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Extract from the Register of European Patents

EP About this file: EP0541111

EP0541111 - Method of forming solder mask [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  23.01.1998
Database last updated on 03.10.2024
Most recent event   Tooltip17.02.2006Change - lapse in a contracting state
Updated state(s): FR
published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
Nippon Paint Co., Ltd.
1-2, Oyodo-kita 2-chome, Kita-ku Osaka-shi
Osaka-fu / JP
[N/P]
Former [1993/19]For all designated states
Nippon Paint Co., Ltd.
1-2, Oyodo-kita 2-chome, Kita-ku
Osaka-shi Osaka-fu / JP
Inventor(s)01 / Yamagami, Yoshikazu
51-3, Kunimatsu-cho
Neyagawa-shi, Osaka-fu / JP
02 / Kashihara, Akio
3-24-12, Yamanoue
Hirakata-shi, Osaka-fu / JP
03 / Seio, Mamoru
1-7-3-405, Tsukahara
Takatsuki-shi, Osaka-fu / JP
04 / Tanabe, Hisaki
7-9, Musashishiba, Yawata
Yawata-shi, Kyoto-fu / JP
[1993/19]
Representative(s)Hansen, Bernd, et al
Hoffmann Eitle Patent- und Rechtsanwälte Postfach 81 04 20
81904 München / DE
[N/P]
Former [1993/19]Hansen, Bernd, Dr. Dipl.-Chem., et al
Hoffmann, Eitle & Partner Patent- und Rechtsanwälte, Postfach 81 04 20
D-81904 München / DE
Application number, filing date92119038.506.11.1992
[1993/19]
Priority number, dateJP1991028983906.11.1991         Original published format: JP 28983991
JP1992010095621.04.1992         Original published format: JP 10095692
[1993/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0541111
Date:12.05.1993
Language:EN
[1993/19]
Type: B1 Patent specification 
No.:EP0541111
Date:19.03.1997
Language:EN
[1997/12]
Search report(s)(Supplementary) European search report - dispatched on:EP05.03.1993
ClassificationIPC:H05K3/34, G03F7/038, G03F7/027
[1993/19]
CPC:
G03F7/038 (EP); G03F7/00 (KR); G03F7/164 (EP);
H05K3/28 (EP); H05K2203/1105 (EP); H05K2203/1355 (EP);
H05K3/0079 (EP) (-)
Designated contracting statesDE,   FR,   GB,   NL [1993/19]
TitleGerman:Verfahren zur Herstellung einer Lötstopmaske[1993/19]
English:Method of forming solder mask[1993/19]
French:Procédé de préparation d'un masque pour soudage[1993/19]
MiscellaneousEPB 1997/12: (deleted)
EPB 1997/12: (deleted)
EPB 1997/12: (deleted)
EPB 1996/17: Teilanmeldung 96100048.6 eingereicht am 03/01/96
EPB 1996/17: Divisional application 96100048.6 filed on 03/01/96
EPB 1996/17: Demande divisionnaire 96100048.6 déposée le 03/01/96
Examination procedure04.08.1993Examination requested  [1993/39]
15.07.1994Despatch of a communication from the examining division (Time limit: M06)
23.01.1995Reply to a communication from the examining division
18.07.1995Despatch of a communication from the examining division (Time limit: M04)
24.11.1995Reply to a communication from the examining division
14.06.1996Despatch of communication of intention to grant (Approval: Yes)
04.09.1996Communication of intention to grant the patent
02.12.1996Fee for grant paid
02.12.1996Fee for publishing/printing paid
Divisional application(s)EP96100048.6  / EP0711105
Opposition(s)20.12.1997No opposition filed within time limit [1998/11]
Fees paidRenewal fee
29.11.1994Renewal fee patent year 03
28.11.1995Renewal fee patent year 04
29.11.1996Renewal fee patent year 05
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Lapses during opposition  TooltipFR19.03.1997
NL19.03.1997
GB06.11.1997
[2006/14]
Former [2003/07]NL19.03.1997
FR14.08.1997
GB06.11.1997
Former [1998/41]FR14.08.1997
GB06.11.1997
Former [1998/03]FR14.08.1997
Documents cited:Search[A]US4894317  (MARUYAMA TSUTOMU [JP], et al);
 [A]EP0286594  (CIBA GEIGY AG [CH]);
 [A]WO9103770  (COATES BROTHERS PLC [GB])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.