Extract from the Register of European Patents

EP About this file: EP0307509

EP0307509 - Sticking and cutoff device for adhesive tape for thin articles [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  03.04.1993
Database last updated on 01.04.2026
Most recent event   Tooltip03.04.1993No opposition filed within time limitpublished on 26.05.1993 [1993/21]
Applicant(s)For all designated states
NITTO DENKO CORPORATION
1-2, Shimohozumi 1-chome Ibaraki-shi
Osaka / JP
[N/P]
Former [1989/12]For all designated states
NITTO DENKO CORPORATION
1-2, Shimohozumi 1-chome Ibaraki-shi
Osaka / JP
Inventor(s)01 / Matsushita, Takao
No. 7-41, Shimohozumi 4-chome
Ibaraki-shi Osaka / JP
02 / Kira, Akihiko
No. 2-B16-306, Momoyamadai 1-chome
Suita-shi Osaka / JP
03 / Ametani, Minoru
No. 19-10, Ankojicho 5-chome
Takatsuki-shi Osaka / JP
[1989/12]
Representative(s)Füchsle, Klaus, et al
Hoffmann - Eitle
ATTENTION : ADDRESS INACTIVE - USE ASS-NR - CDR / DE
[N/P]
Former [1989/12]Füchsle, Klaus, Dipl.-Ing., et al
Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20
D-81904 München / DE
Application number, filing date87114622.107.10.1987
[1989/12]
Priority number, dateJP1987020118511.08.1987         Original published format: JP 20118587
[1989/12]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0307509
Date:22.03.1989
Language:EN
[1989/12]
Type: A3 Search report 
No.:EP0307509
Date:24.01.1990
Language:EN
[1990/04]
Type: B1 Patent specification 
No.:EP0307509
Date:03.06.1992
Language:EN
[1992/23]
Search report(s)(Supplementary) European search report - dispatched on:EP05.12.1989
ClassificationIPC:H01L21/68, B65B63/00
[1992/23]
CPC:
H10P72/0442 (EP,KR,US); H10P72/0606 (KR); Y10T156/1343 (EP,US);
Y10T83/538 (EP,US)
Former IPC [1989/12]H01L21/00
Designated contracting statesDE,   FR,   GB [1989/12]
TitleGerman:Vorrichtung zum Heranbringen und Abschneiden von Klebestreifen für dünne Einzelteile[1989/12]
English:Sticking and cutoff device for adhesive tape for thin articles[1989/12]
French:Dispositif pour appliquer et couper des bandes adhésives pour des pièces minces[1989/12]
File destroyed:03.03.2001
Examination procedure02.04.1990Examination requested  [1990/22]
30.09.1991Despatch of communication of intention to grant (Approval: Yes)
05.12.1991Communication of intention to grant the patent
19.02.1992Fee for grant paid
19.02.1992Fee for publishing/printing paid
Opposition(s)04.03.1993No opposition filed within time limit [1993/21]
Fees paidRenewal fee
31.10.1989Renewal fee patent year 03
31.10.1990Renewal fee patent year 04
27.12.1990Renewal fee patent year 05
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