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Extract from the Register of European Patents

EP About this file: EP0495468

EP0495468 - Method of producing treated copper foil, products thereof and electrolyte useful in such method [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.01.1998
Database last updated on 24.04.2024
Most recent event   Tooltip30.01.1998No opposition filed within time limitpublished on 18.03.1998 [1998/12]
Applicant(s)For all designated states
CIRCUIT FOIL U.S.A. INCORPORATED
88 Route 130 Bordentown
New Jersey 08505-2297 / US
[N/P]
Former [1992/30]For all designated states
CIRCUIT FOIL U.S.A. INCORPORATED
88 Route 130
Bordentown, New Jersey 08505-2297 / US
Inventor(s)01 / Wolski, Adam M.
4B-7 Arbor Green
Edgewater Park, NJ 08010 / US
02 / Maquet, Laurette M.
Rue De Warken Nr. 164
Residence Le Moulin, Luxembourg / LU
03 / Streel, Michel
2, Bonnerue
B-6663 Mabompre / BE
[1997/13]
Former [1992/30]01 / Wolski, Adam M.
4B-7 Arbor Green
Edgewater Park, New Jersey 08010 / US
02 / Maquet, Laurette M.
Rue De Warken Nr. 164
Residence Le Moulin, Luxembourg / LU
03 / Streel, Michel
2, Bonnerue
B-6663 Mabompre / BE
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [1992/30]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
D-80538 München / DE
Application number, filing date92100538.514.01.1992
[1992/30]
Priority number, dateUS1991064192216.01.1991         Original published format: US 641922
[1992/30]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0495468
Date:22.07.1992
Language:EN
[1992/30]
Type: A3 Search report 
No.:EP0495468
Date:18.05.1994
Language:EN
[1994/20]
Type: B1 Patent specification 
No.:EP0495468
Date:26.03.1997
Language:EN
[1997/13]
Search report(s)(Supplementary) European search report - dispatched on:EP16.03.1994
ClassificationIPC:C25D3/58, C25D5/10
[1992/30]
CPC:
H05K3/384 (EP,US); C25D3/58 (EP,US); H05K2201/0355 (EP,US);
H05K2203/0307 (EP,US); H05K2203/0723 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT,   LU [1992/30]
TitleGerman:Verfahren zur Herstellung behandelter Kupfer-Folien, daraus hergestellte Produkte sowie Elektrolyt zur Verwendung in einem solchen Verfahren[1992/30]
English:Method of producing treated copper foil, products thereof and electrolyte useful in such method[1992/30]
French:Procédé de fabrication d'une feuille de cuivre traitée, produits obtenus et électrolyte utilisé dans un tel procédé[1992/30]
Examination procedure17.11.1994Examination requested  [1995/03]
29.03.1995Despatch of a communication from the examining division (Time limit: M07)
16.10.1995Reply to a communication from the examining division
06.05.1996Despatch of communication of intention to grant (Approval: Yes)
09.09.1996Communication of intention to grant the patent
21.11.1996Fee for grant paid
21.11.1996Fee for publishing/printing paid
Opposition(s)30.12.1997No opposition filed within time limit [1998/12]
Fees paidRenewal fee
22.12.1993Renewal fee patent year 03
27.12.1994Renewal fee patent year 04
27.12.1995Renewal fee patent year 05
18.12.1996Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US4356067  (MCCOY EWALD H) [X] 1,7 * column 1, line 53 - line 56 * * column 7, line 45 - line 60 *;
 [DA]US4572768  (WOLSKI ADAM M [US], et al) [DA] * column A; example -; claim - *
 [A]  - SHAPNIK ET AL., "Copper-antimony alloy electroplating in a cyanide-free bath", CHEMICAL ABSTRACTS, (19830725), vol. 99, no. 4, Database accession no. 29942p, page 463 [A] 11 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.