EP0280112 - Method of and device for bonding two or more members [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.11.1993 Database last updated on 04.06.2024 | Most recent event Tooltip | 13.11.1993 | No opposition filed within time limit | published on 05.01.1994 [1994/01] | Applicant(s) | For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP | [N/P] |
Former [1988/35] | For all designated states HITACHI, LTD. 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 / JP | Inventor(s) | 01 /
Yokoi, Kazuaki 1774-5, Shimoinayoshi Chiyodamura Niihari-gun Ibaraki-ken / JP | 02 /
Yamada, Toshihiro 1569-48, Sumiyoshi-Nakayama Tomobemachi Nishiibaraki-gun Ibaraki-ken / JP | 03 /
Kohno, Akiomi 6526-242, Koibuchi Tomobemachi Nishiibaraki-gun Ibaraki-ken / JP | 04 /
Hioki, Susumu 24-2, Midorigaoka Kashiwa-shi / JP | [1988/35] | Representative(s) | Finck, Dieter, et al V. Füner Ebbinghaus Finck Hano Patentanwälte Mariahilfplatz 2-3 81541 München / DE | [N/P] |
Former [1988/35] | Finck, Dieter, Dr.Ing., et al Patentanwälte v. Füner, Ebbinghaus, Finck Mariahilfplatz 2 - 3 D-81541 München / DE | Application number, filing date | 88101895.6 | 09.02.1988 | [1988/35] | Priority number, date | JP19870042659 | 27.02.1987 Original published format: JP 4265987 | [1988/35] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0280112 | Date: | 31.08.1988 | Language: | EN | [1988/35] | Type: | B1 Patent specification | No.: | EP0280112 | Date: | 13.01.1993 | Language: | EN | [1993/02] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.07.1988 | Classification | IPC: | C04B37/02, B23K20/02, B23K20/16 | [1988/35] | CPC: |
B23K20/02 (EP);
B23K20/16 (EP);
B32B37/10 (EP);
B32B37/1054 (EP);
C04B37/026 (EP);
B32B2315/02 (EP);
C04B2237/121 (EP);
C04B2237/368 (EP);
C04B2237/406 (EP);
| Designated contracting states | DE, FR, GB [1988/35] | Title | German: | Verfahren und Vorrichtung zum Verbinden zweier oder mehrerer Teile | [1988/35] | English: | Method of and device for bonding two or more members | [1988/35] | French: | Procédé et dispositif pour l'assemblage de deux ou plusieurs articles | [1988/35] | Examination procedure | 09.02.1988 | Examination requested [1988/35] | 02.08.1990 | Despatch of a communication from the examining division (Time limit: M06) | 06.02.1991 | Reply to a communication from the examining division | 15.05.1991 | Despatch of a communication from the examining division (Time limit: M04) | 28.08.1991 | Reply to a communication from the examining division | 04.10.1991 | Despatch of a communication from the examining division (Time limit: M04) | 28.01.1992 | Reply to a communication from the examining division | 10.04.1992 | Despatch of communication of intention to grant (Approval: Yes) | 08.07.1992 | Communication of intention to grant the patent | 29.09.1992 | Fee for grant paid | 29.09.1992 | Fee for publishing/printing paid | Opposition(s) | 14.10.1993 | No opposition filed within time limit [1994/01] | Fees paid | Renewal fee | 23.02.1990 | Renewal fee patent year 03 | 31.12.1990 | Renewal fee patent year 04 | 27.02.1992 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP60103081 ; | [X]EP0090658 ; | [YD]EP0135937 ; | [X]US4252263 ; | [X]EP0123382 ; | [A]DE3233022 | [A] - CHEMICAL ABSTRACTS, vol. 103, no. 20, 18th November 1985, page 300, abstract no. 165153k, Columbus, Ohio, US; & JP-A-60 103 081 (HITACHI LTD) 07-06-1985, & JP60103081 A 00000000 |