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EP0231795
European procedure
Extract from the Register of European Patents
EP About this file: EP0231795
| EP0231795 - Method for making printed circuit boards [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 27.02.1992 Database last updated on 30.10.2024 | Most recent event Tooltip | 27.02.1992 | No opposition filed within time limit | published on 15.04.1992 [1992/16] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1987/33] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Babu, Surysdevara Vijayakumar 1 Carol Court Potsdam New York 13676 / US | 02 /
Herrmann, William Frederick 307 W. Franklin Street Endicott New York 13760 / US | 03 /
Hoffarth, Joseph Gerard R.D. No. 3, Poplar Hill Road Binghamton New York 13901 / US | 04 /
Markovich, Voya 36-11 Joel Drive Endwell New York 13760 / US | 05 /
Wiley, Robert Taylor 4713 Marshall Drive Binghamton New York 13903 / US | [1987/33] | Representative(s) | Rudack, Günter Otto IBM Corporation Säumerstrasse 4 CH-8803 Rüschlikon / CH | [N/P] |
| Former [1987/33] | Rudack, Günter O., Dipl.-Ing. IBM Corporation Säumerstrasse 4 CH-8803 Rüschlikon / CH | Application number, filing date | 87100547.6 | 16.01.1987 | [1987/33] | Priority number, date | US19860822216 | 24.01.1986 Original published format: US 822216 | [1987/33] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0231795 | Date: | 12.08.1987 | Language: | EN | [1987/33] | Type: | A3 Search report | No.: | EP0231795 | Date: | 20.04.1988 | Language: | EN | [1988/16] | Type: | B1 Patent specification | No.: | EP0231795 | Date: | 24.04.1991 | Language: | EN | [1991/17] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.03.1988 | Classification | IPC: | H05K3/18, H05K3/08 | [1987/33] | CPC: |
H05K3/08 (EP,US);
H05K3/184 (EP,US);
H05K3/26 (EP,US);
H05K2201/0761 (EP,US);
H05K2203/0783 (EP,US);
H05K2203/095 (EP,US);
H05K2203/1407 (EP,US)
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| Designated contracting states | DE, FR, GB [1987/33] | Title | German: | Verfahren zur Herstellung von gedruckten Leiterplatten | [1987/33] | English: | Method for making printed circuit boards | [1987/33] | French: | Procédé de fabrication de circuits imprimés | [1987/33] | Examination procedure | 02.12.1987 | Examination requested [1988/05] | 06.04.1990 | Despatch of communication of intention to grant (Approval: Yes) | 27.06.1990 | Communication of intention to grant the patent | 05.07.1990 | Fee for grant paid | 05.07.1990 | Fee for publishing/printing paid | Opposition(s) | 25.01.1992 | No opposition filed within time limit [1992/16] | Fees paid | Renewal fee | 27.01.1989 | Renewal fee patent year 03 | 20.01.1990 | Renewal fee patent year 04 | 24.01.1991 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP57027177 ; | [A]DE1935316 (GYLLING & CO AB); | [A]US4416725 (CUOMO JEROME J [US], et al); | [A]EP0153683 (BAYER AG [DE]) | [A] - CHEMICAL ABSTRACTS, vol. 97, no. 16, October 1982, page 264, abstract no. 202247z, Columbus, Ohio, US; & JP-A-57 027 177 (FUJITSU LTD) 09-06-1982, & JP57027177 A 00000000 | Examination | US4448804 |