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Extract from the Register of European Patents

EP About this file: EP0275070

EP0275070 - Multilayer printed wiring board and method for making same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.03.1993
Database last updated on 14.06.2024
Most recent event   Tooltip25.03.1993No opposition filed within time limitpublished on 12.05.1993 [1993/19]
Applicant(s)For all designated states
AMP-Akzo Corporation (a Delaware corp.)
710 Dawson Drive Newark
Delaware 197113 / US
[N/P]
Former [1992/11]For all designated states
AMP-AKZO CORPORATION (a Delaware corp.)
710 Dawson Drive
Newark, Delaware 197113 / US
Former [1991/48]For all designated states
AMP-Akzo Corporation (a Delaware corp.)
322 South Service Road
Melville, NY 11747 / US
Former [1988/29]For all designated states
KOLLMORGEN CORPORATION
10 Mill Pond Lane
Simsbury, CT 06070 / US
Inventor(s)01 / Kohm, Thomas S.
5, Target Rock Road
Huntington, NY 11743 / US
[1988/29]
Representative(s)Königseder, geb. Egerer, Claudia
Kreuzbichl 1
D-82491 Grainau / DE
[N/P]
Former [1991/48]Königseder-Egerer, Claudia D.
Kreuzbichl 1
D-82491 Grainau / DE
Former [1988/29]Königseder, geb. Egerer, Claudia (DE)
Kreuzbichl 1
D-82491 Grainau / DE
Application number, filing date88100272.912.01.1988
[1988/29]
Priority number, dateUS1987000028014.01.1987         Original published format: US 280
[1988/29]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0275070
Date:20.07.1988
Language:EN
[1988/29]
Type: A3 Search report 
No.:EP0275070
Date:11.10.1989
Language:EN
[1989/41]
Type: B1 Patent specification 
No.:EP0275070
Date:20.05.1992
Language:EN
[1992/21]
Search report(s)(Supplementary) European search report - dispatched on:EP24.08.1989
ClassificationIPC:H05K3/46, H05K3/38, C09J7/02
[1992/21]
CPC:
B32B15/08 (EP,US); C08K5/0091 (EP,US); H05K3/387 (EP,US);
H05K3/389 (EP,US); H05K3/4661 (EP,US); H05K2201/0133 (EP,US);
H05K2201/0195 (EP,US); H05K2201/0209 (EP,US); H05K2201/09881 (EP,US);
H05K3/184 (EP,US); H05K3/426 (EP,US); Y10S428/901 (EP,US);
Y10T428/24917 (EP,US); Y10T428/31688 (EP,US) (-)
C-Set:
C08K5/0091, C08L61/06 (EP,US)
Former IPC [1988/29]H05K3/46, H05K3/38, C09J3/00
Designated contracting statesCH,   FR,   IT,   LI,   NL,   SE [1992/12]
Former [1988/29]CH,  FR,  GB,  IT,  LI,  NL,  SE 
TitleGerman:Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung[1988/29]
English:Multilayer printed wiring board and method for making same[1988/29]
French:Circuit imprimé multicouche et son procédé de fabrication[1988/29]
Examination procedure17.01.1990Examination requested  [1990/12]
29.07.1991Despatch of communication of intention to grant (Approval: No)
05.11.1991Despatch of communication of intention to grant (Approval: later approval)
15.11.1991Communication of intention to grant the patent
06.02.1992Fee for grant paid
06.02.1992Fee for publishing/printing paid
Opposition(s)23.02.1993No opposition filed within time limit [1993/19]
Fees paidRenewal fee
17.01.1990Renewal fee patent year 03
22.12.1990Renewal fee patent year 04
24.01.1992Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]FR2476427  (KOLLMORGEN TECH CORP [US]);
 [A]DE2821303  (HITACHI CHEMICAL CO LTD);
 [A]US3471589  (RINEHART MAYNARD J);
 [A]EP0164227  (KENRICH PETROCHEMICALS [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.