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EP0357606
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EP About this file: EP0357606
| EP0357606 - LOW STRESS HEAT SINKING FOR SEMICONDUCTORS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 22.01.1991 Database last updated on 24.07.2024 | Most recent event Tooltip | 22.01.1991 | Application deemed to be withdrawn | published on 13.03.1991 [1991/11] | Applicant(s) | For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US | [1990/11] | Inventor(s) | 01 /
GREENSTEIN, Bernard 2444 Saranac Lane Glenview, IL 60025 / US | [1990/11] | Representative(s) | Ibbotson, Harold, et al Motorola, European Intellectual Property, Midpoint, Alencon Link, Basingstoke Hampshire RG21 1PL / GB | [N/P] |
| Former [1990/11] | Ibbotson, Harold, et al Motorola European Intellectual Property Midpoint Alencon Link Basingstoke Hampshire RG 21 1PL / GB | Application number, filing date | 88901361.1 | 15.01.1988 | [1990/11] | WO1988US00074 | Priority number, date | US19870011670 | 06.02.1987 Original published format: US 11670 | [1990/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO8805706 | Date: | 11.08.1988 | Language: | EN | [1988/18] | Type: | A1 Application with search report | No.: | EP0357606 | Date: | 14.03.1990 | Language: | EN | The application published by WIPO in one of the EPO official languages on 11.08.1988 takes the place of the publication of the European patent application. | [1990/11] | Search report(s) | International search report - published on: | US | 11.08.1988 | (Supplementary) European search report - dispatched on: | EP | 05.06.1990 | Classification | IPC: | B23K31/02, B23K35/22, H01L23/48, H01L21/58 | [1990/33] | CPC: |
H01L24/83 (EP,US);
B23K31/02 (KR);
B23K1/19 (EP,US);
B23K35/002 (EP,US);
H01L23/3735 (EP,US);
H01L24/27 (EP,US);
H01L24/32 (EP,US);
B23K2035/008 (EP,US);
H01L2224/04026 (EP,US);
H01L2224/2908 (EP,US);
H01L2224/29084 (EP,US);
H01L2224/29111 (EP,US);
H01L2224/2918 (EP,US);
H01L2224/29184 (EP,US);
H01L2224/29186 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/8319 (EP,US);
H01L2224/83801 (EP,US);
H01L2224/8385 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/0132 (EP,US);
H01L2924/014 (EP,US);
H01L2924/07802 (EP,US);
| C-Set: |
H01L2224/29184, H01L2924/00014 (US,EP);
H01L2224/29186, H01L2924/05432 (US,EP);
H01L2224/2918, H01L2924/00014 (US,EP);
H01L2924/0132, H01L2924/01047, H01L2924/0105 (EP,US); |
| Former IPC [1990/11] | B23K31/02, B23K35/22 | Designated contracting states | DE, FR, GB [1990/11] | Title | German: | WÄRMEAUSLÖSUNG MIT NIEDRIGER SPANNUNG FÜR HALBLEITER | [1990/11] | English: | LOW STRESS HEAT SINKING FOR SEMICONDUCTORS | [1990/11] | French: | SYSTEME DE DISSIPATION THERMIQUE AVEC REDUCTION DES CONTRAINTES DESTINE A DES SEMI-CONDUCTEURS | [1990/11] | File destroyed: | 04.03.1999 | Entry into regional phase | 23.10.1989 | National basic fee paid | 23.10.1989 | Search fee paid | 23.10.1989 | Designation fee(s) paid | 23.10.1989 | Examination fee paid | Examination procedure | 16.06.1988 | Request for preliminary examination filed International Preliminary Examining Authority: DE | 23.10.1989 | Examination requested [1990/11] | 19.08.1990 | Application deemed to be withdrawn, date of legal effect [1991/11] | 26.09.1990 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1991/11] | Fees paid | Renewal fee | 29.01.1990 | Renewal fee patent year 03 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 19.10.1989 | DE M01 Fee paid on 23.10.1989 | 19.10.1989 | FR M01 Fee paid on 23.10.1989 | 19.10.1989 | GB M01 Fee paid on 23.10.1989 | Penalty fee Rule 85b EPC 1973 | 18.09.1989 | M01 Fee paid on 23.10.1989 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4039116 (CHAFFIN III JOHN H); | [A]US4358784 (WISLOCKY JOSEPH, et al) | International search | [A]US2662997 (HOWARD CHRISTENSEN); | [A]US2763822 (FROLA FRANK V, et al); | [A]US2922092 (GAZZARA CHARLES P, et al); | [A]US3010057 (ALBERT WILLIARD S); | [A]US3209218 (GOTTHOLD ZIELASEK, et al); | [A]US3248681 (REINTGEN ROBERT J); | [A]US3303432 (MARVIN GARFINKEL, et al); | [A]US3331995 (LARRISON JOHN E); | [A]US3339267 (BRONNES ROBERT L, et al); | [A]US3387191 (DENIS FISHMAN, et al); | [A]US3399332 (SAVOLAINEN UNTO U); | [A]US3600144 (CSAKVARY TIBOR); | [A]US3839727 (PETERSON G, et al); | [A]US4074342 (HONN JAMES JOSEPH, et al); | [A]US4224636 (YONEZAWA TOSHIO, et al); | [A]US4542401 (SEKIBA TOSHINOBU [JP]) |