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Extract from the Register of European Patents

EP About this file: EP0256904

EP0256904 - A method of fabricating high performance BiCMOS structures having poly emitters and silicided bases [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  03.12.1992
Database last updated on 19.10.2024
Most recent event   Tooltip03.12.1992No opposition filed within time limitpublished on 20.01.1993 [1993/03]
Applicant(s)For all designated states
FAIRCHILD SEMICONDUCTOR CORPORATION
10400 Ridgeview Court P.O. Box 1500
Cupertino, California 95014 / US
[N/P]
Former [1989/35]For all designated states
FAIRCHILD SEMICONDUCTOR CORPORATION
10400 Ridgeview Court P.O. Box 1500
Cupertino, California 95014 / US
Former [1988/08]For all designated states
FAIRCHILD SEMICONDUCTOR CORPORATION
10400 Ridgeview Court P.O. Box 1500
Cupertino California 95014 / US
Inventor(s)01 / Tuntasood, Prateep
3077 Centerwood Way
San Jose California 95148 / US
02 / Manoliu, Juliana
1431 Arcadia Place
Palo Alto California 94303 / US
[1988/08]
Representative(s)Sparing Röhl Henseler
Postfach 14 04 43
40074 Düsseldorf / DE
[N/P]
Former [1989/49]Sparing Röhl Henseler Patentanwälte
Postfach 14 04 43
D-40074 Düsseldorf / DE
Former [1988/34]Dipl.-Ing. H. Marsch Dipl.-Ing. K. Sparing Dipl.-Phys.Dr. W.H. Röhl Patentanwälte
Rethelstrasse 123
D-4000 Düsseldorf 1 / DE
Former [1988/08]Chareyron, Lucien
Service Brevets Patent Department Etudes et Productions Schlumberger BP 202
F-92142 Clamart Cédex / FR
Application number, filing date87401630.610.07.1987
[1988/08]
Priority number, dateUS1986088700716.07.1986         Original published format: US 887007
[1988/08]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0256904
Date:24.02.1988
Language:EN
[1988/08]
Type: B1 Patent specification 
No.:EP0256904
Date:29.01.1992
Language:EN
[1992/05]
Search report(s)(Supplementary) European search report - dispatched on:EP26.11.1987
ClassificationIPC:H01L21/82, // H01L21/74
[1988/08]
CPC:
H01L27/0623 (EP,US); H01L21/74 (EP,US); H01L21/8249 (EP,US);
Y10S257/90 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT,   NL [1988/08]
TitleGerman:Verfahren zur Herstellung von BiCMOS-Strukturen von hoher Leistungsfähigkeit mit Polysilizium-Emittern und Transistorbasen aus Siliziden[1988/08]
English:A method of fabricating high performance BiCMOS structures having poly emitters and silicided bases[1988/08]
French:Méthode pour fabriquer des structures BiCMOS à haute performance ayant des émetteurs en polysilicium et des bases silicidées[1988/08]
Examination procedure23.08.1988Examination requested  [1988/43]
14.09.1990Despatch of a communication from the examining division (Time limit: M04)
11.01.1991Reply to a communication from the examining division
04.06.1991Despatch of communication of intention to grant (Approval: Yes)
30.07.1991Communication of intention to grant the patent
08.10.1991Fee for grant paid
08.10.1991Fee for publishing/printing paid
Opposition(s)30.10.1992No opposition filed within time limit [1993/03]
Fees paidRenewal fee
11.07.1989Renewal fee patent year 03
03.07.1990Renewal fee patent year 04
26.06.1991Renewal fee patent year 05
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Documents cited:Search[AD]US4484388  (IWASAKI HIROSHI [JP]);
 [A]FR2134360  (IBM)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.