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EP0340649
European procedure
Extract from the Register of European Patents
EP About this file: EP0340649
| EP0340649 - Method of formulating and operating an electroless plating bath solution for forming copper deposits which are essentially free of fissures [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 04.12.1993 Database last updated on 11.04.2026 | Most recent event Tooltip | 04.12.1993 | No opposition filed within time limit | published on 26.01.1994 [1994/04] | Applicant(s) | For all designated states AMP-Akzo Corporation (a Delaware corp.) 710 Dawson Drive Newark Delaware 197113 / US | [N/P] |
| Former [1992/06] | For all designated states AMP-AKZO CORPORATION (a Delaware corp.) 710 Dawson Drive Newark, Delaware 197113 / US | ||
| Former [1991/49] | For all designated states AMP-Akzo Corporation (a Delaware corp.) 322 South Service Road Melville, NY 11747 / US | ||
| Former [1989/45] | For all designated states KOLLMORGEN CORPORATION 10 Mill Pond Lane Simsbury, CT 06070 / US | Inventor(s) | 01 /
Hughes, Rowan 22800 Rockside Road Appt. 406 bedford, OH 44146 / UA | 02 /
Paunovic, Milan 78 Shadyside Avenue Port Washington NY 11050 / US | 03 /
Zeblisky, Rudolph J. 41 Glenwood Drive Hauppauge, NY 11787 / US | [1989/45] | Representative(s) | Königseder, geb. Egerer, Claudia Kreuzbichl 1 82491 Grainau / DE | [N/P] |
| Former [1993/45] | Königseder-Egerer, Claudia D. Kreuzbichl 1 D-82491 Grainau / DE | ||
| Former [1991/49] | Königseder-Egerer, Claudia D. Kreuzbichl 1 D-82491 Grainau / DE | ||
| Former [1989/45] | Königseder, geb. Egerer, Claudia (DE) Kreuzbichl 1 D-82491 Grainau / DE | Application number, filing date | 89107716.6 | 28.04.1989 | [1989/45] | Priority number, date | US19880187822 | 29.04.1988 Original published format: US 187822 | [1989/45] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0340649 | Date: | 08.11.1989 | Language: | EN | [1989/45] | Type: | B1 Patent specification | No.: | EP0340649 | Date: | 03.02.1993 | Language: | EN | [1993/05] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.09.1989 | Classification | IPC: | C23C18/16, C23C18/40 | [1989/45] | CPC: |
C23C18/38 (KR);
C23C18/40 (EP)
| Designated contracting states | FR, GB, NL [1993/01] |
| Former [1989/45] | DE, FR, GB, NL | Title | German: | Verfahren zur Formulierung und zum Betrieb eines stromlosen Plattierungsbades zur Abscheidung von im wesentlichen rissfreien Kupferschichten | [1989/45] | English: | Method of formulating and operating an electroless plating bath solution for forming copper deposits which are essentially free of fissures | [1989/45] | French: | Procédé et bain pour effectuer un dépôt chimique de cuivre exempt de fissures | [1989/45] | Examination procedure | 24.04.1990 | Examination requested [1990/26] | 15.03.1991 | Despatch of a communication from the examining division (Time limit: M04) | 03.07.1991 | Reply to a communication from the examining division | 06.11.1991 | Despatch of a communication from the examining division (Time limit: M04) | 04.02.1992 | Reply to a communication from the examining division | 27.05.1992 | Despatch of communication of intention to grant (Approval: No) | 20.07.1992 | Despatch of communication of intention to grant (Approval: later approval) | 03.08.1992 | Communication of intention to grant the patent | 25.09.1992 | Fee for grant paid | 25.09.1992 | Fee for publishing/printing paid | Opposition(s) | 04.11.1993 | No opposition filed within time limit [1994/04] | Fees paid | Renewal fee | 23.04.1991 | Renewal fee patent year 03 | 23.04.1992 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A] JOURNAL OF ELECTROCHEMICAL STY, vol. 127, no. 2, February 1980, pages 365-369, Princeton, US; M. PAUNOVIC: "An electrochemical control system for electroless copper bath" | Examination | Journal of Electrochemical Society, Vol 104, No.1, pages 56-63 |