EP0253603 - Composite diamond abrasive compact [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 21.08.1993 Database last updated on 04.06.2024 | Most recent event Tooltip | 23.11.2007 | Lapse of the patent in a contracting state Updated state(s): FR | published on 26.12.2007 [2007/52] | Applicant(s) | For all designated states DE BEERS INDUSTRIAL DIAMOND DIVISION (PROPRIETARY) LIMITED Debid House, Corner Amethyst Street & Crownwood Road, Theta Johannesburg Transvaal / ZA | [N/P] |
Former [1992/27] | For all designated states DE BEERS INDUSTRIAL DIAMOND DIVISION (PROPRIETARY) LIMITED Debid House, Corner Amethyst Street & Crownwood Road, Theta Johannesburg, Transvaal / ZA | ||
Former [1988/03] | For all designated states DE BEERS INDUSTRIAL DIAMOND DIVISION (PROPRIETARY) LIMITED 8th Floor 45 Main Street Johannesburg Transvaal / ZA | Inventor(s) | 01 /
Burnand, Richard Patrick 39, Constantia Avenue Alan Manor Johannesburg Transvaal / ZA | 02 /
MacKenzie, Kenneth Alexander 215 Oak Avenue, Ferndale Randburg Transvaal / ZA | [1992/43] |
Former [1988/03] | 01 /
Burnand, Richard Patrick 39, Constantia Avenue Alan Manor Johannesburg Transvaal / ZA | ||
02 /
MacKenzie, Kenneth Alexander 215 Oak Avene Ferndale Randburg Transvaal / ZA | Representative(s) | Jones, Alan John, et al CARPMAELS & RANSFORD 43 Bloomsbury Square London, WC1A 2RA / GB | [N/P] |
Former [1988/03] | Jones, Alan John, et al CARPMAELS & RANSFORD 43 Bloomsbury Square London, WC1A 2RA / GB | Application number, filing date | 87306167.5 | 13.07.1987 | [1988/03] | Priority number, date | ZA19860005237 | 14.07.1986 Original published format: ZA 865237 | [1988/03] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0253603 | Date: | 20.01.1988 | Language: | EN | [1988/03] | Type: | A3 Search report | No.: | EP0253603 | Date: | 29.03.1989 | Language: | EN | [1989/13] | Type: | B1 Patent specification | No.: | EP0253603 | Date: | 21.10.1992 | Language: | EN | [1992/43] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.02.1989 | Classification | IPC: | B22F7/06, C22C26/00 | [1988/03] | CPC: |
B01J3/062 (EP,US);
B22F7/06 (EP,US);
B24D3/10 (EP,US);
C01B32/90 (EP);
C22C19/00 (EP);
C22C26/00 (EP,US);
C22C29/06 (EP);
B01J2203/062 (EP,US);
B01J2203/0655 (EP,US);
B01J2203/0685 (EP,US)
(-)
| C-Set: |
B22F7/06, C01B32/90 (US,EP);
B22F7/06, C22C19/00, C22C26/00 (EP,US);
B22F7/06, C22C29/06 (US,EP)
| Designated contracting states | AT, BE, CH, DE, FR, GB, IT, LI, NL, SE [1988/03] | Title | German: | Abrasiven Diamant enthaltender Verbundkörper | [1988/03] | English: | Composite diamond abrasive compact | [1988/03] | French: | Ebauche composite abrasive contenant du diamant | [1988/03] | Examination procedure | 12.05.1989 | Examination requested [1989/29] | 14.01.1991 | Despatch of a communication from the examining division (Time limit: M06) | 17.06.1991 | Reply to a communication from the examining division | 12.08.1991 | Despatch of communication of intention to grant (Approval: Yes) | 04.12.1991 | Communication of intention to grant the patent | 07.01.1992 | Fee for grant paid | 07.01.1992 | Fee for publishing/printing paid | Opposition(s) | 22.07.1993 | No opposition filed within time limit [1993/41] | Fees paid | Renewal fee | 10.07.1989 | Renewal fee patent year 03 | 17.07.1990 | Renewal fee patent year 04 | 13.07.1991 | Renewal fee patent year 05 | 27.07.1992 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 21.10.1992 | IT | 21.10.1992 | NL | 21.10.1992 | [2004/35] |
Former [1999/42] | IT | 21.10.1992 | |
NL | 21.10.1992 | ||
FR | 12.03.1993 | ||
Former [1993/33] | NL | 21.10.1992 | |
FR | 12.03.1993 | ||
Former [1993/21] | NL | 21.10.1992 | Documents cited: | Search | [Y]US4403015 (NAKAI TETSUO [JP], et al); | [Y]EP0180243 (SUMITOMO ELECTRIC INDUSTRIES [JP]) |