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Extract from the Register of European Patents

EP About this file: EP0513834

EP0513834 - Method and apparatus for cooling wafers [Right-click to bookmark this link]
StatusPatent maintained as amended
Status updated on  18.03.2005
Database last updated on 20.12.2024
Most recent event   Tooltip05.10.2005Change: Appeal number 
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
M/S 2061
Santa Clara, California 95054-3299 / US
[N/P]
Former [2005/18]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue, M/S 2061
Santa Clara, California 95054-3299 / US
Former [1992/47]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue
Santa Clara California 95054-3299 / US
Inventor(s)01 / Bahng, Kenneth J.
21541 Regnart Road
Cupertino, CA 95014-4818 / US
[1992/51]
Former [1992/47]01 / Bahng, Kenneth J.
536 Castlerock Court
Sunnyvale, CA 94087 / US
Representative(s)Geissler, Bernhard, et al
Bardehle Pagenberg Partnerschaft mbB
Patentanwälte, Rechtsanwälte
Prinzregentenplatz 7
81675 München / DE
[N/P]
Former [1999/33]Geissler, Bernhard, Dr.jur., Dipl.-Phys., et al
Patent- u. Rechtsanwälte Bardehle -Pagenberg-Dost-Altenburg- Geissler-Isenbruck Galileiplatz 1
81679 München / DE
Former [1999/32]Hess, Peter K., Dipl.-Phys., et al
Patent- und Rechtsanwälte Bardehle - Pagenberg - Dost Altenburg - Geissler -Isenbruck Galileiplatz 1
81679 München / DE
Former [1992/47]Diehl, Hermann O. Th., Dr., et al
Diehl, Glaeser, Hiltl & Partner Patentanwälte Postfach 19 03 65
D-80603 München / DE
Application number, filing date92108288.915.05.1992
[1992/47]
Priority number, dateUS1991070143715.05.1991         Original published format: US 701437
[1992/47]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0513834
Date:19.11.1992
Language:EN
[1992/47]
Type: B1 Patent specification 
No.:EP0513834
Date:11.09.1996
Language:EN
[1996/37]
Type: B2 New European patent specification 
No.:EP0513834
Date:04.05.2005
Language:EN
[2005/18]
Search report(s)(Supplementary) European search report - dispatched on:EP27.08.1992
ClassificationIPC:H01L21/00
[1992/47]
CPC:
H01L21/67109 (EP,US); H01L21/30 (KR); H01L21/68742 (EP,US);
Y10S269/903 (EP,US)
Designated contracting statesDE,   FR,   GB,   NL [1992/47]
TitleGerman:Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen[1992/47]
English:Method and apparatus for cooling wafers[1992/47]
French:Procédé et appareil pour refroidir des disques semi-conducteurs[1992/47]
Examination procedure19.05.1993Examination requested  [1993/29]
20.05.1994Despatch of a communication from the examining division (Time limit: M04)
19.09.1994Reply to a communication from the examining division
17.10.1994Despatch of a communication from the examining division (Time limit: M06)
04.04.1995Reply to a communication from the examining division
23.08.1995Despatch of communication of intention to grant (Approval: Yes)
21.11.1995Communication of intention to grant the patent
22.02.1996Fee for grant paid
22.02.1996Fee for publishing/printing paid
Opposition(s)Opponent(s)01  11.06.1997    ADMISSIBLE
Institute of Technological Information, Inc.
2-2, Kitahara 2-chome
Asaka-shi Saitama-ken 351 / JP
Opponent's representative
Füchsle, Klaus
Hoffmann - Eitle
ATTENTION : ADDRESS INACTIVE - USE ASS-NR - CDR / DE
 [N/P]
Former [1997/33]
Opponent(s)01  11.06.1997    ADMISSIBLE
Institute of Technological Information, Inc.
2-2, Kitahara 2-chome
Asaka-shi Saitama-ken 351 / JP
Opponent's representative
Füchsle, Klaus
Hoffmann Eitle, Patent- und Rechtsanwälte, Arabellastrasse 4
81925 München / DE
22.07.1997Invitation to proprietor to file observations on the notice of opposition
11.11.1997Reply of patent proprietor to notice(s) of opposition
29.01.1999Date of oral proceedings
29.03.1999Despatch of minutes of oral proceedings
29.03.1999Despatch of communication that the patent will be revoked
24.06.2003Despatch of a communication from the opposition division (Time limit: M04)
01.10.2003Reply to a communication from the opposition division
12.01.2004Despatch of interlocutory decision in opposition
22.01.2004Legal effect of interlocutory decision in opposition
28.04.2004Despatch of communication that the patent will be maintained as amended
09.08.2004Fee for printing new specification paid
Appeal following opposition27.05.1999Appeal received No.  T0598/99
06.08.1999Statement of grounds filed
17.12.2002Result of appeal procedure: maintenance in amended form
17.12.2002Date of oral proceedings
27.12.2002Minutes of the oral proceedings despatched
Fees paidRenewal fee
30.05.1994Renewal fee patent year 03
26.05.1995Renewal fee patent year 04
30.05.1996Renewal fee patent year 05
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Lapses during opposition  TooltipGB15.05.2004
[2005/45]
Documents cited:Search[A]US4958061  (WAKABAYASHI TSUYOSHI [JP], et al);
 [A]WO8904386  (KOPIN CORP [US]);
 [A]US4955590  (NARUSHIMA MASAKI [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.