EP0405947 - Method of manufacturing thick-film devices [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 29.11.1993 Database last updated on 26.06.2024 | Most recent event Tooltip | 29.11.1993 | Withdrawal of application | published on 19.01.1994 [1994/03] | Applicant(s) | For all designated states DIGITAL EQUIPMENT CORPORATION 146 Main Street Maynard Massachusetts 01754-1499 / US | [N/P] |
Former [1991/01] | For all designated states DIGITAL EQUIPMENT CORPORATION 146 Main Street Maynard, Massachusetts 01754-1499 / US | Inventor(s) | 01 /
Kellerman, David 162 Hartwell Avenue Littleton, Massachusetts 01460 / US | [1991/01] | Representative(s) | Maggs, Michael Norman, et al Kilburn & Strode LLP 20 Red Lion Street London WC1R 4PJ / GB | [N/P] |
Former [1991/01] | Maggs, Michael Norman, et al Kilburn & Strode 30 John Street London WC1N 2DD / GB | Application number, filing date | 90307037.3 | 27.06.1990 | [1991/01] | Priority number, date | US19890372059 | 27.06.1989 Original published format: US 372059 | [1991/01] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0405947 | Date: | 02.01.1991 | Language: | EN | [1991/01] | Type: | A3 Search report | No.: | EP0405947 | Date: | 21.08.1991 | Language: | EN | [1991/34] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.07.1991 | Classification | IPC: | H01L21/48 | [1991/01] | CPC: |
H05K3/4664 (EP,US);
H01L21/481 (EP,US);
H01L21/4857 (EP,US);
H01L23/49894 (EP,US);
H01L23/642 (EP,US);
H01L2924/0002 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LI, LU, NL, SE [1991/01] | Title | German: | Verfahren zum Herstellen von Dickschicht-Anordnungen | [1991/01] | English: | Method of manufacturing thick-film devices | [1991/01] | French: | Procédé pour la fabrication de dispositif à film épais | [1991/01] | File destroyed: | 12.06.1999 | Examination procedure | 04.07.1990 | Examination requested [1991/01] | 24.11.1993 | Application withdrawn by applicant [1994/03] | Fees paid | Renewal fee | 09.06.1992 | Renewal fee patent year 03 | 14.06.1993 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP59111345 ; | [A]EP0234896 (DIGITAL EQUIPMENT CORP [US]) | [A] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 22, no. 5, October 1979, NEW YORK US page 1799 F.W.HAINING ET AL.: "Low dielectric constant material for printed circuit boards" | [A] - PATENT ABSTRACTS OF JAPAN vol. 8, no. 229 (E-273)(1666) 20 October 1984, & JP-A-59 111345 (FUJITSU K.K.) 27 June 1984,, & JP59111345 A 19840627 |