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Extract from the Register of European Patents

EP About this file: EP0458180

EP0458180 - Process and device for laser beam cutting [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  26.07.1996
Database last updated on 06.07.2024
Most recent event   Tooltip17.02.2006Change - lapse in a contracting state
Updated state(s): FR
published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
Linde AG
Abraham-Lincoln-Strasse 21
65189 Wiesbaden / DE
[N/P]
Former [1991/48]For all designated states
Linde Aktiengesellschaft
Abraham-Lincoln-Strasse 21
D-65189 Wiesbaden / DE
Inventor(s)01 / Mair, Hermann, Dipl.-Ing.
Mangfallstrasse 9
W-8000 München 90 / DE
02 / Herrmann, Johann
Fastlinger Ring 115
W-8044 Unterschleissheim / DE
[1991/48]
Representative(s)Schaefer, Gerhard
Linde Aktiengesellschaft Zentrale Patentabteilung
82049 Höllriegelskreuth / DE
[N/P]
Former [1991/48]Schaefer, Gerhard, Dr.
Linde Aktiengesellschaft Zentrale Patentabteilung
D-82049 Höllriegelskreuth / DE
Application number, filing date91107865.715.05.1991
[1991/48]
Priority number, dateDE1990401619919.05.1990         Original published format: DE 4016199
[1991/48]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP0458180
Date:27.11.1991
Language:DE
[1991/48]
Type: A3 Search report 
No.:EP0458180
Date:22.09.1993
Language:DE
[1993/38]
Type: B1 Patent specification 
No.:EP0458180
Date:20.09.1995
Language:DE
[1995/38]
Search report(s)(Supplementary) European search report - dispatched on:EP03.08.1993
ClassificationIPC:B23K26/14, B23K26/06
[1991/48]
CPC:
B23K26/14 (EP); B23K26/06 (EP); B23K26/0604 (EP);
B23K26/064 (EP); B23K26/1462 (EP); B23K26/364 (EP)
Designated contracting statesAT,   CH,   DE,   FR,   LI,   NL [1991/48]
TitleGerman:Verfahren und Vorrichtung zum Laserstrahlschneiden[1991/48]
English:Process and device for laser beam cutting[1991/48]
French:Procédé et dispositif pour couper par rayon laser[1991/48]
Examination procedure16.06.1993Request for accelerated examination filed
10.11.1993Examination requested  [1994/01]
23.12.1993Despatch of a communication from the examining division (Time limit: M04)
23.12.1993Decision about request for accelerated examination - accepted: Yes
27.04.1994Reply to a communication from the examining division
12.12.1994Despatch of a communication from the examining division (Time limit: M01)
13.12.1994Reply to a communication from the examining division
08.02.1995Despatch of communication of intention to grant (Approval: Yes)
22.03.1995Communication of intention to grant the patent
04.05.1995Fee for grant paid
04.05.1995Fee for publishing/printing paid
Opposition(s)21.06.1996No opposition filed within time limit [1996/37]
Fees paidRenewal fee
12.05.1993Renewal fee patent year 03
18.05.1994Renewal fee patent year 04
15.05.1995Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipFR20.09.1995
NL20.09.1995
[2006/14]
Former [2003/07]NL20.09.1995
FR16.02.1996
Former [1996/30]FR16.02.1996
Documents cited:Search[X]JP01234515  ;
 [X]JP63238991  ;
 [A]JP56136295  ;
 [A]US3972599  (ENGEL SIMON L, et al);
 [X]WO8707862  (UNIV TENNESSEE RES CORP [US])
 [X]  - PATENT ABSTRACTS OF JAPAN vol. 13, no. 562 (C-665)13. Dezember 1989 & JP-A-01 234 515 ( HONDA MOTOR CO LTD ) 19. September 1989, & JP01234515 A 00000000
 [X]  - PATENT ABSTRACTS OF JAPAN vol. 13, no. 28 (M-788)(3376) 23. Januar 1989 & JP-A-63 238 991 ( KOMATSU LTD ) 5. Oktober 1988, & JP63238991 A 00000000
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 6, no. 17 (M-109)(895) 30. Januar 1982 & JP-A-56 136 295 ( MITSUBISHI DENKI K.K. ), & JP56136295 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.