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Extract from the Register of European Patents

EP About this file: EP0228206

EP0228206 - Method of making an integrated circuit structure having gate electrode and underlying oxide [Right-click to bookmark this link]
Former [1987/28]Improvements in integrated circuit structure having gate electrode and underlying oxide and method of making same
[1994/07]
StatusNo opposition filed within time limit
Status updated on  22.12.1994
Database last updated on 24.04.2024
Most recent event   Tooltip28.11.2003Lapse of the patent in a contracting state
New state(s): ES
published on 14.01.2004  [2004/03]
Applicant(s)For all designated states
ADVANCED MICRO DEVICES, INC.
901 Thompson Place P.O. Box 3453
Sunnyvale CA 94088-3453 / US
[N/P]
Former [1987/28]For all designated states
ADVANCED MICRO DEVICES, INC.
901 Thompson Place P.O. Box 3453
Sunnyvale, CA 94088 / US
Inventor(s)01 / Cox, William P.
570 Meadow Avenue
Santa Clara California 95051 / US
02 / Liang, Mong-Song
792 Los Positos Dr.
Milpitas California 95035 / US
[1987/28]
Representative(s)Wright, Hugh Ronald, et al
Brookes Batchellor LLP
1 Boyne Park
Tunbridge Wells Kent TN4 8EL / GB
[N/P]
Former [1987/28]Wright, Hugh Ronald, et al
Brookes & Martin 52/54 High Holborn
London WC1V 6SE / GB
Application number, filing date86309559.209.12.1986
[1987/28]
Priority number, dateUS1985081105717.12.1985         Original published format: US 811057
[1987/28]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0228206
Date:08.07.1987
Language:EN
[1987/28]
Type: A3 Search report 
No.:EP0228206
Date:27.04.1988
Language:EN
[1988/17]
Type: B1 Patent specification 
No.:EP0228206
Date:16.02.1994
Language:EN
[1994/07]
Search report(s)(Supplementary) European search report - dispatched on:EP07.03.1988
ClassificationIPC:H01L21/28, H01L29/784, G11C17/00
[1994/07]
CPC:
H01L29/7883 (EP,US); H01L29/40114 (EP,US); H01L29/4916 (EP,US)
Former IPC [1987/28]H01L29/60, H01L29/78, H01L21/28, // G11C17/00
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1987/28]
TitleGerman:Verfahren zur Herstellung einer integrierten Schaltungsanordnung mit Gate-Elektrode und unterliegendem Oxid[1994/07]
English:Method of making an integrated circuit structure having gate electrode and underlying oxide[1994/07]
French:Méthode de fabrication d'une structure de circuit intégré ayant une électrode de grille et une sous-couche d'oxyde[1994/07]
Former [1987/28]Integrierte Schaltungsanordnung mit Gate-Elektrode und unterliegendem Oxid und Verfahren zu ihrer Herstellung
Former [1987/28]Improvements in integrated circuit structure having gate electrode and underlying oxide and method of making same
Former [1987/28]Structure de circuit intégré ayant une électrode de grille et une sous-couche d'oxyde et sa méthode de fabrication
Examination procedure18.04.1988Examination requested  [1988/24]
07.07.1992Despatch of a communication from the examining division (Time limit: M04)
01.10.1992Reply to a communication from the examining division
14.01.1993Despatch of a communication from the examining division (Time limit: M02)
11.03.1993Reply to a communication from the examining division
01.07.1993Despatch of communication of intention to grant (Approval: Yes)
13.08.1993Communication of intention to grant the patent
27.10.1993Fee for grant paid
27.10.1993Fee for publishing/printing paid
Opposition(s)18.11.1994No opposition filed within time limit [1995/07]
Fees paidRenewal fee
22.12.1988Renewal fee patent year 03
20.12.1989Renewal fee patent year 04
18.12.1990Renewal fee patent year 05
20.12.1991Renewal fee patent year 06
30.10.1992Renewal fee patent year 07
24.11.1993Renewal fee patent year 08
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competence of the Unified
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT16.02.1994
BE16.02.1994
CH16.02.1994
GR16.02.1994
LI16.02.1994
NL16.02.1994
SE16.02.1994
ES27.05.1994
[2004/03]
Former [2000/04]AT16.02.1994
BE16.02.1994
CH16.02.1994
GR16.02.1994
LI16.02.1994
NL16.02.1994
SE16.02.1994
Former [1995/10]AT16.02.1994
BE16.02.1994
CH16.02.1994
LI16.02.1994
NL16.02.1994
SE16.02.1994
Former [1994/49]AT16.02.1994
BE16.02.1994
CH16.02.1994
LI16.02.1994
SE16.02.1994
Former [1994/47]AT16.02.1994
CH16.02.1994
LI16.02.1994
SE16.02.1994
Former [1994/46]AT16.02.1994
SE16.02.1994
Former [1994/45]SE16.02.1994
Documents cited:Search[X]JP56026469  ;
 [X]JP58212178  ;
 [X]US4288256  (NING TAK H, et al);
 [X]EP0053013  (FUJITSU LTD [JP]);
 [X]WO8302197  (NCR CO [US]);
 [A]GB2130009  (RCA CORP);
 [X]EP0160965  (TOSHIBA KK [JP])
 [X]  - PATENT ABSTRACT OF JAPAN, vol. 5, no. 78 (E-58)[750], 22nd May 1981; & JP-A-56 026 469 (NIPPON DENKI K.K.) 14-03-1981, & JP56026469 A 00000000
 [X]  - PATENT ABSTRACTS OF JAPAN, vol. 8, no. 63 (E-233)[1500], 24th March 1984; & JP-A-58 212 178 (MATSUSHITA DENKI SANGYO K.K.) 09-12-1983, & JP58212178 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.