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EP0326218
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EP About this file: EP0326218
| EP0326218 - Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body [Right-click to bookmark this link] | Status | The application has been refused Status updated on 15.09.1994 Database last updated on 11.05.2024 | Most recent event Tooltip | 05.10.2005 | Change: Appeal number | Applicant(s) | For all designated states Koninklijke Philips Electronics N.V. Groenewoudseweg 1 5621 BA Eindhoven / NL | [N/P] |
| Former [1989/31] | For all designated states Philips Electronics N.V. Groenewoudseweg 1 NL-5621 BA Eindhoven / NL | Inventor(s) | 01 /
Wolters, Robertus Adrianus Maria c/o INT. OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | 02 /
Jonkers, Alexander Gijsbertus Mathias c/o INT. OCTROOIBUREAU B.V. Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | [1989/31] | Representative(s) | Rensen, Jan Geert, et al INTERNATIONAAL OCTROOIBUREAU B.V., Prof. Holstlaan 6 5656 AA Eindhoven / NL | [N/P] |
| Former [1989/31] | Rensen, Jan Geert, et al INTERNATIONAAL OCTROOIBUREAU B.V., Prof. Holstlaan 6 NL-5656 AA Eindhoven / NL | Application number, filing date | 89200134.8 | 24.01.1989 | [1989/31] | Priority number, date | NL19880000220 | 29.01.1988 Original published format: NL 8800220 | [1989/31] | Filing language | NL | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0326218 | Date: | 02.08.1989 | Language: | EN | [1989/31] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.06.1989 | Classification | IPC: | H01L21/90, H01L21/285, H01L21/31 | [1989/31] | CPC: |
H01L23/3157 (EP,US);
H01L21/28 (KR);
H01L21/28518 (EP,US);
H01L21/76895 (EP,US);
H01L2924/0002 (EP,US);
Y10S148/015 (EP,US);
Y10S438/902 (EP,US)
(-)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB, IT, NL [1989/31] | Title | German: | Verfahren zum Herstellen einer Halbleiteranordnung, wobei auf einer Oberfläche eines Halbleiterkörpers eine Metalleiterbahn angebracht wird | [1989/31] | English: | Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body | [1989/31] | French: | Procédé de fabrication d'un dispositif semi-conducteur suivant lequel une piste conductrice métallique est formée sur une surface d'un corps semi-conducteur | [1989/31] | Examination procedure | 31.01.1990 | Examination requested [1990/13] | 08.07.1991 | Despatch of a communication from the examining division (Time limit: M04) | 09.11.1991 | Reply to a communication from the examining division | 06.04.1992 | Despatch of communication that the application is refused, reason: substantive examination [1994/44] | 15.09.1994 | Application refused, date of legal effect [1994/44] | Appeal following examination | 11.06.1992 | Appeal received No. T0798/92 | 07.08.1992 | Statement of grounds filed | 28.07.1994 | Result of appeal procedure: appeal of the applicant was rejected | 28.07.1994 | Date of oral proceedings | 16.08.1994 | Minutes of oral proceedings despatched | Fees paid | Renewal fee | 29.01.1991 | Renewal fee patent year 03 | 28.01.1992 | Renewal fee patent year 04 | 27.01.1993 | Renewal fee patent year 05 | 26.01.1994 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US4067099 (ITO SATORU, et al); | [Y]US4106051 (DORMER LESLIE, et al); | [A]DE3414781 (MITSUBISHI ELECTRIC CORP [JP]) | [A] - IEEE ELECTRON DEVICE LETTERS, vol. EDL-7, no. 11, November 1986, pages 623-624, IEEE, New York, US; H.-H. TSENG et al.: "A new oxidation-resistant self-aligned TiSi2 process" | [A] - SOLID STATE TECHNOLOGY, vol. 29, no. 2, February 1986, pages 131-136, Port Washington, NY, US; R.A.M. WOLTERS et al.: "Properties of reactive sputtered TiW" |