EP0458180 - Process and device for laser beam cutting [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 26.07.1996 Database last updated on 06.07.2024 | Most recent event Tooltip | 17.02.2006 | Change - lapse in a contracting state Updated state(s): FR | published on 05.04.2006 [2006/14] | Applicant(s) | For all designated states Linde AG Abraham-Lincoln-Strasse 21 65189 Wiesbaden / DE | [N/P] |
Former [1991/48] | For all designated states Linde Aktiengesellschaft Abraham-Lincoln-Strasse 21 D-65189 Wiesbaden / DE | Inventor(s) | 01 /
Mair, Hermann, Dipl.-Ing. Mangfallstrasse 9 W-8000 München 90 / DE | 02 /
Herrmann, Johann Fastlinger Ring 115 W-8044 Unterschleissheim / DE | [1991/48] | Representative(s) | Schaefer, Gerhard Linde Aktiengesellschaft Zentrale Patentabteilung 82049 Höllriegelskreuth / DE | [N/P] |
Former [1991/48] | Schaefer, Gerhard, Dr. Linde Aktiengesellschaft Zentrale Patentabteilung D-82049 Höllriegelskreuth / DE | Application number, filing date | 91107865.7 | 15.05.1991 | [1991/48] | Priority number, date | DE19904016199 | 19.05.1990 Original published format: DE 4016199 | [1991/48] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP0458180 | Date: | 27.11.1991 | Language: | DE | [1991/48] | Type: | A3 Search report | No.: | EP0458180 | Date: | 22.09.1993 | Language: | DE | [1993/38] | Type: | B1 Patent specification | No.: | EP0458180 | Date: | 20.09.1995 | Language: | DE | [1995/38] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.08.1993 | Classification | IPC: | B23K26/14, B23K26/06 | [1991/48] | CPC: |
B23K26/14 (EP);
B23K26/06 (EP);
B23K26/0604 (EP);
B23K26/064 (EP);
B23K26/1462 (EP);
B23K26/364 (EP)
| Designated contracting states | AT, CH, DE, FR, LI, NL [1991/48] | Title | German: | Verfahren und Vorrichtung zum Laserstrahlschneiden | [1991/48] | English: | Process and device for laser beam cutting | [1991/48] | French: | Procédé et dispositif pour couper par rayon laser | [1991/48] | Examination procedure | 16.06.1993 | Request for accelerated examination filed | 10.11.1993 | Examination requested [1994/01] | 23.12.1993 | Despatch of a communication from the examining division (Time limit: M04) | 23.12.1993 | Decision about request for accelerated examination - accepted: Yes | 27.04.1994 | Reply to a communication from the examining division | 12.12.1994 | Despatch of a communication from the examining division (Time limit: M01) | 13.12.1994 | Reply to a communication from the examining division | 08.02.1995 | Despatch of communication of intention to grant (Approval: Yes) | 22.03.1995 | Communication of intention to grant the patent | 04.05.1995 | Fee for grant paid | 04.05.1995 | Fee for publishing/printing paid | Opposition(s) | 21.06.1996 | No opposition filed within time limit [1996/37] | Fees paid | Renewal fee | 12.05.1993 | Renewal fee patent year 03 | 18.05.1994 | Renewal fee patent year 04 | 15.05.1995 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 20.09.1995 | NL | 20.09.1995 | [2006/14] |
Former [2003/07] | NL | 20.09.1995 | |
FR | 16.02.1996 | ||
Former [1996/30] | FR | 16.02.1996 | Documents cited: | Search | [X]JP01234515 ; | [X]JP63238991 ; | [A]JP56136295 ; | [A]US3972599 (ENGEL SIMON L, et al); | [X]WO8707862 (UNIV TENNESSEE RES CORP [US]) | [X] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 562 (C-665)13. Dezember 1989 & JP-A-01 234 515 ( HONDA MOTOR CO LTD ) 19. September 1989, & JP01234515 A 00000000 | [X] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 28 (M-788)(3376) 23. Januar 1989 & JP-A-63 238 991 ( KOMATSU LTD ) 5. Oktober 1988, & JP63238991 A 00000000 | [A] - PATENT ABSTRACTS OF JAPAN vol. 6, no. 17 (M-109)(895) 30. Januar 1982 & JP-A-56 136 295 ( MITSUBISHI DENKI K.K. ), & JP56136295 A 00000000 |