Extract from the Register of European Patents

EP About this file: EP0257197

EP0257197 - Method and apparatus for controlling the organic contamination level in an electroless plating bath [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  27.11.1993
Database last updated on 09.04.2026
Most recent event   Tooltip23.11.2007Lapse of the patent in a contracting statepublished on 26.12.2007  [2007/52]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1988/09]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / McBride, Donald Gene
2058 Cheshire Road
Binghamton, NY 13903 / US
02 / Rickert, Robert George
2705 Foster Street
Endwell, NY 13760 / US
[1988/09]
Representative(s)Klein, Daniel Jacques Henri
Compagnie IBM France Département de Propriété Intellectuelle
06610 La Gaude / FR
[N/P]
Former [1992/06]Klein, Daniel Jacques Henri
Compagnie IBM France Département de Propriété Intellectuelle
F-06610 La Gaude / FR
Former [1988/41]Combeau, Jacques
Compagnie IBM France Département de Propriété Intellectuelle
F-06610 La Gaude / FR
Former [1988/09]Teufel, Fritz, Dipl.-Phys.
IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht Pascalstrasse 100
W-7000 Stuttgart 80 / DE
Application number, filing date87106898.712.05.1987
[1988/09]
Priority number, dateUS1986088433011.07.1986         Original published format: US 884330
[1988/09]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0257197
Date:02.03.1988
Language:EN
[1988/09]
Type: A3 Search report 
No.:EP0257197
Date:20.09.1989
Language:EN
[1989/38]
Type: B1 Patent specification 
No.:EP0257197
Date:27.01.1993
Language:EN
[1993/04]
Search report(s)(Supplementary) European search report - dispatched on:EP01.08.1989
ClassificationIPC:G01N27/22, C23C18/16
[1989/35]
CPC:
C23C18/1683 (EP,US); H05K3/187 (EP,US)
Former IPC [1988/09]G01N27/22
Designated contracting statesDE,   FR,   GB,   IT [1988/09]
TitleGerman:Verfahren und Vorrichtung zur Kontrolle des organischen Kontaminationspegels in einem Platierungsbad ohne Elektrode[1988/09]
English:Method and apparatus for controlling the organic contamination level in an electroless plating bath[1988/09]
French:Méthode et appareil de contrôle du niveau de contamination organique dans un bain d'enduction sans électrodes[1988/09]
Examination procedure30.05.1988Examination requested  [1988/31]
29.11.1990Despatch of a communication from the examining division (Time limit: M06)
03.06.1991Reply to a communication from the examining division
21.08.1991Despatch of a communication from the examining division (Time limit: M06)
19.02.1992Reply to a communication from the examining division
15.04.1992Despatch of communication of intention to grant (Approval: Yes)
03.08.1992Communication of intention to grant the patent
15.09.1992Fee for grant paid
15.09.1992Fee for publishing/printing paid
Opposition(s)28.10.1993No opposition filed within time limit [1994/03]
Fees paidRenewal fee
30.05.1989Renewal fee patent year 03
19.05.1990Renewal fee patent year 04
21.05.1991Renewal fee patent year 05
21.05.1992Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT27.01.1993
[1999/42]
Documents cited:Search[A]   JOURNAL OF ELECTROCHEMICAL STUDY, vol. 127, no. 2, February 1980, pages 365-368, Princeton, GB; M. PAUNOVIC: "An electrochemical control system for electroless copper bath" [A]
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.