EP0367311 - Method for mounting an electronic component and memory card using same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.06.1994 Database last updated on 19.10.2024 | Most recent event Tooltip | 11.06.1994 | No opposition filed within time limit | published on 03.08.1994 [1994/31] | Applicant(s) | For:CH
DE
ES
FR
GB
IT
LI
NL
SE
AT
Alcatel N.V. Strawinskylaan 341, (World Trade Center) NL-1077 XX Amsterdam / NL | For:BE
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Francis Wellesplein 1 B-2018 Antwerp / BE | [N/P] |
Former [1990/19] | For:CH
DE
ES
FR
GB
IT
LI
NL
SE
AT
ALCATEL N.V. Strawinskylaan 341, (World Trade Center) NL-1077 XX Amsterdam / NL | ||
For:BE
BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Francis Wellesplein 1 B-2018 Antwerp / BE | Inventor(s) | 01 /
Bouquet, Jan Paul Ardooiesteenweg 158 B-8800 Roeselare / BE | [1990/19] | Representative(s) | Vermeersch, Robert, et al BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1 B-2018 Antwerpen / BE | [N/P] |
Former [1990/19] | Vermeersch, Robert, et al BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Patent Department Francis Wellesplein 1 B-2018 Antwerpen / BE | Application number, filing date | 89202342.5 | 16.09.1989 | [1990/19] | Priority number, date | BE19880001103 | 27.09.1988 Original published format: BE 8801103 | [1990/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0367311 | Date: | 09.05.1990 | Language: | EN | [1990/19] | Type: | B1 Patent specification | No.: | EP0367311 | Date: | 11.08.1993 | Language: | EN | [1993/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.03.1990 | Classification | IPC: | G06K19/06 | [1990/19] | CPC: |
H01L24/81 (EP,US);
G06K19/07745 (EP,US);
H01L2224/81801 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/014 (EP,US);
H01L2924/14 (EP,US);
H01L2924/30105 (EP,US);
H05K1/182 (EP,US);
| Designated contracting states | AT, BE, CH, DE, ES, FR, GB, IT, LI, NL, SE [1990/19] | Title | German: | Verfahren zum Montieren eines elektronischen Bausteins und diesen verwendende Speicherkarte | [1990/19] | English: | Method for mounting an electronic component and memory card using same | [1990/19] | French: | Procédé de montage d'un composant électronique et carte à mémoire en faisant usage | [1990/19] | Examination procedure | 29.10.1990 | Examination requested [1990/52] | 26.01.1993 | Despatch of communication of intention to grant (Approval: Yes) | 16.02.1993 | Communication of intention to grant the patent | 30.04.1993 | Fee for grant paid | 30.04.1993 | Fee for publishing/printing paid | Opposition(s) | 12.05.1994 | No opposition filed within time limit [1994/31] | Fees paid | Renewal fee | 21.09.1991 | Renewal fee patent year 03 | 21.09.1992 | Renewal fee patent year 04 |
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