EP0384644 - Printed circuit board [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 08.03.1996 Database last updated on 15.07.2024 | Most recent event Tooltip | 08.03.1996 | No opposition filed within time limit | published on 24.04.1996 [1996/17] | Applicant(s) | For all designated states TATSUTA ELECTRIC WIRE & CABLE CO., LTD. 2-3-1 Iwata-cho Higashiosaka-shi Osaka-fu / JP | [N/P] |
Former [1990/35] | For all designated states TATSUTA ELECTRIC WIRE & CABLE CO., LTD. 2-3-1 Iwata-cho Higashiosaka-shi, Osaka-fu / JP | Inventor(s) | 01 /
Nakatani, Fumio 109-24, Miyado-cho Yamatokoriyama-shi, Nara-ken / JP | 02 /
Wakita, Shinichi 3-1-304, Chaenba-cho Akashi-shi, Hyogo-ken / JP | 03 /
Murakami, Hisatoshi 8-9, 1-chome, Nishiiwata Higashiosaka-shi, Osaka-fu / JP | 04 /
Terada, Tsunehiko Midorigaoka danchi 32-204, 4, 2-chome, Midorigaoka Ikeda-shi, Osaka-fu / JP | 05 /
Morimoto, Shohei, Hishiyahigashi-Ryo, Tatsuta Elec Wire & Cable Co.Ltd. 12-25,1-chome, Hishiyahigashi Higashiosaka-shi, Osaka-fu / JP | [1990/35] | Representative(s) | Beresford, Keith Denis Lewis, et al Beresford Crump LLP 16 High Holborn London WC1V 6BX / GB | [N/P] |
Former [1990/35] | Beresford, Keith Denis Lewis, et al BERESFORD & Co. 2-5 Warwick Court High Holborn London WC1R 5DJ / GB | Application number, filing date | 90301612.9 | 15.02.1990 | [1990/35] | Priority number, date | JP19890019218U | 21.02.1989 Original published format: JP 1921889 U | JP19890019219U | 21.02.1989 Original published format: JP 1921989 U | JP19890019220U | 21.02.1989 Original published format: JP 1922089 U | JP19890040836 | 21.02.1989 Original published format: JP 4083689 | JP19890040837 | 21.02.1989 Original published format: JP 4083789 | JP19890040838 | 21.02.1989 Original published format: JP 4083889 | [1990/35] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0384644 | Date: | 29.08.1990 | Language: | EN | [1990/35] | Type: | B1 Patent specification | No.: | EP0384644 | Date: | 03.05.1995 | Language: | EN | [1995/18] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.07.1990 | Classification | IPC: | H05K1/02, H05K1/16, H05K9/00 | [1990/35] | CPC: |
H05K1/0216 (EP,US);
H05K1/0218 (EP,US);
H05K1/162 (EP,US);
H05K9/0039 (EP,US);
H05K1/095 (EP,US);
H05K1/117 (EP,US);
H05K2201/0715 (EP,US);
H05K2201/09236 (EP,US);
H05K2201/09272 (EP,US);
H05K2201/09672 (EP,US);
H05K2201/10689 (EP,US);
H05K3/3447 (EP,US);
| Designated contracting states | DE, FR, GB, IT, SE [1990/35] | Title | German: | Gedruckte Leiterplatte | [1990/35] | English: | Printed circuit board | [1990/35] | French: | Plaque de circuit imprimé | [1990/35] | Miscellaneous | EPB 1995/18: Teilanmeldung 94202845.7 eingereicht am 15/02/90 | EPB 1995/18: Divisional application 94202845.7 filed on 15/02/90 | EPB 1995/18: Demande divisionnaire 94202845.7 déposée le 15/02/90 | Examination procedure | 17.12.1990 | Examination requested [1991/07] | 27.08.1992 | Despatch of a communication from the examining division (Time limit: M06) | 05.03.1993 | Reply to a communication from the examining division | 22.06.1993 | Despatch of a communication from the examining division (Time limit: M06) | 23.12.1993 | Reply to a communication from the examining division | 14.06.1994 | Despatch of communication of intention to grant (Approval: No) | 25.10.1994 | Despatch of communication of intention to grant (Approval: later approval) | 26.10.1994 | Communication of intention to grant the patent | 10.01.1995 | Fee for grant paid | 10.01.1995 | Fee for publishing/printing paid | Divisional application(s) | EP94202845.7 / EP0633715 | EP94202846.5 / EP0631460 | Opposition(s) | 06.02.1996 | No opposition filed within time limit [1996/17] | Fees paid | Renewal fee | 16.12.1991 | Renewal fee patent year 03 | 21.12.1992 | Renewal fee patent year 04 | 23.02.1994 | Renewal fee patent year 05 | 17.02.1995 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0238267 (NINTENDO CO LTD [JP], et al); | [A]DE1936899 (SIEMENS AG); | [A]EP0259785 (GEN ELECTRIC [US]); | [A]FR2527039 (INF MILIT SPATIALE AERONAUT [FR]) | [A] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 30, no. 4, September 1987, page 1558, Armonk, New York, US: "Method to form an electromagnetic shield on a component-populated electronic circuit board" |