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Extract from the Register of European Patents

EP About this file: EP0269336

EP0269336 - Semiconductor integrated circuit packages [Right-click to bookmark this link]
StatusThe application has been refused
Status updated on  12.06.1998
Database last updated on 03.10.2024
Most recent event   Tooltip07.07.2007Change - inventorpublished on 08.08.2007  [2007/32]
Applicant(s)For all designated states
AT&T Corp.
32 Avenue of the Americas
New York, NY 10013-2412 / US
[1988/22]
Inventor(s)01 / Moyer, Harold William
1602 Ruth Street
Allentown Pennsylvania 18104 / US
02 / Scholz, Harry Robert
1385 Oak Drive
Macungie Pennsylvania 18062 / US
 [2007/32]
Former [1988/22]01 / Moyer, Harold William
1602 Ruth Street
Allentown Pennsylvania 18104 / US
02 / Scholz, Harry Robert
1385 Oak Drive
Macungie Pennsylvania 18062 / US
Representative(s)Johnston, Kenneth Graham, et al
Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue
Enfield, EN3 7XB / GB
[N/P]
Former [1992/16]Johnston, Kenneth Graham, et al
AT&T (UK) LTD. AT&T Intellectual Property Division 5 Mornington Road
Woodford Green Essex, IG8 OTU / GB
Former [1988/22]Johnston, Kenneth Graham
AT&T (UK) Ltd. 5 Mornington Road
Woodford Green Essex, IG8 OTU / GB
Application number, filing date87310085.316.11.1987
[1988/22]
Priority number, dateUS1986093406224.11.1986         Original published format: US 934062
[1988/22]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0269336
Date:01.06.1988
Language:EN
[1988/22]
Type: A3 Search report 
No.:EP0269336
Date:13.12.1989
Language:EN
[1989/50]
Search report(s)(Supplementary) European search report - dispatched on:EP25.10.1989
ClassificationIPC:H01L23/50, H01L23/12, H01L23/48
[1989/52]
CPC:
H01L23/49544 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US);
H01L2224/48472 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/14 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/48472, H01L2224/48091, H01L2924/00 (US,EP);
H01L2224/48472, H01L2224/48247, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP)
Former IPC [1988/22]H01L23/12, H01L23/50
Designated contracting statesDE,   FR,   GB,   IT [1988/22]
TitleGerman:Gehäuse von integrierten Halbleiterschaltkreisen[1988/22]
English:Semiconductor integrated circuit packages[1988/22]
French:Boîtiers de circuits intégrés à semi-conducteur[1988/22]
Examination procedure06.06.1990Examination requested  [1990/32]
14.08.1991Despatch of a communication from the examining division (Time limit: M06)
10.02.1992Reply to a communication from the examining division
13.08.1992Despatch of a communication from the examining division (Time limit: M06)
15.02.1993Reply to a communication from the examining division
14.09.1993Despatch of a communication from the examining division (Time limit: M06)
14.03.1994Reply to a communication from the examining division
15.09.1994Despatch of communication that the application is refused, reason: substantive examination [1998/31]
23.04.1998Application refused, date of legal effect [1998/31]
Appeal following examination10.11.1994Appeal received No.  T0095/95
13.01.1995Statement of grounds filed
21.03.1997Invitation to file observations in an appeal (Time limit: M04) [1997/12]
17.07.1997Date of receipt of observations in an appeal [1997/29]
23.04.1998Result of appeal procedure: appeal of the applicant was rejected
23.04.1998Date of oral proceedings
30.04.1998Minutes of oral proceedings despatched
Fees paidRenewal fee
17.11.1989Renewal fee patent year 03
16.11.1990Renewal fee patent year 04
21.11.1991Renewal fee patent year 05
16.11.1992Renewal fee patent year 06
09.11.1993Renewal fee patent year 07
16.11.1994Renewal fee patent year 08
17.11.1995Renewal fee patent year 09
18.11.1996Renewal fee patent year 10
07.11.1997Renewal fee patent year 11
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Documents cited:Search[X]JP57118658  ;
 [Y]JP61063047  ;
 [Y]JP57066655  ;
 [Y]EP0053966  (CII HONEYWELL BULL [FR]);
 [A]DD240984  (ERFURT MIKROELEKTRONIK [DD])
 [X]  - PATENT ABSTRACTS OF JAPAN. vol. 6, no. 215 (E-138)(1093) 28 October 1982; & JP-A-57 118 658 (HITACHI SEISAKUSHO K.K.) 23-07-1982, & JP57118658 A 19821028
 [Y]  - PATENT ABSTRACTS OF JAPAN. vol. 10, no. 228 (E-426)(2284) 8 August 1986; & JP-A-61 063 047 (HITACHI LTD.) 01-04-1986, & JP61063047 A 19860808
 [Y]  - PATENT ABSTRACTS OF JAPAN. vol. 6, no. 144 (E-122)(1022) 3 August 1982; & JP-A-57 066 655 (MITSUBISHI DENKI K.K.) 22-04-1982, & JP57066655 A 19820803
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.