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Extract from the Register of European Patents

EP About this file: EP0486318

EP0486318 - Semiconductor device for use in a light valve device, and process for manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.11.2005
Database last updated on 11.05.2024
Most recent event   Tooltip25.11.2005No opposition filed within time limitpublished on 11.01.2006  [2006/02]
Applicant(s)For all designated states
Seiko Instruments Inc.
31-1, Kameido 6-chome Koto-ku
Tokyo 136 / JP
[N/P]
Former [1992/21]For all designated states
SEIKO INSTRUMENTS INC.
31-1, Kameido 6-chome Koto-ku
Tokyo 136 / JP
Inventor(s)01 / Takahashi, Kunihiro
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
02 / Kojima, Yoshikazu
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
03 / Takasu, Hiroaki
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
04 / Matsuyama, Nobuyoshi
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
05 / Niwa, Hitoshi
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
06 / Yoshino, Tomoyuki
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
07 / Yamazaki, Tsuneo
c/o Seiko Instruments Inc., 31-1 Kameido, 6-chome
Koto-ku, Tokyo / JP
[1992/21]
Representative(s)Sturt, Clifford Mark, et al
Miller Sturt Kenyon
9 John Street
London
WC1N 2ES / GB
[N/P]
Former [1992/21]Sturt, Clifford Mark, et al
J. MILLER & CO. 34 Bedford Row Holborn
London WC1R 4JH / GB
Application number, filing date91310565.615.11.1991
[1992/21]
Priority number, dateJP1990030943715.11.1990         Original published format: JP 30943790
JP1991000656123.01.1991         Original published format: JP 656191
JP1991002242016.02.1991         Original published format: JP 2242091
JP1991007933011.04.1991         Original published format: JP 7933091
JP1991007933711.04.1991         Original published format: JP 7933791
[1992/21]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0486318
Date:20.05.1992
Language:EN
[1992/21]
Type: B1 Patent specification 
No.:EP0486318
Date:19.01.2005
Language:EN
[2005/03]
Search report(s)(Supplementary) European search report - dispatched on:EP24.03.1992
ClassificationIPC:H01L21/58, H01L21/76, H01L21/84, H01L21/336, G02F1/136
[1999/05]
CPC:
H01L27/1266 (EP,US); H01L29/78 (KR); G02F1/13454 (EP,US);
H01L21/76264 (EP,US); H01L27/1214 (EP,US); H01L29/66772 (EP,US);
H01L29/78648 (EP,US); G02F1/133512 (EP,US); G02F1/13613 (EP,US);
G02F2202/105 (EP,US); H01L21/76289 (EP,US); H01L2221/68363 (EP,US);
Y10S148/012 (EP,US); Y10S148/135 (EP,US) (-)
Former IPC [1992/21]H01L21/336, H01L21/58, H01L21/76, H01L21/84, G02F1/136
Designated contracting statesDE,   FR,   GB,   IT,   NL [1992/21]
TitleGerman:Halbleitervorrichtung zur Verwendung in einem Lichtventil und deren Herstellungsmethode[1992/21]
English:Semiconductor device for use in a light valve device, and process for manufacturing the same[1992/21]
French:Dispositif semi-conducteur pour utilisation dans une vanne de lumière et son procédé de fabrication[1992/21]
Examination procedure04.11.1992Examination requested  [1992/53]
01.08.1995Despatch of a communication from the examining division (Time limit: M06)
07.02.1996Reply to a communication from the examining division
29.11.1996Despatch of a communication from the examining division (Time limit: M06)
06.06.1997Reply to a communication from the examining division
10.12.1998Date of oral proceedings
20.04.1999Despatch of communication of intention to grant (Approval: No)
20.04.1999Minutes of oral proceedings despatched
18.10.1999Despatch of communication of intention to grant (Approval: later approval)
