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Extract from the Register of European Patents

EP About this file: EP0527194

EP0527194 - HIGH DENSITY LOCAL INTERCONNECT IN A SEMICONDUCTOR CIRCUIT USING METAL SILICIDE [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  18.04.1995
Database last updated on 15.06.2024
Most recent event   Tooltip18.04.1995Application deemed to be withdrawnpublished on 07.06.1995 [1995/23]
Applicant(s)For all designated states
QUALITY SEMICONDUCTOR, INC.
851 Martin Avenue
Santa Clara, CA 95050-2903 / US
[1993/07]
Inventor(s)01 / MALWAH, Manohar, L.
26460 Taaffe Lane
Los Altos Hills, CA 94022 / US
[1993/07]
Representative(s)Waldren, Robin Michael
Marks & Clerk LLP
90 Long Acre
London
WC2E 9RA / GB
[N/P]
Former [1993/07]Waldren, Robin Michael
MARKS & CLERK, 57-60 Lincoln's Inn Fields
London WC2A 3LS / GB
Application number, filing date91909507.525.04.1991
[1993/07]
WO1991US02872
Priority number, dateUS1990051801602.05.1990         Original published format: US 518016
[1993/07]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9117576
Date:14.11.1991
Language:EN
[1991/26]
Type: A1 Application with search report 
No.:EP0527194
Date:17.02.1993
Language:EN
The application published by WIPO in one of the EPO official languages on 14.11.1991 takes the place of the publication of the European patent application.
[1993/07]
Search report(s)International search report - published on:US14.11.1991
(Supplementary) European search report - dispatched on:EP22.02.1993
ClassificationIPC:H01L45/00, H01L27/02, H01L29/04, H01L23/48, H01L21/44, H01L21/265
[1993/07]
CPC:
H01L23/53271 (EP); H01L21/76889 (EP); H01L21/76895 (EP);
H01L2924/0002 (EP)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesAT,   CH,   DE,   FR,   GB,   LI,   NL [1993/07]
TitleGerman:LOKALE VERBINDUNGEN HOHER DICHTE IN EINER HALBLEITERSCHALTUNG UNTER VERWENDUNG VON METALLSILICIDEN[1993/07]
English:HIGH DENSITY LOCAL INTERCONNECT IN A SEMICONDUCTOR CIRCUIT USING METAL SILICIDE[1993/07]
French:INTERCONNEXION LOCALE A HAUTE DENSITE DANS UN CIRCUIT A SEMICONDUCTEURS OBTENUE AU MOYEN D'UN SILICIURE DE METAL[1993/07]
File destroyed:03.03.2001
Entry into regional phase30.11.1992National basic fee paid 
30.11.1992Search fee paid 
30.11.1992Designation fee(s) paid 
30.11.1992Examination fee paid 
Examination procedure04.06.1991Request for preliminary examination filed
International Preliminary Examining Authority: DE
01.12.1992Examination requested  [1993/07]
27.05.1994Despatch of a communication from the examining division (Time limit: M06)
07.12.1994Application deemed to be withdrawn, date of legal effect  [1995/23]
09.01.1995Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1995/23]
Fees paidRenewal fee
27.05.1993Renewal fee patent year 03
18.03.1994Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
30.04.199303   M06   Fee paid on   27.05.1993
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]EP0163132  (TOSHIBA KK [JP])
International search[YP]US4951117  (KASAI NAOKI [JP]);
 [Y]US4873204  (WONG SIU-WENG S [US], et al);
 [Y]US4679310  (RAMACHANDRA GOVARDHAN [US], et al);
 [Y]US4549914  (OH KYE H [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.