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Extract from the Register of European Patents

EP About this file: EP0522563

EP0522563 - Semiconductor chip module and method of manufacturing the same [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 19.07.1996 Database last updated on 28.05.2024
Most recent event Tooltip	19.07.1996	Application deemed to be withdrawn	published on 04.09.1996 [1996/36]
Applicant(s)	For all designated states SUMITOMO ELECTRIC INDUSTRIES, LIMITED 5-33, Kitahama 4-chome Chuo-ku Osaka 541 / JP
	[N/P]
Former [1993/02]	For all designated states SUMITOMO ELECTRIC INDUSTRIES, LIMITED 5-33, Kitahama 4-chome Chuo-ku Osaka 541 / JP
Inventor(s)	01 / Nishiguchi, Masanori, c/o Yokohama Works Sumitomo Electric Ind., Ltd, 1, Taya-cho, Sakae-ku Yokohama-shi, Kanagawa / JP
	[1993/02]
Representative(s)	Lehn, Werner, et al Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20 81904 München / DE
	[N/P]
Former [1993/02]	Lehn, Werner, Dipl.-Ing., et al Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20 D-81904 München / DE
Application number, filing date	92111721.4	09.07.1992
	[1993/02]
Priority number, date	JP19910172730	12.07.1991 Original published format: JP 17273091
	JP19910172735	12.07.1991 Original published format: JP 17273591
	JP19910172738	12.07.1991 Original published format: JP 17273891
	[1993/02]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0522563
	Date:	13.01.1993
	Language:	EN
	[1993/02]
	Type:	A3 Search report
	No.:	EP0522563
	Date:	08.06.1994
	Language:	EN
	[1994/23]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	19.04.1994
Classification	IPC:	H01L23/433, H01L23/10	[1993/02]
	CPC:	H01L24/32 (EP,US); H01L23/34 (KR); H01L23/10 (EP,US); H01L23/4338 (EP,US); H01L2224/16225 (EP,US); H01L2224/26145 (EP,US); (+) H01L2224/27013 (EP,US); H01L2224/29111 (EP,US); H01L2224/48091 (EP,US); H01L2224/48227 (EP,US); H01L2224/73253 (EP,US); H01L2224/73257 (EP,US); H01L2224/83051 (EP,US); H01L2224/83365 (EP,US); H01L24/48 (EP,US); H01L29/0657 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01014 (EP,US); H01L2924/0102 (EP,US); H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01043 (EP,US); H01L2924/01047 (EP,US); H01L2924/01051 (EP,US); H01L2924/01061 (EP,US); H01L2924/01074 (EP,US); H01L2924/01082 (EP,US); H01L2924/01084 (EP,US); H01L2924/0132 (EP,US); H01L2924/10158 (EP,US); H01L2924/10329 (EP,US); H01L2924/12033 (EP,US); H01L2924/14 (EP,US); H01L2924/157 (EP,US); H01L2924/15787 (EP,US); H01L2924/1579 (EP,US); H01L2924/16151 (EP,US); H01L2924/16152 (EP,US) (-)
	C-Set:	H01L2224/26145, H01L2924/10155, H01L2924/00014 (EP,US); H01L2224/29111, H01L2924/01082, H01L2924/00014 (EP,US); H01L2224/48091, H01L2924/00014 (US,EP); H01L2924/00014, H01L2224/05599 (US,EP); (+) H01L2924/00014, H01L2224/45099 (US,EP); H01L2924/0132, H01L2924/01029, H01L2924/01074 (US,EP); H01L2924/0132, H01L2924/01046, H01L2924/01047 (US,EP); H01L2924/0132, H01L2924/01047, H01L2924/0105 (EP,US); H01L2924/0132, H01L2924/01051, H01L2924/01082 (EP,US); H01L2924/12033, H01L2924/00 (US,EP); H01L2924/15787, H01L2924/00 (EP,US); H01L2924/16152, H01L2224/73253 (US,EP) (-)
Designated contracting states	CH, DE, FR, GB, IT, LI, NL [1993/02]
Title	German:	Halbleiterchipmodul und Verfahren zur Herstellung	[1993/02]
