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EP0428383
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EP About this file: EP0428383
| EP0428383 - Process for surface treatment of copper and copper alloy [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 06.12.1996 Database last updated on 02.09.2024 | Most recent event Tooltip | 13.06.2008 | Change - representative | published on 16.07.2008 [2008/29] | Applicant(s) | For all designated states SHIKOKU CHEMICALS CORPORATION 147-1-Minato-machi Marugame-shi Kagawa-ken / JP | [1991/21] | Inventor(s) | 01 /
Kinoshita, Masashi 18-38, Doi-cho 2-chome Marugame-shi, Kagawa-ken / JP | 02 /
Murai, Takayuki 498, Ooaza Higashi-shirakata Tadotsu-cho, Nakatado-gun, Kagawa-ken / JP | 03 /
Yoshioka, Takashi 8-15, Kitahirayama-cho 2-chome Marugame-shi, Kagawa-ken / JP | [1991/21] | Representative(s) | Cresswell, Thomas Anthony, et al J.A. Kemp & Co. 14 South Square Gray's Inn London WC1R 5JJ / GB | [N/P] |
| Former [2008/29] | Cresswell, Thomas Anthony, et al J.A. KEMP & CO. 14 South Square Gray's Inn London WC1R 5JJ / GB | ||
| Former [1991/21] | Cresswell, Thomas Anthony, et al J.A. Kemp & Co. 14 South Square Gray's Inn London WC1R 5LX / GB | Application number, filing date | 90312379.2 | 13.11.1990 | [1991/21] | Priority number, date | JP19890295253 | 13.11.1989 Original published format: JP 29525389 | JP19900180239 | 07.07.1990 Original published format: JP 18023990 | JP19900212285 | 10.08.1990 Original published format: JP 21228590 | [1991/21] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0428383 | Date: | 22.05.1991 | Language: | EN | [1991/21] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.03.1991 | Classification | IPC: | C23F11/14, C23F11/10 | [1991/21] | CPC: |
C23F11/10 (EP,US);
B23K35/3615 (EP,US);
C23F11/149 (EP,US);
H05K3/282 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1991/21] | Title | German: | Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen | [1991/21] | English: | Process for surface treatment of copper and copper alloy | [1991/21] | French: | Procédé pour le traitement de surface de cuivre ou d'alliage de cuivre | [1991/21] | File destroyed: | 20.04.2002 | Examination procedure | 21.05.1991 | Examination requested [1991/29] | 09.06.1993 | Despatch of a communication from the examining division (Time limit: M20) | 22.03.1995 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time | 29.05.1995 | Reply to a communication from the examining division | 16.10.1995 | Despatch of a communication from the examining division (Time limit: M01) | 09.11.1995 | Reply to a communication from the examining division | 29.11.1996 | Application withdrawn by applicant [1997/04] | Request for further processing for: | 29.05.1995 | Request for further processing filed | 29.05.1995 | Full payment received (date of receipt of payment) Request granted | 14.06.1995 | Decision despatched | Fees paid | Renewal fee | 16.10.1992 | Renewal fee patent year 03 | 08.11.1993 | Renewal fee patent year 04 | 15.11.1994 | Renewal fee patent year 05 | 09.11.1995 | Renewal fee patent year 06 | 11.11.1996 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP52103338 ; | [Y]FR2298543 (CIBA GEIGY AG [CH]); | [Y]US3933531 (SAWA NATSUO, et al); | [A]US4235838 (OUTLAW BENJAMIN T [US], et al); | [A]GB2104107 (WESTERN ELECTRIC CO [US]) | [A] - DERWENT JAPANESE PATENTS REPORT, vol. 6, section Chemistry, 21st November 1977, no. 73214 Y/41 (M-12), Derwent Publications Ltd, London, GB; & JP-A-52 103 338 (KORYU KOGYO K.K.) 30-08-1977, & JP52103338 A 00000000 | [A] - METAL FINISHING, vol. 83, no. 1, January 1985, pages 35-38; M. BAKSZT: "Providing solderability retention by means of chemical inhibitors" |