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Extract from the Register of European Patents

EP About this file: EP0315655

EP0315655 - COPLANAR DIE TO A SILICON SUBSTRATE BOND METHOD [Right-click to bookmark this link]
Former [1989/20]COPLANAR DIE TO SUBSTRATE BOND METHOD
[1994/30]
StatusNo opposition filed within time limit
Status updated on  01.06.1995
Database last updated on 13.07.2024
Most recent event   Tooltip01.06.1995No opposition filed within time limitpublished on 19.07.1995 [1995/29]
Applicant(s)For all designated states
MOTOROLA, INC.
1303 East Algonquin Road
Schaumburg, IL 60196 / US
[1989/20]
Inventor(s)01 / REED, David, J.
2632 W. LaSenda Circle
Mesa, AZ 85202 / US
02 / FAIRBANKS, Robert, K.
3955 E. Piccadilly 2
Phoenix, AZ 85018 / US
[1989/20]
Representative(s)Ibbotson, Harold, et al
Motorola, European Intellectual Property, Midpoint, Alencon Link, Basingstoke
Hampshire RG21 1PL / GB
[N/P]
Former [1989/20]Ibbotson, Harold, et al
Motorola European Intellectual Property Midpoint Alencon Link
Basingstoke Hampshire RG 21 1PL / GB
Application number, filing date88903627.328.03.1988
[1989/20]
WO1988US00954
Priority number, dateUS1987005649701.06.1987         Original published format: US 56497
[1989/20]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO8809724
Date:15.12.1988
Language:EN
[1988/27]
Type: A1 Application with search report 
No.:EP0315655
Date:17.05.1989
Language:EN
The application published by WIPO in one of the EPO official languages on 15.12.1988 takes the place of the publication of the European patent application.
[1989/20]
Type: B1 Patent specification 
No.:EP0315655
Date:27.07.1994
Language:EN
[1994/30]
Search report(s)International search report - published on:US15.12.1988
(Supplementary) European search report - dispatched on:EP28.11.1990
ClassificationIPC:H01L21/58
[1994/30]
CPC:
H01L24/83 (EP,US); B32B37/00 (KR); H01L24/26 (EP,US);
H01L2224/8319 (EP,US); H01L2224/8385 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01014 (EP,US); H01L2924/01033 (EP,US);
H01L2924/07802 (EP,US); H01L2924/10253 (EP,US); H01L2924/14 (EP,US);
Y10T29/53178 (EP,US) (-)
Former IPC [1989/20]B32B31/04
Designated contracting statesDE,   FR,   GB,   IT [1989/20]
TitleGerman:KOPLANARES VERBINDUNGSVERFAHREN ZWISCHEN EINEM HALBLEITERWÜRFEL UND EINEM SILICIUMSUBSTRAT[1994/30]
English:COPLANAR DIE TO A SILICON SUBSTRATE BOND METHOD[1994/30]
French:PROCEDE DE LIAISON COPLANAIRE ENTRE UNE PUCE ET UN SUBSTRAT EN SILICIUM[1994/30]
Former [1989/20]KOPLANARES VERBINDUNGSVERFAHREN ZWISCHEN EINEM HALBLEITERWÜRFEL UND EINEM SUBSTRAT
Former [1989/20]COPLANAR DIE TO SUBSTRATE BOND METHOD
Former [1989/20]PROCEDE D'AMALGAME COPLANAIRE ENTRE DES DES ET UN SUBSTRAT
Entry into regional phase26.01.1989National basic fee paid 
26.01.1989Search fee paid 
26.01.1989Designation fee(s) paid 
26.01.1989Examination fee paid 
Examination procedure26.01.1989Examination requested  [1989/20]
22.07.1992Despatch of a communication from the examining division (Time limit: M04)
01.12.1992Reply to a communication from the examining division
09.11.1993Despatch of communication of intention to grant (Approval: Yes)
26.01.1994Communication of intention to grant the patent
14.04.1994Fee for grant paid
14.04.1994Fee for publishing/printing paid
Opposition(s)28.04.1995No opposition filed within time limit [1995/29]
Fees paidRenewal fee
22.02.1990Renewal fee patent year 03
25.01.1991Renewal fee patent year 04
31.01.1992Renewal fee patent year 05
28.01.1993Renewal fee patent year 06
27.01.1994Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[A]US4300978  (WHITEMORE CHRISTOPHER E, et al);
 [A]US4620216  (HORVATH JOSEPH L [US]);
 [A]US4630096  (DRYE JAMES E [US], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.