EP0315655 - COPLANAR DIE TO A SILICON SUBSTRATE BOND METHOD [Right-click to bookmark this link] | |||
Former [1989/20] | COPLANAR DIE TO SUBSTRATE BOND METHOD | ||
[1994/30] | Status | No opposition filed within time limit Status updated on 01.06.1995 Database last updated on 13.07.2024 | Most recent event Tooltip | 01.06.1995 | No opposition filed within time limit | published on 19.07.1995 [1995/29] | Applicant(s) | For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US | [1989/20] | Inventor(s) | 01 /
REED, David, J. 2632 W. LaSenda Circle Mesa, AZ 85202 / US | 02 /
FAIRBANKS, Robert, K. 3955 E. Piccadilly 2 Phoenix, AZ 85018 / US | [1989/20] | Representative(s) | Ibbotson, Harold, et al Motorola, European Intellectual Property, Midpoint, Alencon Link, Basingstoke Hampshire RG21 1PL / GB | [N/P] |
Former [1989/20] | Ibbotson, Harold, et al Motorola European Intellectual Property Midpoint Alencon Link Basingstoke Hampshire RG 21 1PL / GB | Application number, filing date | 88903627.3 | 28.03.1988 | [1989/20] | WO1988US00954 | Priority number, date | US19870056497 | 01.06.1987 Original published format: US 56497 | [1989/20] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO8809724 | Date: | 15.12.1988 | Language: | EN | [1988/27] | Type: | A1 Application with search report | No.: | EP0315655 | Date: | 17.05.1989 | Language: | EN | The application published by WIPO in one of the EPO official languages on 15.12.1988 takes the place of the publication of the European patent application. | [1989/20] | Type: | B1 Patent specification | No.: | EP0315655 | Date: | 27.07.1994 | Language: | EN | [1994/30] | Search report(s) | International search report - published on: | US | 15.12.1988 | (Supplementary) European search report - dispatched on: | EP | 28.11.1990 | Classification | IPC: | H01L21/58 | [1994/30] | CPC: |
H01L24/83 (EP,US);
B32B37/00 (KR);
H01L24/26 (EP,US);
H01L2224/8319 (EP,US);
H01L2224/8385 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/07802 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/14 (EP,US);
Y10T29/53178 (EP,US)
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Former IPC [1989/20] | B32B31/04 | Designated contracting states | DE, FR, GB, IT [1989/20] | Title | German: | KOPLANARES VERBINDUNGSVERFAHREN ZWISCHEN EINEM HALBLEITERWÜRFEL UND EINEM SILICIUMSUBSTRAT | [1994/30] | English: | COPLANAR DIE TO A SILICON SUBSTRATE BOND METHOD | [1994/30] | French: | PROCEDE DE LIAISON COPLANAIRE ENTRE UNE PUCE ET UN SUBSTRAT EN SILICIUM | [1994/30] |
Former [1989/20] | KOPLANARES VERBINDUNGSVERFAHREN ZWISCHEN EINEM HALBLEITERWÜRFEL UND EINEM SUBSTRAT | ||
Former [1989/20] | COPLANAR DIE TO SUBSTRATE BOND METHOD | ||
Former [1989/20] | PROCEDE D'AMALGAME COPLANAIRE ENTRE DES DES ET UN SUBSTRAT | Entry into regional phase | 26.01.1989 | National basic fee paid | 26.01.1989 | Search fee paid | 26.01.1989 | Designation fee(s) paid | 26.01.1989 | Examination fee paid | Examination procedure | 26.01.1989 | Examination requested [1989/20] | 22.07.1992 | Despatch of a communication from the examining division (Time limit: M04) | 01.12.1992 | Reply to a communication from the examining division | 09.11.1993 | Despatch of communication of intention to grant (Approval: Yes) | 26.01.1994 | Communication of intention to grant the patent | 14.04.1994 | Fee for grant paid | 14.04.1994 | Fee for publishing/printing paid | Opposition(s) | 28.04.1995 | No opposition filed within time limit [1995/29] | Fees paid | Renewal fee | 22.02.1990 | Renewal fee patent year 03 | 25.01.1991 | Renewal fee patent year 04 | 31.01.1992 | Renewal fee patent year 05 | 28.01.1993 | Renewal fee patent year 06 | 27.01.1994 | Renewal fee patent year 07 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [A]US4300978 (WHITEMORE CHRISTOPHER E, et al); | [A]US4620216 (HORVATH JOSEPH L [US]); | [A]US4630096 (DRYE JAMES E [US], et al) |