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EP0361195
European procedure
Extract from the Register of European Patents
EP About this file: EP0361195
| EP0361195 - Printed circuit board with moulded substrate [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 20.01.1994 Database last updated on 03.06.2024 | Most recent event Tooltip | 30.11.2007 | Lapse of the patent in a contracting state New state(s): FR | published on 02.01.2008 [2008/01] | Applicant(s) | For all designated states SIEMENS AKTIENGESELLSCHAFT Werner-von-Siemens-Str. 1 DE-80333 München / DE | [N/P] |
| Former [1990/14] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 D-80333 München / DE | Inventor(s) | 01 /
Heerman, Marcel Azaleastraat 6 B-9220 Merelbeke / BE | [1993/11] |
| Former [1990/14] | 01 /
Heerman, Marcel Azaleastraat 6 B-9220 Merlbeke / BE | Application number, filing date | 89116804.9 | 11.09.1989 | [1990/14] | Priority number, date | DE19883833297 | 30.09.1988 Original published format: DE 3833297 | [1990/14] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP0361195 | Date: | 04.04.1990 | Language: | DE | [1990/14] | Type: | A3 Search report | No.: | EP0361195 | Date: | 22.08.1990 | Language: | DE | [1990/34] | Type: | B1 Patent specification | No.: | EP0361195 | Date: | 17.03.1993 | Language: | DE | [1993/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.07.1990 | Classification | IPC: | H05K3/10, H05K3/42 | [1990/14] | CPC: |
H05K1/116 (EP,US);
H05K1/00 (US);
H05K3/107 (EP,US);
H05K2201/0376 (EP,US);
H05K2201/09036 (EP,US);
H05K2201/09118 (EP,US);
H05K2201/09827 (EP,US);
H05K2201/09845 (EP,US);
H05K2201/09981 (EP,US);
H05K2203/0574 (EP,US);
H05K2203/1415 (EP,US);
H05K3/184 (EP,US);
H05K3/3452 (EP,US);
H05K3/426 (EP,US);
Y10T29/4916 (EP,US);
Y10T29/49165 (EP,US)
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| Designated contracting states | DE, FR, GB, IT [1990/14] | Title | German: | Leiterplatte mit einem spritzgegossenen Substrat | [1990/14] | English: | Printed circuit board with moulded substrate | [1990/14] | French: | Plaque à circuit imprimé avec substrat moulé | [1990/14] | File destroyed: | 20.04.2002 | Examination procedure | 04.09.1990 | Examination requested [1990/44] | 24.07.1992 | Despatch of communication of intention to grant (Approval: Yes) | 01.09.1992 | Communication of intention to grant the patent | 15.09.1992 | Fee for grant paid | 15.09.1992 | Fee for publishing/printing paid | Opposition(s) | 18.12.1993 | No opposition filed within time limit [1994/10] | Fees paid | Renewal fee | 20.12.1990 | Renewal fee patent year 03 | 15.09.1992 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 17.03.1993 | IT | 17.03.1993 | GB | 11.09.1993 | [2002/24] |
| Former [1999/42] | IT | 17.03.1993 | |
| GB | 11.09.1993 | ||
| Former [1994/49] | GB | 11.09.1993 | Documents cited: | Search | [A]DE3010610 (SCHOELLER & CO ELEKTRONIK [DE]); | [A]EP0051378 (AMP INC [US]); | [AD]US4532152 (ELARDE VITO D [US]) |