Extract from the Register of European Patents

EP About this file: EP0513684

EP0513684 - Method of improving the manufaturing of SOI devices by forming position alignment marks [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  27.06.1997
Database last updated on 28.03.2026
Most recent event   Tooltip27.06.1997No opposition filed within time limitpublished on 13.08.1997 [1997/33]
Applicant(s)For all designated states
Sony Corporation
7-35, Kitashinagawa 6-chome
Shinagawa-ku
Tokyo / JP
[N/P]
Former [1992/47]For all designated states
SONY CORPORATION
7-35, Kitashinagawa 6-chome Shinagawa-ku
Tokyo / JP
Inventor(s)01 / Nishihara, Toshiyuki
c/o Sony Corporation, 7-35 Kitashinagawa 6-chome
Shinagawa-ku, Tokyo / JP
[1992/47]
Representative(s)Müller, Frithjof E.
Müller Hoffmann & Partner Patentanwälte Innere Wiener Strasse 17
81667 München / DE
[N/P]
Former [1997/12]Müller, Frithjof E., Dipl.-Ing.
Patentanwälte MÜLLER & HOFFMANN, Innere Wiener Strasse 17
81667 München / DE
Former [1992/47]TER MEER - MÜLLER - STEINMEISTER & PARTNER
Mauerkircherstrasse 45
D-81679 München / DE
Application number, filing date92107798.808.05.1992
[1992/47]
Priority number, dateJP1991010560210.05.1991         Original published format: JP 10560291
[1992/47]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0513684
Date:19.11.1992
Language:EN
[1992/47]
Type: A3 Search report 
No.:EP0513684
Date:09.12.1992
Language:EN
[1992/50]
Type: B1 Patent specification 
No.:EP0513684
Date:21.08.1996
Language:EN
[1996/34]
Search report(s)(Supplementary) European search report - dispatched on:EP23.10.1992
ClassificationIPC:H01L23/544
[1992/47]
CPC:
H10W20/089 (EP,US); H10W20/069 (EP,US); H10W46/00 (EP,US);
H10W46/501 (EP,US); Y10S438/928 (EP,US); Y10S438/975 (EP,US)
Designated contracting statesDE,   FR,   GB,   NL [1992/47]
TitleGerman:Verfahren zum Verbessern der Herstellung von SOI-Anordnungen mittels Positions-Ausrichtungsmarken[1996/34]
English:Method of improving the manufaturing of SOI devices by forming position alignment marks[1992/47]
French:Procédé pour l'amélioration de la fabrication de dispositifs SOI au moyen de la formation de marques d'alignement de position[1992/47]
Former [1992/47]Verfahren zum Verbessern der Herstellung von SOI-Anordnungen mittels Aurichtungsmarken der Position
Examination procedure06.05.1993Examination requested  [1993/26]
12.10.1994Despatch of a communication from the examining division (Time limit: M04)
14.02.1995Reply to a communication from the examining division
04.10.1995Despatch of communication of intention to grant (Approval: Yes)
01.02.1996Communication of intention to grant the patent
30.04.1996Fee for grant paid
30.04.1996Fee for publishing/printing paid
Opposition(s)22.05.1997No opposition filed within time limit [1997/33]
Fees paidRenewal fee
09.05.1994Renewal fee patent year 03
12.04.1995Renewal fee patent year 04
09.05.1996Renewal fee patent year 05
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