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Extract from the Register of European Patents

EP About this file: EP0405947

EP0405947 - Method of manufacturing thick-film devices [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  29.11.1993
Database last updated on 26.06.2024
Most recent event   Tooltip29.11.1993Withdrawal of applicationpublished on 19.01.1994 [1994/03]
Applicant(s)For all designated states
DIGITAL EQUIPMENT CORPORATION
146 Main Street Maynard
Massachusetts 01754-1499 / US
[N/P]
Former [1991/01]For all designated states
DIGITAL EQUIPMENT CORPORATION
146 Main Street
Maynard, Massachusetts 01754-1499 / US
Inventor(s)01 / Kellerman, David
162 Hartwell Avenue
Littleton, Massachusetts 01460 / US
[1991/01]
Representative(s)Maggs, Michael Norman, et al
Kilburn & Strode LLP
20 Red Lion Street
London WC1R 4PJ / GB
[N/P]
Former [1991/01]Maggs, Michael Norman, et al
Kilburn & Strode 30 John Street
London WC1N 2DD / GB
Application number, filing date90307037.327.06.1990
[1991/01]
Priority number, dateUS1989037205927.06.1989         Original published format: US 372059
[1991/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0405947
Date:02.01.1991
Language:EN
[1991/01]
Type: A3 Search report 
No.:EP0405947
Date:21.08.1991
Language:EN
[1991/34]
Search report(s)(Supplementary) European search report - dispatched on:EP04.07.1991
ClassificationIPC:H01L21/48
[1991/01]
CPC:
H05K3/4664 (EP,US); H01L21/481 (EP,US); H01L21/4857 (EP,US);
H01L23/49894 (EP,US); H01L23/642 (EP,US); H01L2924/0002 (EP,US);
H01L2924/09701 (EP,US); Y10S264/06 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1991/01]
TitleGerman:Verfahren zum Herstellen von Dickschicht-Anordnungen[1991/01]
English:Method of manufacturing thick-film devices[1991/01]
French:Procédé pour la fabrication de dispositif à film épais[1991/01]
File destroyed:12.06.1999
Examination procedure04.07.1990Examination requested  [1991/01]
24.11.1993Application withdrawn by applicant  [1994/03]
Fees paidRenewal fee
09.06.1992Renewal fee patent year 03
14.06.1993Renewal fee patent year 04
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Documents cited:Search[A]JP59111345  ;
 [A]EP0234896  (DIGITAL EQUIPMENT CORP [US])
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 22, no. 5, October 1979, NEW YORK US page 1799 F.W.HAINING ET AL.: "Low dielectric constant material for printed circuit boards"
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 8, no. 229 (E-273)(1666) 20 October 1984, & JP-A-59 111345 (FUJITSU K.K.) 27 June 1984,, & JP59111345 A 19840627
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.