03.11.1999Despatch of a communication from the examining division (Time limit: M04)
03.12.1999Despatch of a communication from the examining division (Time limit: M04)
13.04.2000Reply to a communication from the examining division
23.07.2004Communication of intention to grant the patent
18.10.2004Fee for grant paid
18.10.2004Fee for publishing/printing paid
Appeal following examination22.04.2002Appeal received No.  T0749/02
25.06.2002Statement of grounds filed
20.01.2004Result of appeal procedure: remittal for grant
Divisional application(s)EP00200828.2  / EP1026733
EP98204180.8  / EP0915503
Opposition(s)20.10.2005No opposition filed within time limit [2006/02]
Fees paidRenewal fee
29.11.1993Renewal fee patent year 03
15.11.1994Renewal fee patent year 04
09.11.1995Renewal fee patent year 05
11.11.1996Renewal fee patent year 06
10.11.1997Renewal fee patent year 07
10.11.1998Renewal fee patent year 08
12.11.1999Renewal fee patent year 09
13.11.2000Renewal fee patent year 10
14.11.2001Renewal fee patent year 11
13.11.2002Renewal fee patent year 12
12.11.2003Renewal fee patent year 13
12.11.2004Renewal fee patent year 14
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Documents cited:Search[Y]EP0211402  (GEN ELECTRIC [US]);
 [A]US4024626  (LEUPP ALEX M, et al);
 [A]DE2715446  (SIEMENS AG);
 [Y]DD134283  ;
 [A]EP0164646  (IBM [US]);
 [A]GB2206445  (SPECTROL RELIANCE LTD)
 [Y]  - IEEE TRANSACTIONS ON ELECTRON DEVICES vol. 37, no. 1, January 1990, pages 121-127, New York, US; E. FUJII et al.: "A laser-recrystallization technique for silicon-TFT integrated circuits on quartz substrates and its application to small-size monolithic active-matrix LCD's"
 [A]  - JAPANESE JOURNAL OF APPLIED PHYSICS vol. 29, no. 4, part 2, April 1990, pages L521-L523, Tokyo, JP; K. ISHII et al.: "Experimental fabrication of XMOS transistors using lateral solid-phase epitaxy of CVD silicon films"
 [Y]  - FUJITSU SCIENTIFIC AND TECHNICAL JOURNAL vol. 24, no. 4 + index, December 1988, pages 408-417, Kawasaki, JP; H. GOTOU et al.: "SOI-Device on Bonded Wafer"
 [A]  - JOURNAL OF THE ELECTROMECHANICAL SOCIETY vol. 120, no. 11, November 1973, pages 1563-1566, Manchester, NH, US; G.L. KUHN et al.: "Thin silicon film on insulating substrate"
Examination   - EIJI FUJII, ET AL., "A LASER-RECRYSTALLIZATION TECHNIQUE FOR SILICON-TFT INTEGRATED CIRCUITS ON QUARTZ SUBSTRATES AND ITS APPLICATION TO SMALL-SIZE MONOLITHIC ACTIVE-MATRIX LCD'S.", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE SERVICE CENTER, PISACATAWAY, NJ., US, US, (19900101), vol. 37., no. 01., doi:10.1109/16.43808, ISSN 0018-9383, pages 121 - 127., XP000086899

DOI:   http://dx.doi.org/10.1109/16.43808
    - KENICHI ISHII, YUTAKA HAYASHI, TOSHIHIRO SEKIGAWA., "EXPERIMENTAL FABRICATION OF XMOS TRANSISTORS USING LATERAL SOLID-PHASE EPITAXY OF CVD SILICON FILMS.", JAPANESE JOURNAL OF APPLIED PHYSICS, Japan Society of Applied Physics, JP, JP, (19900401), vol. 29., no. 04., doi:10.1143/JJAP.29.L521, ISSN 0021-4922, pages L521 - L523., XP000136262

DOI:   http://dx.doi.org/10.1143/JJAP.29.L521
    - GOTOU H., ET AL., "SOI-DEVICE ON BONDED WAFER.", FUJITSU-SCIENTIFIC AND TECHNICAL JOURNAL., Fujitsu Ltd., JP, JP, (19881221), vol. 24., no. 04 + INDEX., ISSN 0016-2523, pages 408 - 417., XP000112818
    - G.L.KUHN, "Thin silicon film on insulating substrate", Journal of The Electrochemical Society, Electrochemical Society, (19731101), vol. 120, no. 11, ISSN 0013-4651, pages 1563 - 1566, XP002097278
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.