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Extract from the Register of European Patents

EP About this file: EP0330749

EP0330749 - Semiconductor device [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.02.1992
Database last updated on 03.10.2024
Most recent event   Tooltip06.02.1992Application deemed to be withdrawnpublished on 25.03.1992 [1992/13]
Applicant(s)For all designated states
Kabushiki Kaisha Toshiba
72, Horikawa-cho, Saiwai-ku Kawasaki-shi
Kanagawa-ken 210-8572 / JP
[N/P]
Former [1989/36]For all designated states
KABUSHIKI KAISHA TOSHIBA
72, Horikawa-cho, Saiwai-ku
Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP
Inventor(s)01 / Ichikawa, Keiji
1454-4, Imajuku-Higashi-Cho Asahi-ku
Yokohama-shi Kanagawa-ken / JP
02 / Ohno, Jun-ichi
1-24-24, Nagata-Higashi Minami-ku
Yokohama-shi Kanagawa-ken / JP
[1989/36]
Representative(s)Lehn, Werner, et al
Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20
81904 München / DE
[N/P]
Former [1989/36]Lehn, Werner, Dipl.-Ing., et al
Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20
D-81904 München / DE
Application number, filing date88120623.909.12.1988
[1989/36]
Priority number, dateJP1987031367211.12.1987         Original published format: JP 31367287
[1989/36]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0330749
Date:06.09.1989
Language:EN
[1989/36]
Search report(s)(Supplementary) European search report - dispatched on:EP19.07.1989
ClassificationIPC:H01L23/50, H01L23/30
[1989/36]
CPC:
H01L24/85 (EP); H01L23/28 (KR); H01L23/16 (EP);
H01L23/49506 (EP); H01L23/4951 (EP); H01L24/48 (EP);
H01L2224/451 (EP); H01L2224/48091 (EP); H01L2224/48247 (EP);
H01L2224/48465 (EP); H01L2224/4899 (EP); H01L2224/49171 (EP);
H01L24/45 (EP); H01L24/49 (EP); H01L2924/00014 (EP);
H01L2924/01014 (EP); H01L2924/01015 (EP); H01L2924/01033 (EP);
H01L2924/01082 (EP); H01L2924/181 (EP) (-)
C-Set:
H01L2224/451, H01L2924/00015 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (EP);
H01L2224/49171, H01L2224/48465, H01L2924/00 (EP);
H01L2924/00014, H01L2224/05599 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/00014, H01L2224/78 (EP);
H01L2924/00014, H01L2224/85399 (EP);
H01L2924/181, H01L2924/00012 (EP)
(-)
Designated contracting statesDE,   FR,   GB,   IT [1989/36]
TitleGerman:Halbleiteranordnung[1989/36]
English:Semiconductor device[1989/36]
French:Dispositif semi-conducteur[1989/36]
File destroyed:12.06.1999
Examination procedure09.12.1988Examination requested  [1989/36]
14.05.1991Despatch of a communication from the examining division (Time limit: M04)
25.09.1991Application deemed to be withdrawn, date of legal effect  [1992/13]
25.10.1991Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1992/13]
Fees paidRenewal fee
11.12.1990Renewal fee patent year 03
09.12.1991Renewal fee patent year 04
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Documents cited:Search[Y]JP6084854  ;
 [Y]JP6060743  ;
 [A]JP5624958  ;
 [A]EP0078606  (TEXAS INSTRUMENTS INC [US])
 [Y]  - PATENT ABSTRACTS OF JAPAN, vol. 9, no. 230 (E-343)[1953], 17th September 1985; & JP-A-60 84 854 (TOSHIBA K.K.) 14-05-1985, & JP6084854 A 00000000
 [Y]  - PATENT ABSTRACTS OF JAPAN, vol. 9, no. 193 (E-334)[1916], 9th August 1985; & JP-A-60 60 743 (MATSUSHITA DENSHI KOGYO K.K.) 08-04-1985, & JP6060743 A 00000000
 [A]  - PATENT ABSTRACTS OF JAPAN, vol. 5, no. 78 (E-58)[750], 22nd May 1981; & JP-A-56 24 958 (KIYUUSHIYUU NIPPON DENKI K.K.) 10-03-1981, & JP5624958 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.