-
EP0401341
European procedure
Extract from the Register of European Patents
EP About this file: EP0401341
| EP0401341 - LOW TEMPERATURE COFIRED CERAMIC PACKAGES FOR MICROWAVE AND MILLIMETER WAVE GALLIUM ARSENIDE INTEGRATED CIRCUITS [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.09.1994 Database last updated on 12.07.2024 | Most recent event Tooltip | 03.09.1994 | No opposition filed within time limit | published on 26.10.1994 [1994/43] | Applicant(s) | For all designated states Hughes Aircraft Company 7200 Hughes Terrace P.O. Box 45066 Los Angeles, California 90045-0066 / US | [N/P] |
| Former [1992/27] | For all designated states Hughes Aircraft Company 7200 Hughes Terrace P.O. Box 45066 Los Angeles, California 90045-0066 / US | ||
| Former [1990/50] | For all designated states HUGHES AIRCRAFT COMPANY P.O. Box 80028 Los Angeles, CA 90080-0028 / US | Inventor(s) | 01 /
POLINSKI, Paul, W., Sr. 32872 Danapoplar Dana Point, CA 92629 / US | [1990/50] | Representative(s) | Winter, Brandl - Partnerschaft mbB Alois-Steinecker-Straße 22 85354 Freising / DE | [N/P] |
| Former [1990/50] | KUHNEN, WACKER & PARTNER Alois-Steinecker-Strasse 22 D-85354 Freising / DE | Application number, filing date | 90900581.1 | 13.11.1989 | [1990/50] | WO1989US05026 | Priority number, date | US19880289862 | 27.12.1988 Original published format: US 289862 | [1990/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO9007793 | Date: | 12.07.1990 | Language: | EN | [1990/16] | Type: | A1 Application with search report | No.: | EP0401341 | Date: | 12.12.1990 | Language: | EN | The application published by WIPO in one of the EPO official languages on 12.07.1990 takes the place of the publication of the European patent application. | [1990/50] | Type: | B1 Patent specification | No.: | EP0401341 | Date: | 03.11.1993 | Language: | EN | [1993/44] | Search report(s) | International search report - published on: | EP | 12.07.1990 | Classification | IPC: | H01L23/66, H01L25/16 | [1990/50] | CPC: |
H01L23/66 (EP,US);
H01P3/08 (EP,US);
H05K1/183 (EP,US);
H01L2924/0002 (EP,US);
H01L2924/09701 (EP,US);
H01L2924/3011 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB, SE [1990/50] | Title | German: | BEI NIEDRIGER TEMPERATUR ZUSAMMENGEBRANNTE KERAMISCHE PACKUNGEN FÜR INTEGRIERTE MIKROWELLEN- UND MILLIMETERWELLEN-GALLIUMARSENID-SCHALTUNGEN | [1990/50] | English: | LOW TEMPERATURE COFIRED CERAMIC PACKAGES FOR MICROWAVE AND MILLIMETER WAVE GALLIUM ARSENIDE INTEGRATED CIRCUITS | [1990/50] | French: | BOITIERS CERAMIQUES A CO-CUISSON A FAIBLE TEMPERATURE POUR CIRCUITS INTEGRES A L'ARSENIURE DE GALLIUM POUR MICRO-ONDES ET ONDES MILLIMETRIQUES | [1990/50] | Entry into regional phase | 21.07.1990 | National basic fee paid | 21.07.1990 | Designation fee(s) paid | 18.12.1990 | Examination fee paid | Examination procedure | 18.12.1990 | Examination requested [1991/07] | 09.01.1992 | Despatch of a communication from the examining division (Time limit: M04) | 19.05.1992 | Reply to a communication from the examining division | 05.06.1992 | Despatch of a communication from the examining division (Time limit: M02) | 11.08.1992 | Reply to a communication from the examining division | 29.12.1992 | Despatch of communication of intention to grant (Approval: Yes) | 03.05.1993 | Communication of intention to grant the patent | 09.08.1993 | Fee for grant paid | 09.08.1993 | Fee for publishing/printing paid | Opposition(s) | 04.08.1994 | No opposition filed within time limit [1994/43] | Fees paid | Renewal fee | 11.10.1991 | Renewal fee patent year 03 | 19.10.1992 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | US4172261 [ ] (ANAZAWA SHINZO [JP], et al); | EP0015709 [ ] (FUJITSU LTD [JP]); | EP0198621 [ ] (FUJITSU LTD [JP]); | EP0209642 [ ] (HEWLETT PACKARD CO [US]); | EP0272188 [ ] (FAIRCHILD SEMICONDUCTOR [US]) |