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EP0469216
European procedure
Extract from the Register of European Patents
EP About this file: EP0469216
| EP0469216 - Method of forming metal contact pads and terminals on semiconductor chips [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.10.1995 Database last updated on 03.09.2024 | Most recent event Tooltip | 30.11.2007 | Lapse of the patent in a contracting state | published on 02.01.2008 [2008/01] | Applicant(s) | For:DE
GB
IT
International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | For:FR
Compagnie IBM FRANCE 5 Place Vendôme F-75000 Paris 1er / FR | [N/P] |
| Former [1992/06] | For:DE
GB
IT
International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | ||
| For:FR
Compagnie IBM FRANCE 5 Place Vendôme F-75000 Paris 1er / FR | Inventor(s) | 01 /
Lochon, Henri 15, Allée du Colonel Koch F-91250 Saintry-Sur-Seine / FR | 02 /
Robert, Georges 1, rue de la Ferme, Baulne F-91510 La Ferte-Alais / FR | [1992/06] | Representative(s) | Klein, Daniel Jacques Henri Compagnie IBM France Département de Propriété Intellectuelle 06610 La Gaude / FR | [N/P] |
| Former [1992/06] | Klein, Daniel Jacques Henri Compagnie IBM France Département de Propriété Intellectuelle F-06610 La Gaude / FR | Application number, filing date | 90480110.7 | 31.07.1990 | [1992/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0469216 | Date: | 05.02.1992 | Language: | EN | [1992/06] | Type: | B1 Patent specification | No.: | EP0469216 | Date: | 07.12.1994 | Language: | EN | [1994/49] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.04.1991 | Classification | IPC: | H01L21/60, H01L23/485 | [1992/06] | CPC: |
H01L24/11 (EP,US);
H01L23/53209 (EP,US);
H01L24/03 (EP);
H01L24/05 (EP);
H01L24/13 (EP,US);
H01L2224/023 (EP);
H01L2224/05124 (EP,US);
H01L2224/05147 (EP,US);
H01L2224/05171 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/1147 (EP,US);
H01L2224/11472 (EP,US);
H01L2224/11902 (EP,US);
H01L2224/13023 (EP,US);
H01L2224/13099 (EP,US);
H01L2224/131 (EP,US);
H01L2224/13116 (EP,US);
H01L2924/0001 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01011 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01018 (EP,US);
H01L2924/01019 (EP,US);
H01L2924/01024 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01058 (EP,US);
H01L2924/01059 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/014 (EP,US);
| C-Set: |
H01L2224/023, H01L2924/0001 (EP);
H01L2224/05124, H01L2924/00014 (EP,US);
H01L2224/05147, H01L2924/00014 (EP,US);
H01L2224/05171, H01L2924/00014 (EP,US);
H01L2224/05644, H01L2924/00014 (EP,US);
H01L2224/13116, H01L2924/0105, H01L2924/00014 (US,EP);
H01L2224/131, H01L2924/014 (US,EP);
H01L2924/0001, H01L2224/13099 (US,EP); | Designated contracting states | DE, FR, GB, IT [1992/06] | Title | German: | Verfahren zur Bildung metallischer Kontaktflächen und Anschlüsse auf Halbleiterchips | [1992/06] | English: | Method of forming metal contact pads and terminals on semiconductor chips | [1992/06] | French: | Procédé pour former des terminaux et des plages de contact métalliques sur des chips semi-conducteurs | [1992/06] | Examination procedure | 21.05.1992 | Examination requested [1992/30] | 11.03.1994 | Despatch of communication of intention to grant (Approval: Yes) | 10.06.1994 | Communication of intention to grant the patent | 28.06.1994 | Fee for grant paid | 28.06.1994 | Fee for publishing/printing paid | Opposition(s) | 08.09.1995 | No opposition filed within time limit [1995/48] | Fees paid | Renewal fee | 25.07.1992 | Renewal fee patent year 03 | 16.07.1993 | Renewal fee patent year 04 | 18.07.1994 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IT | 07.12.1994 | [2008/01] |
| Former [1999/42] | IT | 07.12.1994 | Documents cited: | Search | [A]US4293637 (HATADA KENZO, et al); | [AD]EP0061593 (IBM [US]); | [A]US4410622 (DALAL HORMAZDYZR D [US], et al) | [A] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 25, no. 11A, April 1983, NEW YORK US pages 5725 - 5726; S.BOYAR ET AL.: "Sub-etch ball limiting metallurgy technology" |