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Extract from the Register of European Patents

EP About this file: EP0313452

EP0313452 - Process of depositing a refractory metal-silicide for integrated circuits manufacturing [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  23.07.1992
Database last updated on 28.05.2024
Most recent event   Tooltip04.07.2008Change - representativepublished on 06.08.2008  [2008/32]
Applicant(s)For all designated states
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
75, Quai d'Orsay
75321 Paris Cédex 07 / FR
[N/P]
Former [1989/17]For all designated states
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE
75, Quai d'Orsay
F-75321 Paris Cédex 07 / FR
Inventor(s)01 / Hirase, Ikuo
75, quai d'Orsay
F-75321 Paris cedex 07 / FR
02 / Rufin, Denis
75, quai d'Orsay
F-75321 Paris cedex 07 / FR
03 / Sumiya, Tooru
2500 Hagisono
Chigasaki 253 / JP
04 / Matsuura, Masamichi
2500 Hagisono
Chigasaki 253 / JP
05 / Schack, Michael
75, quai d'Orsay
F-75321 Paris cedex 07 / FR
06 / Ukishima, Sadayuki
2500 Hagisono
Chigasaki 253 / JP
[1989/17]
Representative(s)Vesin, Jacques, et al
L'Air Liquide S.A. Service Propriété Industrielle, 75 Quai d'Orsay
75321 Paris Cedex 07 / FR
[2008/32]
Former [1989/17]Vesin, Jacques, et al
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE 75, quai d'Orsay
F-75321 Paris Cédex 07 / FR
Application number, filing date88402620.418.10.1988
[1989/17]
Priority number, dateFR1987001438319.10.1987         Original published format: FR 8714383
[1989/17]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP0313452
Date:26.04.1989
Language:FR
[1989/17]
Type: B1 Patent specification 
No.:EP0313452
Date:18.09.1991
Language:FR
[1991/38]
Search report(s)(Supplementary) European search report - dispatched on:EP31.01.1989
ClassificationIPC:H01L21/285, C23C16/42
[1989/17]
CPC:
C23C16/42 (EP,US); H01L21/28 (KR); H01L21/28518 (EP,US);
H01L21/32053 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   IT,   LI,   NL,   SE [1989/17]
TitleGerman:Verfahren um hochschmelzendes Metallsilizid niederzuschlagen zur Herstellung von integrierten Schaltungen[1991/38]
English:Process of depositing a refractory metal-silicide for integrated circuits manufacturing[1989/17]
French:Procédé de dépot de siliciure de métal réfractaire pour la fabrication de circuits intégrés[1989/17]
Former [1989/17]Verfahren um feuerfestes Metallsilizid niederzuschlagen zur Herstellung von integrierten Schaltungen
Examination procedure26.10.1988Examination requested  [1989/17]
05.03.1991Despatch of communication of intention to grant (Approval: Yes)
25.03.1991Communication of intention to grant the patent
14.06.1991Fee for grant paid
14.06.1991Fee for publishing/printing paid
Opposition(s)20.06.1992No opposition filed within time limit [1992/37]
Fees paidRenewal fee
11.09.1990Renewal fee patent year 03
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT18.09.1991
[1992/29]
Documents cited:Search[A]EP0077535  (SIEMENS AG [DE]);
 [A]GB2148946  (ADVANCED SEMICONDUCTOR MAT);
 [A]EP0157052  (GENUS INC [US])
 [A]  - JOURNAL OF MATERIALS SCIENCE
Examination   - JOURNAL OF MATERIALS SCIENCE, vol. 22, no. 2, février 1987, pages 547-553, Londres, GB; S.MOTOJIMA et al.: "PREPARATION AND PROPERTIES OF NICKEL SILICIDE LAYERS BY THE DIFFUSION AND CVD processes using Si2C16 as a source of silicon".
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.