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Extract from the Register of European Patents

EP About this file: EP0521405

EP0521405 - Heat radiating component and semiconductor device provided with the same [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 22.02.2002 Database last updated on 04.06.2024
Most recent event Tooltip	22.02.2002	No opposition filed within time limit	published on 10.04.2002 [2002/15]
Applicant(s)	For all designated states Sumitomo Electric Industries, Ltd. 5-33, Kitahama 4-chome, Chuo-ku Osaka 541 / JP
	[1993/01]
Inventor(s)	01 / Nakamura, Tsutomu, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
	02 / Iguchi, Takahisa, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
	03 / Nakai, Tetsuo, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
	[2001/34]
Former [1993/01]	01 / Nakamura, Tsutomo, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
	02 / Iguchi, Takahisa, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
	03 / Nakai, Tetsuo, c/o Itami Works Sumitomo El. Ind. Limited 1-1, Koyakita 1-chome Itami-shi, Hyogo / JP
Representative(s)	Grosse, Wolfgang, et al Grosse - Schumacher - Knauer - von Hirschhausen Patent- und Rechtsanwälte Nymphenburger Strasse 14 80335 München / DE
	[N/P]
Former [1997/17]	Grosse, Wolfgang, Dipl.-Ing., et al Patentanwälte Herrmann-Trentepohl Grosse - Bockhorni & Partner, Forstenrieder Allee 59 81476 München / DE
Former [1993/01]	Kirschner, Klaus Dieter, Dipl.-Phys., et al Patentanwälte Herrmann-Trentepohl, Kirschner, Grosse, Bockhorni & Partner Forstenrieder Allee 59 D-81476 München / DE
Application number, filing date	92110805.6	26.06.1992
	[1993/01]
Priority number, date	JP19910160210	01.07.1991 Original published format: JP 16021091
	JP19920063473	19.03.1992 Original published format: JP 6347392
	[1993/01]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP0521405
	Date:	07.01.1993
	Language:	EN
	[1993/01]
	Type:	B1 Patent specification
	No.:	EP0521405
	Date:	18.04.2001
	Language:	EN
	[2001/16]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	14.10.1992
Classification	IPC:	H01L23/373, C23C16/26	[1993/01]
	CPC:	H01L23/49513 (EP,US); H01S5/024 (KR); H01L23/3732 (EP,US); H01L23/3736 (EP,US); H01L23/4334 (EP,US); H01L24/32 (EP,US); (+) H01L2224/2908 (EP,US); H01L2224/29083 (EP,US); H01L2224/29111 (EP,US); H01L2224/32245 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US); H01L2224/73265 (EP,US); H01L24/48 (EP,US); H01L24/73 (EP,US); H01L2924/0001 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01018 (EP,US); H01L2924/01019 (EP,US); H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01032 (EP,US); H01L2924/01033 (EP,US); H01L2924/0104 (EP,US); H01L2924/01041 (EP,US); H01L2924/01042 (EP,US); H01L2924/01046 (EP,US); H01L2924/01047 (EP,US); H01L2924/0105 (EP,US); H01L2924/01072 (EP,US); H01L2924/01073 (EP,US); H01L2924/01074 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/0132 (EP,US); H01L2924/0133 (EP,US); H01L2924/10329 (EP,US); H01L2924/12042 (EP,US); H01L2924/157 (EP,US); H01L2924/15787 (EP,US); H01L2924/181 (EP,US) (-)
	C-Set:	H01L2224/48091, H01L2924/00014 (US,EP); H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (US,EP); H01L2924/00014, H01L2224/05599 (EP,US); H01L2924/00014, H01L2224/45099 (EP,US); (+) H01L2924/0001, H01L2224/29099 (US,EP); H01L2924/0132, H01L2924/01014, H01L2924/01079 (US,EP); H01L2924/0132, H01L2924/01029, H01L2924/01042 (US,EP); H01L2924/0132, H01L2924/01029, H01L2924/01074 (US,EP); H01L2924/0132, H01L2924/0105, H01L2924/01079 (US,EP); H01L2924/0132, H01L2924/0105, H01L2924/01082, H01L2924/00012 (US,EP); H01L2924/0133, H01L2924/01029, H01L2924/01042, H01L2924/01074 (US,EP); H01L2924/12042, H01L2924/00 (EP,US); H01L2924/181, H01L2924/00012 (US,EP) (-)
Designated contracting states	DE, FR, GB [1993/01]
Title	German:	Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung	[1993/01]
	English:	Heat radiating component and semiconductor device provided with the same	[1993/01]
	French:	Composant évacuant la chaleur et dispositif semi-conducteur qui en est muni	[1993/01]
Examination procedure	11.01.1993	Examination requested [1993/11]
	11.01.1995	Despatch of a communication from the examining division (Time limit: M04)
	03.04.1995	Reply to a communication from the examining division
	28.02.1996	Despatch of a communication from the examining division (Time limit: M04)
	04.07.1996	Reply to a communication from the examining division
	18.12.1996	Despatch of a communication from the examining division (Time limit: M06)
	30.05.1997	Reply to a communication from the examining division
	02.12.1997	Despatch of a communication from the examining division (Time limit: M04)
	02.04.1998	Reply to a communication from the examining division
	30.11.1999	Date of oral proceedings
	08.12.1999	Minutes of oral proceedings despatched
	14.08.2000	Despatch of communication of intention to grant (Approval: Yes)
	17.10.2000	Communication of intention to grant the patent
	29.12.2000	Fee for grant paid
	29.12.2000	Fee for publishing/printing paid
Opposition(s)	19.01.2002	No opposition filed within time limit [2002/15]
Fees paid	Renewal fee
	29.06.1994	Renewal fee patent year 03
	26.06.1995	Renewal fee patent year 04
	21.06.1996	Renewal fee patent year 05
	26.06.1997	Renewal fee patent year 06
	23.06.1998	Renewal fee patent year 07
	22.06.1999	Renewal fee patent year 08
	26.06.2000	Renewal fee patent year 09
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]JP62196858 ;
		[X]EP0286306 (FUJITSU LTD [JP])
		[Y] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 49 (E-582)(2896) 18 February 1988 & JP-A-62 196 858 ( NEC CORP ) 31 August 1987, & JP62196858 A 19870831
		[Y] - FUJITSU SCIENTIFIC AND TECHNICAL JOURNAL. vol. 25, no. 1, March 1989, KAWASAKI JP pages 44 - 51; KAZUAKI KURIHARA ET AL.: 'Diamond-Film Synthesis Using DC Plasma Jet CVD'
		[X] - SOLID STATE TECHNOLOGY. vol. 34, no. 2, February 1991, WASHINGTON US pages 89 - 91; DAVID.S.HOOVER ET AL.: 'Diamond Thin Film:Applications in Electronics Packaging'
		[A] - MOLECULAR CRYSTALS AND LIQUID CRYSTALS, LETTERS SECTION vol. 7, no. 2, March 1990, NEW YORK , US pages 2294 - 2302; C.V.DESHPANDEY ET AL.: 'Diamond and diamondlike films:Deposition processes and properties'

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