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Extract from the Register of European Patents

EP About this file: EP0368256

EP0368256 - Serial printer and a method of assembling the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.07.1996
Database last updated on 22.08.2024
Most recent event   Tooltip19.07.1996No opposition filed within time limitpublished on 04.09.1996 [1996/36]
Applicant(s)For all designated states
Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
[N/P]
Former [1990/20]For all designated states
Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
Inventor(s)01 / Mizutani, Minoru Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
02 / Watanabe, Shyoichi Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
03 / Saito, Toshiaki Tohoku Oki Electric Co., Ltd.
1 Tate Sasakino Fukushima-shi
Fukushima-ken / JP
[1990/20]
Representative(s)Betten & Resch
Patent- und Rechtsanwälte PartGmbB
Postfach 10 02 51
80076 München / DE
[N/P]
Former [1990/20]Betten & Resch
Reichenbachstrasse 19
D-80469 München / DE
Application number, filing date89120627.807.11.1989
[1990/20]
Priority number, dateJP19880144996U08.11.1988         Original published format: JP 14499688 U
[1990/20]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0368256
Date:16.05.1990
Language:EN
[1990/20]
Type: A3 Search report 
No.:EP0368256
Date:12.12.1990
Language:EN
[1990/50]
Type: B1 Patent specification 
No.:EP0368256
Date:13.09.1995
Language:EN
[1995/37]
Search report(s)(Supplementary) European search report - dispatched on:EP23.10.1990
ClassificationIPC:B41J29/02
[1990/20]
CPC:
B41J29/02 (EP,US)
Designated contracting statesDE,   FR,   GB [1990/20]
TitleGerman:Seriendrucker und Verfahren zu seinem Zusammenbau[1990/20]
English:Serial printer and a method of assembling the same[1990/20]
French:Imprimante en série et méthode pour son assemblage[1990/20]
Examination procedure04.04.1991Examination requested  [1991/23]
29.12.1992Despatch of a communication from the examining division (Time limit: M04)
28.04.1993Reply to a communication from the examining division
20.10.1993Despatch of a communication from the examining division (Time limit: M04)
18.02.1994Reply to a communication from the examining division
22.11.1994Despatch of communication of intention to grant (Approval: Yes)
08.03.1995Communication of intention to grant the patent
06.06.1995Fee for grant paid
06.06.1995Fee for publishing/printing paid
Opposition(s)14.06.1996No opposition filed within time limit [1996/36]
Fees paidRenewal fee
02.01.1991Renewal fee patent year 03
27.11.1992Renewal fee patent year 04
29.11.1993Renewal fee patent year 05
28.11.1994Renewal fee patent year 06
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Documents cited:Search[A]JP61206682  ;
 [A]JP61104878  ;
 [A]FR2251110  (CIT ALCATEL [FR]);
 [A]EP0271090  (CANON KK [JP])
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 18, no. 11, April 1976, NEW YORK US page 3588 WARD: "SOLDERLESS MODULE-TO-CIRCUIT CONNECTION"
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 11, no. 39 (M-559)(2486) 5 February 1987, & JP-A-61 206682 (ISOBE) 12 September 1986,, & JP61206682 A 19860912
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 10, no. 286 (M-521)(2342) 27 September 1986, & JP-A-61 104878 (MURAKAMI) 23 May 1986,, & JP61104878 A 19860523
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.