]
	CPC:	H05K3/3405 (EP,US); H01R12/58 (EP,US); H05K2201/09063 (EP,US); H05K2201/09145 (EP,US); H05K2201/10295 (EP,US); H05K2201/10962 (EP,US); (+) Y10T29/49149 (EP,US) (-)
Designated contracting states	DE, GB, SE [1987/09]
Title	German:	Verfahren zur Herstellung einer Kontakteinrichtung auf einer Leiterplatte	[1992/26]
	English:	Process for installing a contact device on a circuit board.	[1992/26]
	French:	procédé d'installation d'un dispositif de contact sur une carte de circuits imprimés.	[1992/26]
	Former [1987/09]	Kontakteinrichtung
	Former [1987/09]	Contact device
	Former [1987/09]	Dispositif de contact
File destroyed:	20.04.2002
Examination procedure	07.03.1989	Examination requested [1989/18]
	20.11.1990	Despatch of a communication from the examining division (Time limit: M04)
	20.03.1991	Reply to a communication from the examining division
	09.08.1991	Despatch of communication of intention to grant (Approval: Yes)
	16.12.1991	Communication of intention to grant the patent
	10.03.1992	Fee for grant paid
	10.03.1992	Fee for publishing/printing paid
Opposition(s)	25.03.1993	No opposition filed within time limit [1993/24]
Fees paid	Renewal fee
	25.07.1988	Renewal fee patent year 03
	26.07.1989	Renewal fee patent year 04
	26.07.1990	Renewal fee patent year 05
	20.12.1990	Renewal fee patent year 06
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