-
EP0402966
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP0402966
| EP0402966 - Method for treating copper circuit pattern of interlayer circuit board [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 07.12.1993 Database last updated on 30.10.2024 | Most recent event Tooltip | 07.12.1993 | Application deemed to be withdrawn | published on 26.01.1994 [1994/04] | Applicant(s) | For all designated states MATSUSHITA ELECTRIC WORKS, LTD. 1048, Oaza-Kadoma Kadoma-shi, Osaka 571 / JP | [N/P] |
| Former [1990/51] | For all designated states MATSUSHITA ELECTRIC WORKS, LTD. 1048, Oaza-Kadoma Kadoma-shi Osaka 571 / JP | Inventor(s) | 01 /
Awano, Tomio, c/o Matsushita Electric Works, Ltd. 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | 02 /
Akamatsu, Motoyuki, c/o Matsushita Electric Works Ltd., 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | 03 /
Yamane, Tomoaki, c/o Matsushita Electric Works Ltd., 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | 04 /
Ichiki, Tsutomu, c/o Matsushita Electric Works Ltd., 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | 05 /
Funo, Hideo, c/o Matsushita Electric Works Ltd., 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | 06 /
Sagara, Takashi, c/o Matsushita Electric Works Ltd., 1048, Oaza-Kadoma, Kadoma-shi Osaka 571 / JP | [1990/51] | Representative(s) | Kupecz, Arpad, et al Octrooibureau Los en Stigter B.V. P.O. Box 20052 1000 HB Amsterdam / NL | [N/P] |
| Former [1990/51] | Kupecz, Arpad, et al Octrooibureau Los en Stigter B.V. Postbox 20052 NL-1000 HB Amsterdam / NL | Application number, filing date | 90201118.8 | 03.05.1990 | [1990/51] | Priority number, date | JP19890152702 | 15.06.1989 Original published format: JP 15270289 | [1990/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0402966 | Date: | 19.12.1990 | Language: | EN | [1990/51] | Type: | A3 Search report | No.: | EP0402966 | Date: | 10.04.1991 | Language: | EN | [1991/15] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.02.1991 | Classification | IPC: | H05K3/46, H05K3/38 | [1990/51] | CPC: |
H05K3/385 (EP);
H05K3/46 (KR);
H05K2203/0315 (EP);
H05K2203/1157 (EP);
H05K3/4611 (EP)
| Designated contracting states | DE, GB, IT [1990/51] | Title | German: | Verfahren zur Behandlung eines Kupferschaltungsmusters einer inneren Leiterplatte | [1990/51] | English: | Method for treating copper circuit pattern of interlayer circuit board | [1990/51] | French: | Procédé de traitement du circuit en cuivre d'une plaquette de circuit interne | [1990/51] | File destroyed: | 12.06.1999 | Examination procedure | 30.11.1990 | Examination requested [1991/04] | 17.03.1993 | Despatch of a communication from the examining division (Time limit: M04) | 28.07.1993 | Application deemed to be withdrawn, date of legal effect [1994/04] | 26.08.1993 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1994/04] | Fees paid | Renewal fee | 01.06.1992 | Renewal fee patent year 03 | 01.06.1993 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4795512 (NAKATANI SEIICHI [JP], et al); | [AD]EP0189913 (HITACHI LTD [JP]); | [A]US4328048 (SENDA ATSUO, et al); | [AP]EP0321067 (HITACHI CHEMICAL CO LTD [JP]) |