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Extract from the Register of European Patents

EP About this file: EP0334992

EP0334992 - Easily peelable semiconductive resin composition [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  26.10.1995
Database last updated on 06.07.2024
Most recent event   Tooltip26.10.1995No opposition filed within time limitpublished on 13.12.1995 [1995/50]
Applicant(s)For all designated states
Hitachi Cable, Ltd.
1-2, Marunouchi 2-chome Chiyoda-ku
Tokyo 100 / JP
[N/P]
Former [1989/40]For all designated states
HITACHI CABLE, LTD.
1-2, Marunouchi 2-chome
Chiyoda-ku Tokyo 100 / JP
Inventor(s)01 / Watanabe, Kiyoshi Hitachi Cable Ltd.
1-1, Hidaka-cho 5-chome
Hitachi-shi Ibaraki / JP
02 / Yamazaki, Takanori Hitachi Cable Ltd.
1-1, Hidaka-cho 5-chome
Hitachi-shi Ibaraki / JP
03 / Yagyu, Hideki Hitachi Cable Ltd.
1-1, Hidaka-cho 5-chome
Hitachi-shi Ibaraki / JP
[1989/40]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [1989/49]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
D-80538 München / DE
Former [1989/40]Patentanwälte Grünecker, Kinkeldey, Stockmair & Partner
Maximilianstrasse 58
D-80538 München / DE
Application number, filing date88115903.227.09.1988
[1989/40]
Priority number, dateJP1988007574329.03.1988         Original published format: JP 7574388
[1989/40]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0334992
Date:04.10.1989
Language:EN
[1989/40]
Type: B1 Patent specification 
No.:EP0334992
Date:21.12.1994
Language:EN
[1994/51]
Search report(s)(Supplementary) European search report - dispatched on:EP03.07.1989
ClassificationIPC:H01B1/24, H01B9/02
[1989/40]
CPC:
C08L23/0853 (EP,US); C08K3/04 (EP,US); H01B1/24 (EP,US);
C08L2203/202 (EP,US); C08L2205/03 (EP,US); C08L51/06 (EP,US);
C08L91/06 (EP,US) (-)
C-Set:
C08K3/04, C08L23/08 (EP,US);
C08L23/0853, C08L2666/02 (US,EP);
C08L23/0853, C08L91/06 (US,EP)
Designated contracting statesCH,   DE,   FR,   GB,   LI,   SE [1989/40]
TitleGerman:Leicht abschälbare halbleitende Harzzusammensetzung[1989/40]
English:Easily peelable semiconductive resin composition[1989/40]
French:Composition semi-conductrice de résine facile à enlever[1989/40]
Examination procedure29.01.1990Examination requested  [1990/13]
02.07.1992Despatch of a communication from the examining division (Time limit: M06)
12.01.1993Reply to a communication from the examining division
21.01.1994Despatch of communication of intention to grant (Approval: Yes)
26.05.1994Communication of intention to grant the patent
01.08.1994Fee for grant paid
01.08.1994Fee for publishing/printing paid
Opposition(s)22.09.1995No opposition filed within time limit [1995/50]
Fees paidRenewal fee
28.09.1990Renewal fee patent year 03
30.09.1991Renewal fee patent year 04
30.09.1992Renewal fee patent year 05
30.09.1993Renewal fee patent year 06
30.09.1994Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:SearchDE2722081  [ ] (ASEA KABEL AB);
 US4374227  [ ] (MICHIE JR WILLIAM J);
 DE2548371  [ ] (DAETWYLER AG);
 DE3034747  [ ] (KABEL METALLWERKE GHH [DE]);
 [L]GB1574796  (SUMITOMO ELECTRIC INDUSTRIES)
Examination   - Gächter, Kunststoff-Additive, 2 nd ed., 1983, p. 315-320, 333
    - Cabot Corporation,technical lefleat, 1986, p.4 and 24
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.