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Extract from the Register of European Patents

EP About this file: EP0217326

EP0217326 - Semiconductor device with a high breakdown voltage [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  13.04.1991
Database last updated on 13.09.2024
Most recent event   Tooltip13.04.1991No opposition filed within time limitpublished on 05.06.1991 [1991/23]
Applicant(s)For all designated states
Kabushiki Kaisha Toshiba
72, Horikawa-cho, Saiwai-ku Kawasaki-shi
Kanagawa-ken 210-8572 / JP
[N/P]
Former [1987/15]For all designated states
KABUSHIKI KAISHA TOSHIBA
72, Horikawa-cho, Saiwai-ku
Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP
Inventor(s)01 / Baba, Yoshiro Pat. Division
K.K. Toshiba 1-1- Shibaura 1-chome
Minato-ku Tokyo 105 / JP
02 / Tsuru, Kazuo Pat. Division
K.K. Toshiba 1-1- Shibaura 1-chome
Minato-ku Tokyo 105 / JP
03 / Akiyama, Tatsuo Pat. Division
K.K. Toshiba 1-1- Shibaura 1-chome
Minato-ku Tokyo 105 / JP
04 / Koshino, Yutaka Pat. Division
K.K. Toshiba 1-1- Shibaura 1-chome
Minato-ku Tokyo 105 / JP
[1987/15]
Representative(s)Hoffmann, Klaus, et al
Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20
81904 München / DE
[N/P]
Former [1989/17]Hoffmann, Klaus, Dr. rer. nat., et al
Hoffmann, Eitle & Partner Patentanwälte Postfach 81 04 20
D-81904 München / DE
Former [1987/15]Hoffmann, Klaus, Dr. rer. nat.
Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20
D-81925 München / DE
Application number, filing date86113342.929.09.1986
[1987/15]
Priority number, dateJP1985021658630.09.1985         Original published format: JP 21658685
[1987/15]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0217326
Date:08.04.1987
Language:EN
[1987/15]
Type: A3 Search report 
No.:EP0217326
Date:02.12.1987
Language:EN
[1987/49]
Type: B1 Patent specification 
No.:EP0217326
Date:13.06.1990
Language:EN
[1990/24]
Search report(s)(Supplementary) European search report - dispatched on:EP13.10.1987
ClassificationIPC:H01L29/06
[1987/15]
CPC:
H01L29/405 (EP,US); H01L29/04 (EP,US); H01L29/0619 (EP,US);
H01L29/408 (EP,US)
Designated contracting statesDE,   FR,   GB [1987/15]
TitleGerman:Halbleiteranordnung mit einer hohen Durchbruchspannung[1987/15]
English:Semiconductor device with a high breakdown voltage[1987/15]
French:Dispositif semi-conducteur à haute tension de claquage[1987/15]
Examination procedure29.09.1986Examination requested  [1987/15]
20.02.1989Despatch of a communication from the examining division (Time limit: M06)
11.08.1989Reply to a communication from the examining division
17.10.1989Despatch of communication of intention to grant (Approval: Yes)
07.12.1989Communication of intention to grant the patent
28.02.1990Fee for grant paid
28.02.1990Fee for publishing/printing paid
Opposition(s)14.03.1991No opposition filed within time limit [1991/23]
Fees paidRenewal fee
14.09.1988Renewal fee patent year 03
11.09.1989Renewal fee patent year 04
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Documents cited:Search[A]US3971061  (MATSUSHITA TAKESHI, et al);
 [A]GB2047461  (PHILIPS ELECTRONIC ASSOCIATED)
 [X]  - JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 15, no. 7, 1976, supplement, pages 41-48, Tokyo, JP; H. MOCHIZUKI et al.: "Semi-insulating polycrystalline-silicon (SIPOS) films applied to MOS integrated circuits"
 [AD]  - IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. ED-23, no. 8, August 1976, pages 826-830, IEEE, New York, US; T. MATSUSHITA et al.: "Highly reliable high-voltage transistors by use of the SIPOS process"
ExaminationUS4014037
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.