Extract from the Register of European Patents

EP About this file: EP0499986

EP0499986 - Multilayer wiring structure and method for forming multilayer construction [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.03.1999
Database last updated on 28.03.2026
Most recent event   Tooltip19.03.1999No opposition filed within time limitpublished on 06.05.1999 [1999/18]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo 101 / JP
[N/P]
Former [1998/20]For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101-0062 / JP
Former [1992/35]For all designated states
HITACHI, LTD.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101 / JP
Inventor(s)01 / Tawata, Rie
7-6-203, Omikacho-6-chome
Hitachi-shi / JP
02 / Numata, Shunichi
1-15, Miyatacho-3-chome
Hitachi-shi / JP
03 / Miwa, Takao
17-2-202, Moriyamacho-3-chome
Hitachi-shi / JP
04 / Fujisaki, Koji
26-19, Higashionumacho-2-chome
Hitachi-shi / JP
05 / Ikeda, Takayoshi
1161-3, Ishigamiuchijuku, Tokaimura
Naka-gun, Ibaraki-ken / JP
06 / Okabe, Yoshiaki
17-2-102, Moriyamacho-3-chome
Hitachi-shi / JP
07 / Shimanoki, Hisae
21-5, Ishinazakacho-1-chome
Hitachi-shi / JP
[1992/35]
Representative(s)Beetz & Partner mbB
Patentanwälte
Prinzregentenstraße 54
80538 München / DE
[N/P]
Former [1994/11]Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr
Steinsdorfstrasse 10
D-80538 München / DE
Former [1992/35]Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr
Steinsdorfstrasse 10
D-80538 München / DE
Application number, filing date92102530.014.02.1992
[1992/35]
Priority number, dateJP1991002310618.02.1991         Original published format: JP 2310691
[1992/35]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0499986
Date:26.08.1992
Language:EN
[1992/35]
Type: A3 Search report 
No.:EP0499986
Date:08.03.1995
Language:EN
[1995/10]
Type: B1 Patent specification 
No.:EP0499986
Date:13.05.1998
Language:EN
[1998/20]
Search report(s)(Supplementary) European search report - dispatched on:EP19.01.1995
ClassificationIPC:H05K1/03, H05K1/00, H05K3/46
[1992/35]
CPC:
H05K3/4655 (EP,US); H05K3/46 (KR); H05K1/0346 (EP,US);
H05K3/4673 (EP,US); H05K3/4676 (EP,US); H10W70/69 (EP,US);
H05K2201/0154 (EP,US); H05K2201/0195 (EP,US); H05K2201/068 (EP,US);
H05K2203/0759 (EP,US); H05K3/4644 (EP,US); H05K3/4652 (EP,US);
Y10T29/49126 (EP,US); Y10T29/49128 (EP,US); Y10T29/49163 (EP,US);
Y10T428/31721 (EP,US) (-)
Designated contracting statesDE,   FR,   NL [1992/35]
TitleGerman:Mehrlagen-Leiterplattenstruktur und Verfahren zur Herstellung mehrlagiger Konstruktionen[1998/17]
English:Multilayer wiring structure and method for forming multilayer construction[1992/35]
French:Structure de circuit multicouche et procédé de fabrication d'une construction multicouche[1992/35]
Former [1992/35]Mehrschichtleiterbahnstruktur und Verfahren zur Herstellung von Mehrschichtkonstruktion
Examination procedure26.01.1995Examination requested  [1995/13]
08.09.1995Despatch of a communication from the examining division (Time limit: M06)
18.03.1996Reply to a communication from the examining division
14.08.1996Despatch of a communication from the examining division (Time limit: M04)
18.12.1996Reply to a communication from the examining division
22.09.1997Despatch of communication of intention to grant (Approval: Yes)
02.12.1997Communication of intention to grant the patent
24.02.1998Fee for grant paid
24.02.1998Fee for publishing/printing paid
Opposition(s)16.02.1999No opposition filed within time limit [1999/18]
Fees paidRenewal fee
28.02.1994Renewal fee patent year 03
27.02.1995Renewal fee patent year 04
28.02.1996Renewal fee patent year 05
27.02.1997Renewal fee patent year 06
27.02.1998Renewal fee patent year 07
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Documents cited:Search[A] JPH0245998  
 [A]   PATENT ABSTRACTS OF JAPAN vol. 14, no. 205 (E - 0921) 26 April 1990 (1990-04-26) [A] * abstract *
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