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EP0285410
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EP About this file: EP0285410
| EP0285410 - Forming metal interconnects on uneven substrates [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.01.1992 Database last updated on 30.10.2024 | Most recent event Tooltip | 09.01.1992 | Application deemed to be withdrawn | published on 26.02.1992 [1992/09] | Applicant(s) | For all designated states FAIRCHILD SEMICONDUCTOR CORPORATION 10400 Ridgeview Court P.O. Box 1500 Cupertino, California 95014 / US | [N/P] |
| Former [1989/35] | For all designated states FAIRCHILD SEMICONDUCTOR CORPORATION 10400 Ridgeview Court P.O. Box 1500 Cupertino, California 95014 / US | ||
| Former [1988/40] | For all designated states FAIRCHILD SEMICONDUCTOR CORPORATION 10400 Ridgeview Court P.O. Box 1500 Cupertino California 95014 / US | Inventor(s) | 01 /
Kulkarni, Vivek D. 474 Hawthrone Avenue No.4 Sunnyvale, California 94086 / US | 02 /
Castel, Egil D. 10668C Maplewood Cupertino, California 95014 / US | [1988/40] | Representative(s) | Jones, Ian, et al W.P. Thompson & Co. Celcon House 289-293 High Holborn London WC1V 7HU / GB | [N/P] |
| Former [1988/40] | Jones, Ian, et al W.P. THOMPSON & CO. Celcon House 289-293 High Holborn London WC1V 7HU / GB | Application number, filing date | 88302872.2 | 30.03.1988 | [1988/40] | Priority number, date | US19870033961 | 01.04.1987 Original published format: US 33961 | [1988/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0285410 | Date: | 05.10.1988 | Language: | EN | [1988/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.07.1988 | Classification | IPC: | H01L21/90 | [1988/40] | CPC: |
H01L21/7684 (EP,US);
H01L21/302 (KR);
H01L21/76819 (EP,US)
| Designated contracting states | DE, FR, GB, IT, NL [1988/40] | Title | German: | Ausbildung von metallischen Verbindungen auf unebenen Substraten | [1988/40] | English: | Forming metal interconnects on uneven substrates | [1988/40] | French: | Formation de connexions métalliques sur des substrats inégaux | [1988/40] | File destroyed: | 12.06.1999 | Examination procedure | 25.10.1988 | Examination requested [1988/51] | 04.04.1991 | Despatch of a communication from the examining division (Time limit: M04) | 15.08.1991 | Application deemed to be withdrawn, date of legal effect [1992/09] | 12.09.1991 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1992/09] | Fees paid | Renewal fee | 04.01.1990 | Renewal fee patent year 03 | 20.12.1990 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0215542 (TOSHIBA KK [JP]) | [X] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 28, no. 2, July 1985, pages 827-828, New York US; "Method of adjusting conductive stud surfaces to the same level" | [A] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 24, no 4, September 1981, pages 2189-2191, New York US; T.M.REITH et al.: "Hybrid contact metal planarization process" |