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EP0377464
European procedure
Extract from the Register of European Patents
EP About this file: EP0377464
| EP0377464 - Wafer processing system [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 06.02.1998 Database last updated on 26.07.2024 | Most recent event Tooltip | 28.06.2002 | Lapse of the patent in a contracting state | published on 14.08.2002 [2002/33] | Applicant(s) | For all designated states GENERAL SIGNAL CORPORATION PO Box 10010 High Ridge Park Stamford Connecticut 06904 / US | [N/P] |
| Former [1990/28] | For all designated states GENERAL SIGNAL CORPORATION PO Box 10010 High Ridge Park Stamford Connecticut 06904 / US | Inventor(s) | 01 /
Vowles, John E. RFD No 1. Box 922 Deering New Hampshire 03244 / US | 02 /
Maher, Joseph A. 3 Virginia Place Wenham Massachusetts 01984 / US | 03 /
Napoli, Joseph D. 11 Grandview Road Windham New Hampshire 03087 / US | [1990/28] | Representative(s) | Baillie, Iain Cameron, et al Ladas & Parry, Dachauerstrasse 37 80335 München / DE | [N/P] |
| Former [1990/28] | Baillie, Iain Cameron, et al c/o Ladas & Parry Altheimer Eck 2 D-80331 München / DE | Application number, filing date | 90100164.4 | 04.01.1990 | [1990/28] | Priority number, date | US19890294278 | 06.01.1989 Original published format: US 294278 | [1990/28] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0377464 | Date: | 11.07.1990 | Language: | EN | [1990/28] | Type: | A3 Search report | No.: | EP0377464 | Date: | 10.07.1991 | Language: | EN | [1991/28] | Type: | B1 Patent specification | No.: | EP0377464 | Date: | 02.04.1997 | Language: | EN | [1997/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.05.1991 | Classification | IPC: | H01L21/00 | [1990/28] | CPC: |
H01L21/67184 (EP,US);
H01L21/6719 (EP,US);
H01L21/67196 (EP,US);
H01L21/67775 (EP,US);
Y10S414/139 (EP,US)
| Designated contracting states | CH, DE, FR, GB, LI, NL [1990/28] | Title | German: | Plättchenbehandlungssystem | [1990/28] | English: | Wafer processing system | [1990/28] | French: | Système de traitement de plaquettes | [1990/28] | Examination procedure | 10.01.1992 | Examination requested [1992/11] | 19.03.1993 | Despatch of a communication from the examining division (Time limit: M08) | 29.09.1993 | Reply to a communication from the examining division | 02.02.1994 | Despatch of a communication from the examining division (Time limit: M06) | 05.08.1994 | Reply to a communication from the examining division | 29.08.1994 | Despatch of a communication from the examining division (Time limit: M06) | 19.01.1995 | Reply to a communication from the examining division | 19.03.1996 | Despatch of communication of intention to grant (Approval: Yes) | 16.07.1996 | Communication of intention to grant the patent | 16.10.1996 | Fee for grant paid | 16.10.1996 | Fee for publishing/printing paid | Opposition(s) | 03.01.1998 | No opposition filed within time limit [1998/13] | Fees paid | Renewal fee | 16.12.1991 | Renewal fee patent year 03 | 05.01.1993 | Renewal fee patent year 04 | 29.12.1993 | Renewal fee patent year 05 | 28.12.1994 | Renewal fee patent year 06 | 09.01.1996 | Renewal fee patent year 07 | 17.01.1997 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 02.04.1997 | [2002/33] | Documents cited: | Search | [A]EP0272141 (APPLIED MATERIALS INC [US]); | [A]US4657618 (SPENCER JOHN E [US], et al); | [AD]US4715921 (MAHER JOSEPH A [US], et al) | Examination | WO8704414 |