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Extract from the Register of European Patents

EP About this file: EP0398366

EP0398366 - Semiconductor processing apparatus and method [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  22.07.1995
Database last updated on 11.09.2024
Most recent event   Tooltip30.11.2007Lapse of the patent in a contracting state
Updated state(s): FR
published on 02.01.2008  [2008/01]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
M/S 2061
Santa Clara, California 95054-3299 / US
[N/P]
Former [1990/47]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue
Santa Clara California 95054-3299 / US
Inventor(s)01 / Severns, David W.
1168 Tangerine Way
Sunnyvale, California 94087 / US
02 / Tompson, Brian
4710 Del Loma Court
Campell, California 95008 / US
03 / Lindstrom, Paul R.
120 Hawks Peak Road
Aptos, California 95003 / US
04 / Carlson, David K.
2308 Dundee Drive
Santa Clara, California 95051 / US
[1990/47]
Representative(s)Diehl, Hermann O. Th., et al
Diehl & Partner GbR
Postfach 34 01 15
80098 München / DE
[N/P]
Former [1990/47]Diehl, Hermann O. Th., Dr., et al
Diehl, Glaeser, Hiltl & Partner Patentanwälte Postfach 19 03 65
D-80603 München / DE
Application number, filing date90109478.918.05.1990
[1990/47]
Priority number, dateUS1989035416119.05.1989         Original published format: US 354161
[1990/47]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0398366
Date:22.11.1990
Language:EN
[1990/47]
Type: A3 Search report 
No.:EP0398366
Date:12.06.1991
Language:EN
[1991/24]
Type: B1 Patent specification 
No.:EP0398366
Date:21.09.1994
Language:EN
[1994/38]
Search report(s)(Supplementary) European search report - dispatched on:EP22.04.1991
ClassificationIPC:C23C16/44, H01L21/00
[1991/22]
CPC:
H01L21/68764 (EP,US); C23C16/54 (EP,KR,US); C23C16/4401 (EP,US);
C30B25/02 (EP,US); C30B35/005 (EP,US); H01L21/68707 (EP,US);
H01L21/68771 (EP,US) (-)
Former IPC [1990/47]H01L21/00
Designated contracting statesBE,   DE,   ES,   FR,   GB,   IT,   NL [1990/47]
TitleGerman:Halbleiterbehandlungsvorrichtung und Verfahren[1990/47]
English:Semiconductor processing apparatus and method[1990/47]
French:Appareil de manipulation de semi-conducteur et méthode[1990/47]
Examination procedure02.08.1991Examination requested  [1991/40]
12.10.1992Despatch of a communication from the examining division (Time limit: M06)
06.04.1993Reply to a communication from the examining division
27.10.1993Despatch of communication of intention to grant (Approval: No)
03.01.1994Despatch of communication of intention to grant (Approval: later approval)
15.03.1994Communication of intention to grant the patent
10.06.1994Fee for grant paid
10.06.1994Fee for publishing/printing paid
Opposition(s)22.06.1995No opposition filed within time limit [1995/37]
Fees paidRenewal fee
27.03.1992Renewal fee patent year 03
28.05.1993Renewal fee patent year 04
30.05.1994Renewal fee patent year 05
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Lapses during opposition  TooltipBE21.09.1994
ES21.09.1994
FR21.09.1994
IT21.09.1994
NL21.09.1994
[2006/14]
Former [2002/24]BE21.09.1994
ES21.09.1994
IT21.09.1994
NL21.09.1994
FR17.02.1995
Former [1999/42]BE21.09.1994
IT21.09.1994
NL21.09.1994
FR17.02.1995
Former [1995/35]BE21.09.1994
NL21.09.1994
FR17.02.1995
Former [1995/34]BE21.09.1994
FR17.02.1995
Former [1995/27]BE21.09.1994
Documents cited:Search[X]FR2590879  (AMERICAN TELEPHONE & TELEGRAPH [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.