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Extract from the Register of European Patents

EP About this file: EP0272142

EP0272142 - Magnetic field enhanced plasma etch reactor [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  08.07.1995
Database last updated on 11.05.2024
Most recent event   Tooltip11.12.1999Lapse of the patent in a contracting statepublished on 26.01.2000 [2000/04]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, California 95051 / US
[N/P]
Former [1988/25]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue
Santa Clara California 95051 / US
Inventor(s)01 / Cheng, David
974 Sherman Oaks Drive
San Jose California 95128 / US
02 / Maydan, Dan
1200 Murietta Lane
Los Altos Hills California 94022 / US
03 / Somekh, Sasson
524 Compass Drive
Redwood City California 94065 / US
04 / Stalder, Kenneth R.
515 King Street
Redwood City California 94062 / US
05 / Andrews, Dana L.
2541 Betlo Avenue
Mountain View California 94043 / US
06 / Chang, Mei
3366 Isadora Drive
San Josa California 95132 / US
07 / White, John M.
2811 Colony View Place
Hayward California 94541 / US
08 / Wong, Jerry Yuen Kui
32729 Orick Street
Union City California 94587 / US
09 / Zeitlin, Vladimir J.
146 Muir Avenue
Santa Clara California 95051 / US
10 / Wang, David Nin-Kou
10931 Santa Teresa Drive
Cupertino California 95014 / US
[1988/25]
Representative(s)Bayliss, Geoffrey Cyril, et al
BOULT WADE TENNANT
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
[N/P]
Former [1988/25]Bayliss, Geoffrey Cyril, et al
BOULT, WADE & TENNANT 27 Furnival Street
London EC4A 1PQ / GB
Application number, filing date87311195.918.12.1987
[1988/25]
Priority number, dateUS1986094484319.12.1986         Original published format: US 944843
[1988/25]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0272142
Date:22.06.1988
Language:EN
[1988/25]
Type: A3 Search report 
No.:EP0272142
Date:05.09.1990
Language:EN
[1990/36]
Type: B1 Patent specification 
No.:EP0272142
Date:07.09.1994
Language:EN
[1994/36]
Search report(s)(Supplementary) European search report - dispatched on:EP16.07.1990
ClassificationIPC:H01J37/32, H01L21/306, C23C16/50
[1990/22]
CPC:
H01L21/67069 (EP); H01J37/32477 (EP); H01J37/32623 (EP);
H01J37/32743 (EP); H01J37/32788 (EP); H01J37/32862 (EP)
Former IPC [1988/25]H01L21/306, C23C16/50, H01J37/32
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1988/25]
TitleGerman:Plasmaätzvorrichtung mit Magnetfeldverstärkung[1988/25]
English:Magnetic field enhanced plasma etch reactor[1988/25]
French:Dispositif de décapage au plasma à amplification par champ magnétique[1988/25]
Examination procedure18.12.1990Examination requested  [1991/07]
26.02.1993Despatch of a communication from the examining division (Time limit: M06)
19.07.1993Reply to a communication from the examining division
11.11.1993Despatch of communication of intention to grant (Approval: No)
16.02.1994Despatch of communication of intention to grant (Approval: later approval)
24.02.1994Communication of intention to grant the patent
25.05.1994Fee for grant paid
25.05.1994Fee for publishing/printing paid
Divisional application(s)EP93201991.2  / EP0566220
Opposition(s)08.06.1995No opposition filed within time limit [1995/35]
Fees paidRenewal fee
04.12.1989Renewal fee patent year 03
17.12.1990Renewal fee patent year 04
25.11.1991Renewal fee patent year 05
14.12.1992Renewal fee patent year 06
29.11.1993Renewal fee patent year 07
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipGR07.09.1994
[2000/04]
Documents cited:Search[A]US4159799  (ALLES DAVID S, et al);
 [X]US4431473  (OKANO HARUO [JP], et al);
 [Y]EP0115970  (COMMISSARIAT ENERGIE ATOMIQUE [FR]);
 [X]EP0173583  (ANELVA CORP [JP]);
 [Y]US4615755  (TRACY DAVID H [US], et al);
 [X]EP0205142  (TEGAL CORP [US]);
 [XP]DE3535900  (AIGO SEIICHIRO);
 [XPD]US4668338  (MAYDAN DAN [US], et al);
 [XP]EP0242065  (VARIAN ASSOCIATES [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.