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EP0544076
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EP About this file: EP0544076
| EP0544076 - Reworkable module and method of fabricating the module [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 04.07.1997 Database last updated on 07.03.2026 | Most recent event Tooltip | 04.07.1997 | Application deemed to be withdrawn | published on 20.08.1997 [1997/34] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1993/22] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Grebe, Kurt Rudolph 24 Van Nydeck Avenue Beacon, New York 12508 / US | 02 /
McCreary, Jack Marlyn 106 Pleasant View Drive Apalachin, New York 13732 / US | 03 /
Suryanarayana, Darbha 4212 Fuller Hollow Road Vestal, New York 13850 / US | 04 /
Tong, Ho-Ming 2569 Barry Court Yorktown Heights, New York 10598 / US | [1993/22] | Representative(s) | Schäfer, Wolfgang IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht 70548 Stuttgart / DE | [N/P] |
| Former [1994/38] | Schäfer, Wolfgang, Dipl.-Ing. IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht D-70548 Stuttgart / DE | ||
| Former [1993/39] | Mönig, Anton, Dipl.-Ing. IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht D-70548 Stuttgart / DE | ||
| Former [1993/22] | Klocke, Peter, Dipl.-Ing. IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht Pascalstrasse 100 D-70569 Stuttgart / DE | Application number, filing date | 92116514.8 | 26.09.1992 | [1993/22] | Priority number, date | US19910782701 | 25.10.1991 Original published format: US 782701 | [1993/22] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0544076 | Date: | 02.06.1993 | Language: | EN | [1993/22] | Type: | A3 Search report | No.: | EP0544076 | Date: | 23.03.1994 | Language: | EN | [1994/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.02.1994 | Classification | IPC: | H01L21/58, H01L21/60, H05K3/30 | [1993/22] | CPC: |
H10W74/012 (EP,US);
H05K3/284 (EP,US);
H10W74/121 (EP,US);
H10W74/15 (EP,US);
H10W72/01215 (EP,US);
H10W72/072 (EP,US);
H10W72/07236 (EP,US);
H10W72/856 (EP,US);
Y10T29/49144 (EP,US);
Y10T29/49146 (EP,US)
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| Designated contracting states | DE, FR, GB, IT [1993/22] | Title | German: | Umarbeitungsfähiger Modul und Verfahren zu seiner Herstellung | [1993/22] | English: | Reworkable module and method of fabricating the module | [1993/22] | French: | Module refaçonnable et procédé pour sa fabrication | [1993/22] | Examination procedure | 19.08.1993 | Examination requested [1993/42] | 04.08.1995 | Despatch of a communication from the examining division (Time limit: M04) | 10.10.1995 | Reply to a communication from the examining division | 14.10.1996 | Despatch of a communication from the examining division (Time limit: M04) | 25.02.1997 | Application deemed to be withdrawn, date of legal effect [1997/34] | 26.03.1997 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1997/34] | Fees paid | Renewal fee | 27.09.1994 | Renewal fee patent year 03 | 07.09.1995 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 30.09.1996 | 05 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A] "Semiconductor die encapsulant with intrinsic release layer", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 34, no. 2, July 1991 (1991-07-01), NEW YORK US, pages 181 - 182, XP000211073 [A] 1,4,6,10 * the whole document * | [A] "Conformal coating materials", ELECTRONIC PACKAGING AND PRODUCTION, vol. 30, no. 4, April 1990 (1990-04-01), MASSACHUSETTS US, pages 39 - 40, XP000117358 [A] 2,4 * the whole document * |