-
EP0312975
European procedure
Extract from the Register of European Patents
EP About this file: EP0312975
| EP0312975 - Semiconductor chip package [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 19.02.1999 Database last updated on 23.11.2024 | Most recent event Tooltip | 05.10.2005 | Change: Appeal number | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. Samsung Main Building 250-2-Ka, Taepyung-Ro Chung-Ku Seoul 100-742 / KR | [N/P] |
| Former [1998/16] | For all designated states SAMSUNG ELECTRONICS CO., LTD. Samsung Main Building, 250-2-Ka, Taepyung-Ro Chung-Ku, Seoul 100-742 / KR | ||
| Former [1996/06] | For all designated states SAMSUNG ELECTRONICS CO., LTD. Samsung Main Building, 250-2-Ka, Taepyung-Ro Chung-Ku, Seoul / KR | ||
| Former [1995/05] | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis Minnesota 55408 / US | ||
| Former [1989/17] | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis MN 55408 / US | Inventor(s) | 01 /
Spielberger, Richard K. 17814-83rd Avenue North Maple Grove Minnesota 55369 / US | 02 /
Dunaway, Thomas J. 2512 Highway 100 South Apt. 423 St. Louis Park Minnesota 55416 / US | [1989/17] | Representative(s) | Tunstall, Christopher Stephen, et al Harrison Goddard Foote Fountain Precinct Balm Green Sheffield S1 2JA / GB | [N/P] |
| Former [1996/06] | Tunstall, Christopher Stephen, et al Dibb Lupton Broomhead, 117 The Headrow Leeds, West Yorkshire LS1 5JX / GB | ||
| Former [1993/17] | Rentzsch, Heinz, Dipl.-Ing., et al Honeywell Holding AG Patent- und Lizenzabteilung Postfach 10 08 65 D-63008 Offenbach / DE | ||
| Former [1989/17] | Rentzsch, Heinz, Dipl.-Ing. Honeywell Holding AG Patent- und Lizenzabteilung Kaiserleistrasse 39 Postfach 10 08 65 D-63008 Offenbach / DE | Application number, filing date | 88117298.5 | 18.10.1988 | [1989/17] | Priority number, date | US19870112851 | 23.10.1987 Original published format: US 112851 | [1989/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0312975 | Date: | 26.04.1989 | Language: | EN | [1989/17] | Type: | A3 Search report | No.: | EP0312975 | Date: | 03.10.1990 | Language: | EN | [1990/40] | Type: | B1 Patent specification | No.: | EP0312975 | Date: | 15.04.1998 | Language: | EN | [1998/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.08.1990 | Classification | IPC: | H01L23/538, H01L23/50, H01L23/52 | [1990/41] | CPC: |
H01L23/498 (EP);
H01L23/52 (KR);
H01L23/50 (EP);
H01L23/5382 (EP);
H01L2924/0002 (EP);
H01L2924/15173 (EP);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP)
|
| Former IPC [1989/17] | H01L23/52, H01L23/50 | Designated contracting states | DE, FR, GB, IT, NL [1989/17] | Title | German: | Halbleiterchippackung | [1989/17] | English: | Semiconductor chip package | [1989/17] | French: | Empaquetage pour puce semi-conductrice | [1989/17] | Examination procedure | 12.03.1991 | Examination requested [1991/19] | 27.07.1992 | Despatch of a communication from the examining division (Time limit: M04) | 24.11.1992 | Reply to a communication from the examining division | 25.03.1993 | Despatch of a communication from the examining division (Time limit: M06) | 29.09.1993 | Reply to a communication from the examining division | 10.03.1994 | Despatch of communication that the application is refused, reason: substantive examination {1} | 08.07.1997 | Despatch of communication of intention to grant (Approval: Yes) | 24.07.1997 | Communication of intention to grant the patent | 03.11.1997 | Fee for grant paid | 03.11.1997 | Fee for publishing/printing paid | Appeal following examination | 28.04.1994 | Appeal received No. T0594/94 | 08.07.1994 | Statement of grounds filed | 17.10.1996 | Invitation to file observations in an appeal (Time limit: M06) [1996/42] | 24.03.1997 | Date of receipt of observations in an appeal [1997/13] | 22.04.1997 | Result of appeal procedure: remittal for grant | Opposition(s) | 16.01.1999 | No opposition filed within time limit [1999/14] | Fees paid | Renewal fee | 21.09.1990 | Renewal fee patent year 03 | 23.09.1991 | Renewal fee patent year 04 | 21.09.1992 | Renewal fee patent year 05 | 15.09.1993 | Renewal fee patent year 06 | 03.03.1995 | Renewal fee patent year 07 | 30.10.1995 | Renewal fee patent year 08 | 20.08.1996 | Renewal fee patent year 09 | 30.09.1997 | Renewal fee patent year 10 | Penalty fee | Additional fee for renewal fee | 31.10.1994 | 07 M06 Fee paid on 03.03.1995 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0171783 (HITACHI LTD [JP]); | [A]US4245273 (FEINBERG IRVING, et al) | [A] - SOLID STATE TECHNOLOGY, vol. 27, no. 1, January 1984, pages 119-122, Port Washington, New York, US; A.H. MONES et al.: "Interconnecting and packaging VLSI chips" |