	English:	Semiconductor chip module and method of manufacturing the same	[1993/02]
	French:	Module à puce semi-conductrice et procédé de fabrication	[1993/02]
File destroyed:	20.04.2002
Examination procedure	25.11.1994	Examination requested [1995/04]
	12.09.1995	Despatch of a communication from the examining division (Time limit: M04)
	23.01.1996	Application deemed to be withdrawn, date of legal effect [1996/36]
	22.02.1996	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1996/36]
Fees paid	Renewal fee
	28.07.1994	Renewal fee patent year 03
	26.07.1995	Renewal fee patent year 04
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XAY]JPS5987843 ;
		[A]JPS6084848 ;
		[A]JPH02109358 ;
		[A]JPS58148434 ;
		[A]JPS63293928 ;
		[A]JPH0382144 ;
		[A]JPS6239032 ;
		[XAY]US4069498 (JOSHI KAILASH CHANDRA) [X] 1 * the whole document * [A] 2 [Y] 5,10,12,13;
		[A]EP0006445 (IBM [US]) [A] 1,2 * the whole document *;
		[A]US4825284 (SOGA TASAO [JP], et al) [A] 3,4 * the whole document *
		[XAY] - PATENT ABSTRACTS OF JAPAN, (19840913), vol. 008, no. 200, Database accession no. (E - 266), & JP59087843 A 19840521 (HITACHI SEISAKUSHO KK) [X] 1 * abstract * [A] 2 [Y] 5,10,12,13
		[XA] - R. SPAIGHT, "THERMAL ENHANCEMENT TECHNIQUE FOR LARGE-SCALE INTEGRATED CIRCUIT CHIP-CARRIERS", IBM TECHNICAL DISCLOSURE BULLETIN., NEW YORK US, (197712), vol. 20, no. 7, page 2614 [X] 2 * the whole document * [A] 1
		[A] - PATENT ABSTRACTS OF JAPAN, (19850917), vol. 009, no. 230, Database accession no. (E - 343), & JP60084848 A 19850514 (HITACHI SEISAKUSHO KK) [A] 3 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19900711), vol. 014, no. 324, Database accession no. (E - 0951), & JP02109358 A 19900423 (HITACHI LTD) [A] 3,4 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19831129), vol. 007, no. 267, Database accession no. (E - 213), & JP58148434 A 19830903 (MITSUBISHI DENKI KK) [A] 4 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19890328), vol. 013, no. 126, Database accession no. (E - 734), & JP63293928 A 19881130 (HITACHI LTD) [A] 3 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19910627), vol. 015, no. 254, Database accession no. (E - 1083), & JP03082144 A 19910408 (HITACHI LTD) [A] 6 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19870716), vol. 011, no. 220, Database accession no. (E - 524), & JP62039032 A 19870220 (MATSUSHITA ELECTRIC WORKS LTD) [A] 6 * abstract *
		[Y] - T. WATARI ET AL.:, "PACKAGING TECHNOLOGY FOR THE NEC SX SUPERCOMPUTER", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY, NEW YORK US, (198512), vol. CHMT-8, no. 4, pages 462 - 467 [Y] 5,10,12,13 PAGE 464, PARAGRAPH: "LIQUID COOLING MODULE";; figures 5,10 * PAGE 463, PARAGRAPH: "MULTILAYER SUBSTRATE"
		[A] - K. LODGE ET AL.:, "PROTOTYPE PACKAGES IN ALUMINUM NITRIDE FOR HIGH PERFORMANCE ELECTRONIC SYSTEMS", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY, NEW YORK US, (199012), vol. 13, no. 4, pages 633 - 638 [A] 5,10,12,13 PAGE 636, PARAGRAPH VIII. "THICK FILM PACKAGE DEMONSTRATOR";; figure 5 *
		[Y] - J. CAVALIERE ET AL.:, "HIGH-PERFORMANCE SINGLE-CHIP MODULE", IBM TECHNICAL DISCLOSURE BULLETIN., NEW YORK US, (198106), vol. 24, no. 1A, pages 46 - 48 [Y] 5,10,12,13 * the whole document *

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