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Extract from the Register of European Patents

EP About this file: EP0367311

EP0367311 - Method for mounting an electronic component and memory card using same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  11.06.1994
Database last updated on 19.10.2024
Most recent event   Tooltip11.06.1994No opposition filed within time limitpublished on 03.08.1994 [1994/31]
Applicant(s)For:CH  DE  ES  FR  GB  IT  LI  NL  SE  AT 
Alcatel N.V.
Strawinskylaan 341, (World Trade Center)
NL-1077 XX Amsterdam / NL
For:BE 
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap
Francis Wellesplein 1
B-2018 Antwerp / BE
[N/P]
Former [1990/19]For:CH  DE  ES  FR  GB  IT  LI  NL  SE  AT 
ALCATEL N.V.
Strawinskylaan 341, (World Trade Center)
NL-1077 XX Amsterdam / NL
For:BE 
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap
Francis Wellesplein 1
B-2018 Antwerp / BE
Inventor(s)01 / Bouquet, Jan Paul
Ardooiesteenweg 158
B-8800 Roeselare / BE
[1990/19]
Representative(s)Vermeersch, Robert, et al
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1
B-2018 Antwerpen / BE
[N/P]
Former [1990/19]Vermeersch, Robert, et al
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1
B-2018 Antwerpen / BE
Application number, filing date89202342.516.09.1989
[1990/19]
Priority number, dateBE1988000110327.09.1988         Original published format: BE 8801103
[1990/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0367311
Date:09.05.1990
Language:EN
[1990/19]
Type: B1 Patent specification 
No.:EP0367311
Date:11.08.1993
Language:EN
[1993/32]
Search report(s)(Supplementary) European search report - dispatched on:EP19.03.1990
ClassificationIPC:G06K19/06
[1990/19]
CPC:
H01L24/81 (EP,US); G06K19/07745 (EP,US); H01L2224/81801 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US); H01L2924/0105 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01075 (EP,US); H01L2924/01079 (EP,US); H01L2924/014 (EP,US);
H01L2924/14 (EP,US); H01L2924/30105 (EP,US); H05K1/182 (EP,US);
H05K3/06 (EP,US); H05K3/328 (EP,US); Y10T29/49144 (EP,US) (-)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   IT,   LI,   NL,   SE [1990/19]
TitleGerman:Verfahren zum Montieren eines elektronischen Bausteins und diesen verwendende Speicherkarte[1990/19]
English:Method for mounting an electronic component and memory card using same[1990/19]
French:Procédé de montage d'un composant électronique et carte à mémoire en faisant usage[1990/19]
Examination procedure29.10.1990Examination requested  [1990/52]
26.01.1993Despatch of communication of intention to grant (Approval: Yes)
16.02.1993Communication of intention to grant the patent
30.04.1993Fee for grant paid
30.04.1993Fee for publishing/printing paid
Opposition(s)12.05.1994No opposition filed within time limit [1994/31]
Fees paidRenewal fee
21.09.1991Renewal fee patent year 03
21.09.1992Renewal fee patent year 04
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Documents cited:SearchEP0207853  [ ] (BULL SA [FR]);
 EP0207852  [ ] (BULL SA [FR]);
 EP0246744  [ ] (TOSHIBA KK [JP]);
 FR2601477  [ ] (BULL CP8 [FR])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.