EP0275070 - Multilayer printed wiring board and method for making same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.03.1993 Database last updated on 14.06.2024 | Most recent event Tooltip | 25.03.1993 | No opposition filed within time limit | published on 12.05.1993 [1993/19] | Applicant(s) | For all designated states AMP-Akzo Corporation (a Delaware corp.) 710 Dawson Drive Newark Delaware 197113 / US | [N/P] |
Former [1992/11] | For all designated states AMP-AKZO CORPORATION (a Delaware corp.) 710 Dawson Drive Newark, Delaware 197113 / US | ||
Former [1991/48] | For all designated states AMP-Akzo Corporation (a Delaware corp.) 322 South Service Road Melville, NY 11747 / US | ||
Former [1988/29] | For all designated states KOLLMORGEN CORPORATION 10 Mill Pond Lane Simsbury, CT 06070 / US | Inventor(s) | 01 /
Kohm, Thomas S. 5, Target Rock Road Huntington, NY 11743 / US | [1988/29] | Representative(s) | Königseder, geb. Egerer, Claudia Kreuzbichl 1 D-82491 Grainau / DE | [N/P] |
Former [1991/48] | Königseder-Egerer, Claudia D. Kreuzbichl 1 D-82491 Grainau / DE | ||
Former [1988/29] | Königseder, geb. Egerer, Claudia (DE) Kreuzbichl 1 D-82491 Grainau / DE | Application number, filing date | 88100272.9 | 12.01.1988 | [1988/29] | Priority number, date | US19870000280 | 14.01.1987 Original published format: US 280 | [1988/29] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0275070 | Date: | 20.07.1988 | Language: | EN | [1988/29] | Type: | A3 Search report | No.: | EP0275070 | Date: | 11.10.1989 | Language: | EN | [1989/41] | Type: | B1 Patent specification | No.: | EP0275070 | Date: | 20.05.1992 | Language: | EN | [1992/21] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.08.1989 | Classification | IPC: | H05K3/46, H05K3/38, C09J7/02 | [1992/21] | CPC: |
B32B15/08 (EP,US);
C08K5/0091 (EP,US);
H05K3/387 (EP,US);
H05K3/389 (EP,US);
H05K3/4661 (EP,US);
H05K2201/0133 (EP,US);
H05K2201/0195 (EP,US);
H05K2201/0209 (EP,US);
H05K2201/09881 (EP,US);
H05K3/184 (EP,US);
H05K3/426 (EP,US);
Y10S428/901 (EP,US);
| C-Set: |
C08K5/0091, C08L61/06 (EP,US)
|
Former IPC [1988/29] | H05K3/46, H05K3/38, C09J3/00 | Designated contracting states | CH, FR, IT, LI, NL, SE [1992/12] |
Former [1988/29] | CH, FR, GB, IT, LI, NL, SE | Title | German: | Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung | [1988/29] | English: | Multilayer printed wiring board and method for making same | [1988/29] | French: | Circuit imprimé multicouche et son procédé de fabrication | [1988/29] | Examination procedure | 17.01.1990 | Examination requested [1990/12] | 29.07.1991 | Despatch of communication of intention to grant (Approval: No) | 05.11.1991 | Despatch of communication of intention to grant (Approval: later approval) | 15.11.1991 | Communication of intention to grant the patent | 06.02.1992 | Fee for grant paid | 06.02.1992 | Fee for publishing/printing paid | Opposition(s) | 23.02.1993 | No opposition filed within time limit [1993/19] | Fees paid | Renewal fee | 17.01.1990 | Renewal fee patent year 03 | 22.12.1990 | Renewal fee patent year 04 | 24.01.1992 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]FR2476427 (KOLLMORGEN TECH CORP [US]); | [A]DE2821303 (HITACHI CHEMICAL CO LTD); | [A]US3471589 (RINEHART MAYNARD J); | [A]EP0164227 (KENRICH PETROCHEMICALS [US]) |