blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP0452009

EP0452009 - Water soluble solder flux and paste [Right-click to bookmark this link]
StatusThe application has been refused
Status updated on  24.01.1997
Database last updated on 24.04.2024
Most recent event   Tooltip24.01.1997Refusal of applicationpublished on 12.03.1997 [1997/11]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1991/42]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Frazier, Janice Dianne
20508 Henwood Road
San Jose, CA 95120 / US
02 / Jackson, Robert Lloyd
981 Shadow Brook Drive
San Jose, CA 95120 / US
03 / Reich, Richard Alan
111 Buckskin Court
Georgetown, TX 78628 / US
[1991/42]
Representative(s)Moss, Robert Douglas
IBM United Kingdom Limited
Intellectual Property Department
Hursley Park
Winchester
Hampshire SO21 2JN / GB
[N/P]
Former [1991/42]Moss, Robert Douglas
IBM United Kingdom Limited Intellectual Property Department Hursley Park
Winchester Hampshire SO21 2JN / GB
Application number, filing date91302799.128.03.1991
[1991/42]
Priority number, dateUS1990050874012.04.1990         Original published format: US 508740
[1991/42]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0452009
Date:16.10.1991
Language:EN
[1991/42]
Type: A3 Search report 
No.:EP0452009
Date:19.11.1992
Language:EN
[1992/47]
Search report(s)(Supplementary) European search report - dispatched on:EP30.09.1992
ClassificationIPC:B23K35/36, B23K36/363
[1992/47]
CPC:
B23K35/3612 (EP,US); B23K35/36 (EP,US); B23K35/3615 (EP,US)
Former IPC [1991/42]B23K35/363, B23K35/36
Designated contracting statesDE,   FR,   GB [1991/42]
TitleGerman:Wasserlösliches Weichlötflussmittel und Paste[1991/42]
English:Water soluble solder flux and paste[1991/42]
French:Flux pour soudure tendre soluble dans l'eau et pâte[1991/42]
Examination procedure19.12.1991Examination requested  [1992/09]
07.09.1994Despatch of a communication from the examining division (Time limit: M06)
02.03.1995Reply to a communication from the examining division
09.05.1995Despatch of a communication from the examining division (Time limit: M06)
19.09.1995Reply to a communication from the examining division
25.10.1995Despatch of a communication from the examining division (Time limit: M02)
16.12.1995Reply to a communication from the examining division
16.02.1996Despatch of a communication from the examining division (Time limit: M02)
04.03.1996Reply to a communication from the examining division
13.05.1996Despatch of communication of intention to grant (Approval: )
28.10.1996Despatch of communication that the application is refused, reason: formalities examination [1997/11]
07.11.1996Application refused, date of legal effect [1997/11]
Fees paidRenewal fee
31.03.1993Renewal fee patent year 03
24.03.1994Renewal fee patent year 04
23.03.1995Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
31.03.199606   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]DE841097  (KOEHLER FRITZ);
 [AD]FR2168072  (LAKE CHEMICAL CO [US]);
 [AD]US4153482  (STAYNER ROBERT A, et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.