EP0452777 - Wafer heating and monitoring system and method of operation [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.01.1997 Database last updated on 14.06.2024 | Most recent event Tooltip | 03.01.1997 | No opposition filed within time limit | published on 19.02.1997 [1997/08] | Applicant(s) | For all designated states Applied Materials, Inc. P.O. Box 58039 M/S 0934 3050 Bowers Avenue Santa Clara, California 95052-8039 / US | [N/P] |
Former [1997/06] | For all designated states APPLIED MATERIALS, INC. P.O. Box 58039, M/S 0934, 3050 Bowers Avenue Santa Clara, California 95052-8039 / US | ||
Former [1991/43] | For all designated states APPLIED MATERIALS INC. PO Box 58039 Santa Clara California 95052 / US | Inventor(s) | 01 /
Nulman, Jaim 4155-G El Camino Way Palo Alto, California 94306 / US | 02 /
Maydan, Dan 12000 Murietta Lane Los Altos Hills, California 94022 / US | [1991/43] | Representative(s) | Kahler, Kurt Patentanwälte Kahler, Käck, Fiener Vorderer Anger 239 86899 Landsberg/Lech / DE | [N/P] |
Former [1991/43] | Kahler, Kurt, Dipl.-Ing. Patentanwälte Kahler, Käck, Fiener & Sturm P.O. Box 12 49 D-87712 Mindelheim / DE | Application number, filing date | 91105627.3 | 09.04.1991 | [1991/43] | Priority number, date | US19900510710 | 19.04.1990 Original published format: US 510710 | [1991/43] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0452777 | Date: | 23.10.1991 | Language: | EN | [1991/43] | Type: | A3 Search report | No.: | EP0452777 | Date: | 09.09.1992 | Language: | EN | [1992/37] | Type: | B1 Patent specification | No.: | EP0452777 | Date: | 28.02.1996 | [1996/09] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.07.1992 | Classification | IPC: | H01L21/00 | [1991/43] | CPC: |
H01L21/67115 (EP);
H01L21/67248 (EP);
H01L22/00 (KR)
| Designated contracting states | BE, DE, ES, FR, GB, IT, NL [1991/43] | Title | German: | Heizungs- und Überwachungssystem für eine Halbleiterscheibe und Wirkungsweise | [1991/43] | English: | Wafer heating and monitoring system and method of operation | [1991/43] | French: | Système de chauffe et de surveillance d'une plaquette et méthode d'utilisation | [1991/43] | Examination procedure | 09.03.1993 | Examination requested [1993/19] | 09.06.1994 | Despatch of a communication from the examining division (Time limit: M06) | 19.12.1994 | Reply to a communication from the examining division | 10.02.1995 | Despatch of communication of intention to grant (Approval: Yes) | 30.08.1995 | Communication of intention to grant the patent | 30.11.1995 | Fee for grant paid | 30.11.1995 | Fee for publishing/printing paid | Opposition(s) | 29.11.1996 | No opposition filed within time limit [1997/08] | Fees paid | Renewal fee | 30.04.1993 | Renewal fee patent year 03 | 29.04.1994 | Renewal fee patent year 04 | 28.04.1995 | Renewal fee patent year 05 |
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