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Extract from the Register of European Patents

EP About this file: EP0400780

EP0400780 - Microlithographic method for producing thick, vertically-walled photoresist patterns [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  07.09.1994
Database last updated on 07.10.2024
Most recent event   Tooltip07.09.1994Application deemed to be withdrawnpublished on 26.10.1994 [1994/43]
Applicant(s)For all designated states
DIGITAL EQUIPMENT CORPORATION
111 Powdermill Road Maynard
Massachusetts 01754-1418 / US
[N/P]
Former [1990/49]For all designated states
DIGITAL EQUIPMENT CORPORATION
111 Powdermill Road
Maynard Massachusetts 01754-1418 / US
Inventor(s)01 / Sidman, Alan Lee
29 Leewood Road
Wellesley, Massachusetts 02181 / US
02 / Fung, Susan Kit
381 Lake Avenue
Worcester, Massachusetts 01604 / US
[1990/49]
Representative(s)Goodman, Christopher, et al
Eric Potter Clarkson, Park View House, 58 The Ropewalk
Nottingham NG1 5DD / GB
[N/P]
Former [1990/49]Goodman, Christopher, et al
Eric Potter & Clarkson St. Mary's Court St. Mary's Gate
Nottingham NG1 1LE / GB
Application number, filing date90302628.413.03.1990
[1990/49]
Priority number, dateUS1989036052202.06.1989         Original published format: US 360522
[1990/49]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0400780
Date:05.12.1990
Language:EN
[1990/49]
Search report(s)(Supplementary) European search report - dispatched on:EP10.09.1990
ClassificationIPC:H01L21/027, G03F7/00, G03B41/00
[1990/49]
CPC:
G11B5/3163 (EP,US); G03F7/091 (EP,US); H01F41/34 (EP,US);
H01L21/0274 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1990/49]
TitleGerman:Mikrolithographisches Verfahren für die Herstellung dicker Fororesistmuster mit vertikalen Wänden[1990/49]
English:Microlithographic method for producing thick, vertically-walled photoresist patterns[1990/49]
French:Méthode microlithographique pour produire des motifs en photorésist épais et à parois verticales[1990/49]
File destroyed:03.03.2001
Examination procedure23.03.1990Examination requested  [1990/49]
20.10.1993Despatch of a communication from the examining division (Time limit: M06)
03.05.1994Application deemed to be withdrawn, date of legal effect  [1994/43]
01.06.1994Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1994/43]
Fees paidRenewal fee
25.02.1992Renewal fee patent year 03
26.02.1993Renewal fee patent year 04
24.02.1994Renewal fee patent year 05
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Documents cited:Search[X]  - IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
 [Y]  - MICROELECTRONIC ENGINEERING
 [X]  - IEEE ELECTRON DEVICE LETTERS
 [Y]  - NTIS TECHNICAL NOTES
 [X]  - JOURNAL OF IMAGING SCIENCE
 [A]  - PATENT ABSTRACTS OF JAPAN
 [A]  - LASER & OPTOELEKTRONIK
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