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Extract from the Register of European Patents

EP About this file: EP0351569

EP0351569 - Apparatus for electroplating platelike articles, particularly circuit boards [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.06.1994
Database last updated on 15.08.2024
Most recent event   Tooltip17.02.2006Change - lapse in a contracting state
Updated state(s): FR
published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
Siemens Nixdorf Informationssysteme Aktiengesellschaft
Fürstenallee 7
33102 Paderborn / DE
[N/P]
Former [1994/01]For all designated states
Siemens Nixdorf Informationssysteme Aktiengesellschaft
Fürstenallee 7
D-33102 Paderborn / DE
Former [1991/36]For all designated states
Siemens Nixdorf Informationssysteme AG
Fürstenallee 7
D-33102 Paderborn / DE
Former [1990/04]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
D-80333 München / DE
Inventor(s)01 / Hosten, Daniel
Staatsbaan 147
B-8120 Handzame / BE
[1990/04]
Representative(s)Fuchs, Franz-Josef, et al
Postfach 22 13 17
80503 München / DE
[N/P]
Former [1993/34]Fuchs, Franz-Josef, Dr.-Ing., et al
Postfach 22 13 17
D-80503 München / DE
Application number, filing date89111253.420.06.1989
[1990/04]
Priority number, dateDE1988382307107.07.1988         Original published format: DE 3823071
[1990/04]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0351569
Date:24.01.1990
Language:DE
[1990/04]
Type: B1 Patent specification 
No.:EP0351569
Date:25.08.1993
Language:DE
[1993/34]
Search report(s)(Supplementary) European search report - dispatched on:EP04.12.1989
ClassificationIPC:C25D17/00
[1990/04]
CPC:
H05K3/241 (EP,US); C25D17/00 (EP,US); C25D17/005 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   FR,   GB,   LI,   NL [1990/04]
TitleGerman:Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten[1990/04]
English:Apparatus for electroplating platelike articles, particularly circuit boards[1990/04]
French:Dispositif pour l'électroplacage des articles en forme de plaques en particulier des plaques de circuits[1990/04]
Examination procedure26.02.1990Examination requested  [1990/17]
06.03.1992Despatch of a communication from the examining division (Time limit: M04)
26.06.1992Reply to a communication from the examining division
18.01.1993Despatch of communication of intention to grant (Approval: Yes)
03.02.1993Communication of intention to grant the patent
22.04.1993Fee for grant paid
22.04.1993Fee for publishing/printing paid
Opposition(s)26.05.1994No opposition filed within time limit [1994/33]
Fees paidRenewal fee
20.12.1990Renewal fee patent year 03
25.06.1992Renewal fee patent year 04
18.06.1993Renewal fee patent year 05
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Lapses during opposition  TooltipBE25.08.1993
FR25.08.1993
GB25.08.1993
NL25.08.1993
[2006/14]
Former [1994/45]BE25.08.1993
GB25.08.1993
NL25.08.1993
FR14.01.1994
Former [1994/41]BE25.08.1993
GB25.08.1993
NL25.08.1993
Former [1994/25]BE25.08.1993
NL25.08.1993
Former [1994/25]NL25.08.1993
Documents cited:Search[A]DE3703549  (SCHERING AG [DE]);
 [AD]EP0254030  (SCHERING AG [DE]);
 [AD]EP0254962
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.